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Programs Catalog

Programs Catalog

SMART Room 402, COEX Wednesday, January 23
2:00pm to 5:00pm
AI Accelerates Silicon Growth
 
AI is one of the key factor accompanying the silicon growth with various applications- from daily life gadgets to industrial systems. It will definitely affect for semiconductor industry to expand its market and to develop new market. AI summit will provide the special chance to meet AI industry leaders from worldwide and to find the new opportunities for your future business.
 
  • Date: Jan 23(Wed), 2019
  • Time: 14:00-17:00
  • Room: #402, Conference Room (South), COEX
  • Language: English and Korean (Simultaneous interpretation will NOT be provided)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda 

 
 
14:00-14:10
Welcome
 
 
14:10-14:40
AI Driven Changes in the Semiconductor Industry
 
 
 
14:40-15:10
Always-on AI Processing at the Edge Device
 
 
 
15:10-15:40
Advancement of Semiconductor Technology and Computing
 
 
 
15:40-16:00
Break
 
 
16:00-16:30
Connected, Intelligent Devices: Where Cloud Meets Edge
 
 
 
16:30-17:00
Enabling the A.I. Era: From Materials to Systems
 
Sundeep Bajikar, Applied Materials
 
 

*The agenda will be subject to change without notice.
 

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Standards Room 305, COEX Wednesday, January 23
1:00pm to 3:00pm

 

  • Program: EHS Chapter Formation Group Meeting
  • Date: Jan 23(Wed), 2019
  • Time: 13:00-15:00
  • Room: #305, Conference Room (South), COEX
 

 

 


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Networking Grand Ballroom, 5F, Grand InterContinental Seoul Parnas Wednesday, January 23
5:30pm to 8:00pm
Join more than 400 international participants including leaders and executives from industry, academia, and government in this celebration of our industry and SEMICON Korea. Engage customers, peers, and important decision-makers at this exclusive networking event.
 
  • Date: Jan 23(Wed), 2019
  • Time: 17:30-20:00
  • Room: Grand Ballroom, 5F, InterContinental Seoul Parnas
 

 

 
 

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Eunsoo Shim
Senior Vice President / Head of AI & SW Research Center
Samsung Advanced Institute of Technology, Samsung Electronics
2nd Speaker will be announced soon!
3rd Speaker will be announced soon!
Keynotes Room 401, COEX Wednesday, January 23
10:10am to 12:00pm
 
  • Date: Jan 23(Wed), 2019
  • Time: 10:10-12:00
  • Room: #401, Conference Room (South), COEX
  • Registration: Free
  • Language: Korean and English (Simultaneous interpretation will be provided)

 

Agenda

10:10-10:40
On-Device Artificial Intelligence
 
Eunsoo Shim, Senior Vice President SAIT, Samsung Electronics
 
 
10:40-11:20
TBD
 
 
 
 
11:20-12:00
TBD
 
 

*The agenda will be subject to change without notice.

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Standards SEMI Korea Office Friday, January 25
2:00pm to 4:00pm
 
  • Program: Korea FPD Metrology TC Chapter Meeting
  • Date: Jan 25(Fri), 2019
  • Time: 14:00-16:00
  • Room: SEMI Korea Office

Agenda

1.0    Welcome / Call to Order

  • 1.1    Introductions
  • 1.2    Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)
  • 1.3    Agenda Review

2.0    Review and Approval of Previous Meeting Minutes

3.0    Liaison Report

  • 3.1    FPD Metrology Japan TC Chapter
  • 3.2    FPD Metrology Taiwan TC Chapter

4.0    Staff Report

​5.0    Ballot Review

None

6.0    Subcommittee & Task Force Reports

  • 5.1    Perceptual Viewing Angle TF
  • 5.2    Perceptual Image Quality TF
  • 5.3    Transparent Display TF

7.0    Old Business

8.0    New Business 

  • 7.1    Discussion for roadmap

9.0    Action Item Review

10.0    Next Meeting and Adjournment

 

