Taejoo Hwang

Dr. Hwang is currently the Director for Advanced Package Planning in Samsung Electronics Corp. Before that he was a Principal engineer for HBM assembly and 3D TSV SiP, also with Samsung Electronics Corp.

Dr. Hwang completed his PhD in 3D TSV Wafer Bonding from Rensselaer Polytechnic Institute. He has a Masters in MEMS Technology and Bachelors in Robotics from Korea University