 

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Standards Room 305, COEX Thursday, January 24
10:00am to 12:00pm

 

  • Program: Korea I&C TC Chapter Meeting
  • Date: Jan 24(Thu), 2019
  • Time: 10:00-12:00
  • Room: #305, Conference Room (South), COEX

Agenda

1.0    Welcome / Call to Order

  • 1.1    Introductions
  • 1.2    Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)
  • 1.3    Agenda Review

2.0    Review and Approval of Previous Meeting Minutes

3.0    Liaison Report

  • 3.1    I&C Japan TC Chapter
  • 3.2    I&C North America TC Chapter
  • 3.3    I&C Taiwan TC Chapter

4.0    Staff Report

5.0    Ballot Review

  • 5.1    4946D : Line Item Revisions to SEMI E87-1017, Specification for Carrier Management (Cms) and E87.1-1017 Specification for SECS-II Protocol for Carrier Management (CMS); Adding Carrier Ready to Unload Prediction Feature
  • 5.2    5832A : New Standard, Specification for Equipment Generic Counter Model, (EGCM)
  • 5.3    6301 : Line Item Revision to E142-0211, Specification for Substrate Mapping, Adding packaging raw materials traceability method

6.0    Subcommittee & Task Force Reports

  • 6.1    GEM300 TF
  • 6.2    DDA TF
  • 6.3    ABFI TF  

7.0    Old Business  

8.0    New Business

9.0    Action Item Review

10.0  Next Meeting and Adjournment


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Market Room 318, COEX Wednesday, January 23
1:00pm to 5:10pm
New application is rising- AI, Automotive in semiconductor industry and it is time to look it up for understanding its impact in semiconductor market. Also, China market is still interesting theme for our industry due to its potential and investment scale. You can explore these issues as well as semiconductor equipment and materials outlook in one place!
 
  • Date: Jan 23(Wed), 2019
  • Time: 13:00-17:10
  • Room: #318, Conference Room (South), COEX
  • Language: English (Simultaneous interpretation will NOT be provided)
  • Who Should Attend 
- Senior Professionals in Marketing
- Sales
- Procurement
- Business Development
- Consulting and Product Planning
- Finance

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

   
 13:00-13:40
AI Innovation to Significantly Increase the Value of Semiconductors with 5G
 
Masahiro Wakasugi, Bloomberg Intelligence
 
 
 13:40-14:20
Memory Market
 
Nicholas Gaudois, UBS
 
 
 14:20-15:00
Wafer Fab Materials Enabling the Connected World
 
Mark Thirsk, Linx Consulting
 
 
 15:00-15:20
Break
 
 
 15:20-16:00
Market Forecast: What Is the Semiconductor Outlook by Product and Markets
 
Jim Feldhan, Semico Research
 
 
 16:00-16:40
SEMI Market Outlook- Equipment & Materials for 2019
 
Clark Tseng, SEMI
 
 
16:40-17:10
China Tech Trend
 
Allen Chang, Macquarie
 
 
*The agenda will be subject to change without notice.
 
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SMART Room 300, COEX Friday, January 25
9:00am to 1:00pm
Opportunities and Challenges for MEMS & Sensor in Korea
 
For enabling IoT and AI, data acquisition from edge is essential and MEMS & Sensor industry is getting bigger and smarter accordingly. The featured speakers from world-leading MEMS & Sensor company will share their vision, technology roadmap and business model at MEMS & Sensor Summit and this will be the great chance to get inspired for Korea MEMS & Sensor community’s future direction.
 
  • Date: Jan 25(Fri), 2019
  • Time: 09:00-13:00
  • Room: #300, Conference Room (South), COEX
  • Language: English and Korean (Simultaneous interpretation will NOT be provided)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won
 

 

Agenda

 
 
09:00-09:05
Welcome
 
 
09:05-09:35
KEYNOTE: Disruptive Engineering
 
Bosch
 
 
09:35-10:00
Maximizing your impact with MEMS and Sensors
 
 
 
10:00-10:25
Identifying the Markets and Opportunities for MEMs and Sensors
 
Jim Feldhan, Semico Research
 
 
10:25-10:55
Break & Networking
 
 
10:55-11:20
VCSELS for 3D Sensing
 
 
 
11:20-11:45
Let Your Voice be Heard- Devices are Listening
 
James Jeong, Vesper
 
 
11:45-12:10
Smart Sensors & Smart Ear
 
Stanley Park, Infineon
 
 
12:10-12:35
Opportunities and Challenges for MEMS & Sensors in China
 
Mark Ding, Shanghai Industrial μTechnology Research Institute (SITRI)
   
12:35-13:00
Panel Discussion
 
 
*The agenda will be subject to change without notice.
 
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Technology Room 402, COEX Thursday, January 24
10:00am to 7:00pm
New Waves: Ready to Enjoy?
 
The new waves of industry 4.0 is coming and the role of metrology and inspection is getting more and more important to enable it. To enjoy these waves, we need to prepare the new technologies and sources accordingly in a timely manner. With excellent 10 presentations from technology experts, you can get better understanding on MI challenges and solutions we’re facing now and near future and build the strong network with industry leaders.
 
  • Date: Jan 24(Thu), 2019
  • Time: 10:00-19:00
  • Room: #402, Conference Room (South), COEX
  • Language: English, Korea (Simultaneous interpretation will NOT be provided)

 

Committee

  • Chuck Kim (AMETEK Korea)
  • Chang Woo Kim (KLA-Tencor Korea)
  • TK Kim (Semilab Korea)
  • Harris Kim (Rudolph Technologies Korea)
  • Munhong Ro (DB HiTek)
  • Changman Moon (NOVA Measuring Instruments Korea)
  • Byong Chon Park (KRISS)
  • Hyungwon Yoo (Hitachi High-Technologies Korea)
  • Byoung-Ho Lee (SK hynix)
  • Suk Woo Martin Lee (Applied Materials Korea)   
  • Sung Hun Lee (Thermo Fisher Scientific Electron Microscopy Korea)
  • Dongchul Ihm (Samsung Electronics)
  • Hyunjin Chang (Auros Technology)
  • Jason Jeong (Nextin)
  • Jaesung Choi (ASML Korea)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 200,000 won 240,000 won 120,000 won
Onsite 240,000 won 280,000 won 150,000 won

 

Agenda

 
 
10:00-10:10
Welcome
 
 
10:10-10:40
Keynote
 
Metrology and Inspection: Challenges, Opportunities and Requirements for Advanced Logic Technology
 
 
 
 
 
Session 1: Industry 4.0
 
 
10:40-11:10
A Systematic Approach to Integrate Metrology and Inspection
 
Poh-Boon Yong, KLA-Tencor
 
 
11:10-11:40
TBD
 
Chris Hyungho Kang, GLOBALFOUNDRIES
 
 
11:40-12:10
Tilt, Overlay and Hole Shape using Spectrum Analysis
 
Liu Zhuan, Nanometrics
 
 
12:10-13:30
Lunch
 
 
13:30-14:00
Challenges in Enabling Multiple Feedback & Feedforward Loops for Advanced Patterning Control
 
Ofer Adan, Applied Materials
 
 
14:00-14:30
Implementation of Machine learning in metrology for advanced semiconductor manufacturing
 
Michael Shifrin, NOVA
 
 
14:30-14:50
Break
 
 
 
 
Session 2: New Sources
 
 
14:50-15:20
TBD
 
OhJang Kwon, SK hynix
 
 
15:20-15:50
X-ray Dimensional Metrology for the Semiconductor Industry
 
R. Joseph Kline, NIST
 
 
15:50-16:20
New OPC Modeling with HMI e-Beam System
 
Seung-Hyuk Lee, ASML
 
 
16:20-16:40
Break
 
 
16:40-17:10
TBD
 
Hyochang Lee, KRISS
 
 
17:10-17:40
CDSEM Metrology of Line-Edge Roughness (LER) and Wiggling occurring in EUV-Lithography or Mandrel Process
 
Hiroki Kawada, Hitachi High-Technologies
 
 
17:40-18:10
Enabling EUV Materials Defectivity Qualification with Un-patterned Wafer Inspection
 
Ming Feng Li, KLA-Tencor
 
 
18:10-19:00
Networking Reception
 
(Forum attendees are invited to networking reception.)
 
 
*The agenda will be subject to change without notice.

 

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Networking Room 402 Lobby, COEX Thursday, January 24
5:30pm to 7:00pm
MI Reception is a special event for MI industry to build the global networking through supply chain and to get together for business opportunities. More than 200 people including MI Forum attendees, speakers and MI Committee members are expected to attend.
 
  • Date: Jan 24(Thu), 2019
  • Time: 17:30-19:00
  • Room: #402 Lobby, COEX

 

 


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Opening Ceremony Room 401, COEX Wednesday, January 23
10:00am to 10:10am
 
  • Date: Jan 23(Wed), 2019
  • Time: 10:00-10:10
  • Room: #401, Conference Room (South), COEX

 

 

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STS Room 307, COEX Wednesday, January 23
1:00pm to 4:40pm
Beginning of EUV High Volume Manufacturing
 
Advanced lithography session of the STS 2019 is prepared under the theme of "Beginning of EUV High Volume Manufacturing". This session will provide the opportunities of sharing the information on the latest progresses of EUV lithography as well as other advanced technologies. Recently, there has been a lot of significant progresses made on various fronts of EUV lithography technologies and it is about to enter the high volume manufacturing stage. During the session, you can hear the very up-to-date knowledge and information on various segments, such as exposure tools, optics, materials, mask, and processes including etching aspects, of EUV and also some of optical lithography technology from the prominent figures of the academia and industry. The extendibility issues of EUV such as high NA EUV and industrial challenges where we have to further collaborate will be touched and discussed throughout the session.
 
  • Date: Jan 23(Wed), 2019
  • Time: 13:00-16:40
  • Room: #307, Conference Room (South), COEX
  • Language: English (Simultaneous interpretation will NOT be provided)​​

 

Committee

  • Shangwon Kim (DB HiTek)
  • Seong-Sue Kim (Samsung Electronics)
  • Jaehyun Kim (Dongjin Semichem)
  • Hong Seok Kim (Toppan Photomasks Korea)
  • Chang-Nam Ahn (ASML Korea)
  • Hye-Keun Oh (Hanyang University)
  • Changmoon Lim (SK hynix)
  • Jaesung Choi (ASML Korea)

 

Registration Fee 

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won
 

 

Agenda

   
 13:00-13:40
EUV Extendibility Research at Berkeley Lab  
 
 
 
 13:40-14:00
EUV Materials Solution
 
 
 
 14:00-14:20
EUV Resist Materials Development for Overcoming Stochastic Limitation
 
Sumin Kim, Samsung Electronics
 
 
 14:20-14:40
The Industrialized EUV Scanner for High-Volume Manufacturing
 
Diederik de Bruin, ASML
 
 
 14:40-15:00
Break
 
 
 15:00-15:20
EUV Materials Challenge for DRAM Application
 
Keundo Ban, SK hynix
 
 
 15:20-16:00
EUV and Evolution in Lithography on the Horizon of Logic Scaling Paradigm Change
 
 
 
 16:00-16:20
Lithography Source Requirements in DUV and its EUV Status Updates
 
Tommy Oga, Gigaphoton
 
 
 16:20-16:40
Atomic Layer Etch for Mitigation of EUV Resist Stochastic Defects
 
 
 

*The agenda will be subject to change without notice.

 

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STS Room 308, COEX Wednesday, January 23
1:00pm to 6:00pm
Advanced Materials & Technologies for Emerging Devices
 
In this session, the most up-to-date research and development outputs in the field of Advanced Materials and Process Technology, which are the key enablers of the future semiconductor devices, will be shared. Many prominent authors from the academia and industries will talk various research areas of functional materials and semiconductor devices not only in the view points of the fundamental but also of the mass production. Especially, topics regarding material innovation for semiconductor fabrication will be highlighted and technical challenges for mass production will be discussed. Excellent 8 presentations including 4 outstanding invited talks will be given to cover the major technical issues and the leading-edge solutions.
 
  • Date: Jan 23(Wed), 2019
  • Time: 13:00-18:00
  • Room: #308, Conference Room (South), COEX
  • Language: English (Simultaneous interpretation will NOT be provided)​​

 

Committee

  • Deok-Sin Kil (SK hynix)
  • Si-Bum Kim (MagnaChip Semiconductor)
  • Hyoung-Yoon Kim (DB HiTek)
  • Jae-Sung Roh (Jusung Engineering)
  • Ki-Seon Park (SK Materials)
  • Jin-Seong Park (Hanyang University)
  • Hyun-Chul Sohn (Yonsei University)
  • Gill Lee (Applied Materials)
  • Marco Lee (Lam Research Korea)
  • Won-Jun Lee (Sejong University)
  • In-Gon Lim (Digital Imaging Technology)
  • Han-Jin Lim (Samsung Electronics)
  • Ji-Hyun Choi (Tokyo Electron Korea)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 
 
13:00-13:40
New Precursors for Vapor Deposition Processes
 
 
 
13:40-14:00
CVD Precursors and Associated By-Products – Ensuring Maximum Chamber Productivity
 
 
 
14:00-14:30
CVD/ALD Developments for Safety, Performance & Affordability
 
Jean-Marc Girard, Air Liquide Advanced Materials (invited)
 
 
14:30-14:50 Break
 
 
14:50-15:30 Formation of Interface Dipole Layers between Two Dielectrics: Considerations on Physical Origins and Opportunities to Manipulate Its Strength
  Prof. Koji Kita, The University of Tokyo (invited)
 
 
15:30-15:50 Graphene and 2D Layered Materials; Device Application Prospect
 
Hyeon-Jin Shin, SAIT, Samsung Electronics 
 
 
15:50-16:30 Initial Characteristics of ALD Process
 
Prof. Jiyoung Kim, University of Texas at Dallas (invited)
 
 
16:30-16:50 Break
 
 
16:50-17:20 Ferroelectricity in Fluorite Structure Oxides for Future Memory Devices
  Prof. Min Hyuk Park, Pusan National University (invited)
   
17:20-17:40 Materials and Processes for Crosspoint Emerging Memory
  WanGee Kim, Applied Materials
   
17:40-18:00 Study of Interface Dipole in Effective Work Function Modulation
 
Hyungchul Kim, SK hynix
 
 
* The agenda will be subject to change without notice.
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STS Room 317, COEX Wednesday, January 23
1:00pm to 4:50pm
Challenges to Specialty Device Technology
 
Semiconductor scaling is becoming increasingly challenging, requiring more than mere conventional dimension scaling. Two different approaches can be taken at this moment. One approach is to find new specific applications, such as automotive and IoT, based on the current technology. Another approach is to use innovative device structures to overcome the limitations of the current structure. This session will discuss such challenges and the exciting future that lies ahead with distinguished 7 speakers from all of the world.
 
  • Date: Jan 23(Wed), 2019
  • Time: 13:00-16:50
  • Room: #317, Conference Room (South), COEX
  • Language: English (Simultaneous interpretation will NOT be provided​​)

 

Committee

  • Oh-Kyong Kwon (Hanyang University)
  • Dong-Won Kim (Samsung Electronics)
  • Tae Kyun Kim (SK hynix)
  • Rock-Hyun Baek (POSTECH)
  • Changhwan Shin (Sungkyunkwan University)
  • Sang Gi Lee (DB HiTek)
  • Hi-Deok Lee (Chungnam National University)
  • Byung Jin Cho (KAIST)
  • Woo Young Choi (Sogang University)
  • Sung Woo Hwang (Samsung Advanced Institute of Technology)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 
 
 13:00-13:40
Material and Device Innovation for IoT and Automotive Applications
 
 
 
 13:40-14:20
SiC Power Device Fabrication: Making the Transition from Si
 
 
 
 14:20-14:40
TBD
 
Samsung Electronics
 
 
 14:40-15:00
Break
 
 
 15:00-15:40
Challenges and Innovations in Interconnect Integration for Continuation of Device Scaling and Enabling Future Devices
 
 
 
 15:40-16:10
ReRAM-based Analog Synapse Devices for Neuromorphic System
 
 
 
 16:10-16:30
Current Status and Trends in MRAM
 
   
16:30-16:50 TBD
  David Haynes, Lam Research
 
 
*The agenda will be subject to change without notice.
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STS Room 307, COEX Thursday, January 24
1:00pm to 6:10pm
Plasma Etch Process Technologies for Next Generation Devices
 
The semiconductor business is exploded in this year and the need for semiconductor chips will be more increased in the future by the explosive increase of big data, AI chips and autonomous vehicles. But there exist many limitations at the fabrication of the next generation chips and especially the plasma etching technology will confront the severe limitation. The most critical problems at the plasma etching process have been always related with etch loading, selectivity and variation at the more shrinked patterns and the problem is that there is no plasma etchers to provide the sufficient capability at the next generation. To overcome those limitations we must developed efficient vacuum system, plasma and process simulation S/W as well as high performance plasma etcher including ALE, IBE(Ion beam etch) and ultra low temperature etch. Especially the ALE, IBE and ultra low temperature etch technologies emerged as the very promising ones for replacing the conventional etchers, and those provide unique etch characteristics for the next generation devices fabrication.
We invited the specialists on the above technical areas from worldwide and we will provide the good chances to get the insight on the next generation etch technologies at this symposium. We wish that the coming symposium will contribute to the expansion of the future technologies for overcoming the limitation on the next generation devices fabrication.
 
  • Date: Jan 24(Thu), 2019
  • Time: 13:00-18:10
  • Room: #307, Conference Room (South), COEX
  • Language: English (Simultaneous interpretation will NOT be provided.)

 

Committee

  • Jaesoung Kim (DB HiTek)
  • Gyoungjin Min (Lam Research Korea)
  • Jongchul Park (Samsung Electronics)
  • Jong Won Shon (ASM Genitech)
  • Geun Young Yeom (Sungkyunkwan University)
  • Minsuk Lee (SK hynix)
  • IC Jang (Lam Research Korea)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won
 

 

Agenda

 
 
13:00-13:40
Etch Process Technology for Emerging Semiconductor Applications
 
 
 
13:40-14:00
Finding Correlation between RCP and Profile in HARC Etching through Simulation
 
 
 
14:00-14:20
Emerging memories: Etching Challenges and Solutions
 
 
 
14:20-14:40
Enabling 3D and High-Aspect Ratio Etch Technologies Through on-Chamber Process Vacuum
 
 
 
14:40-15:00
Break
 
 
15:00-15:30
A Precise Measurement Method of Plasma Density in Plasma Process
 
 
 
15:30-16:00
Semiconductor Manufacturer's View and Entreaty to Future Dry Etching Technologies
 
 
 
16:00-16:20
Process Variation Studies and the Impact on Electrical Performance
 
 
 
16:20-16:40
Break
 
 
16:40-17:20
DRIE / Silicon Ultra Low Temperature Plasma Etching: …Its Applications, Limitations & Evolution
 
Mohamed Boufnichel, ST Microelectronics (invited)
 
 
17:20-17:40
Ion Beam Etching in Semiconductor Process
 
Keun Hee Bai, Samsung Electronics
 
 
17:40-18:10
Optimizing Tools for ALD and ALE
 
Mike Cooke, Oxford Instruments Plasma Technology
 
 
*The agenda will be subject to change without notice.
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STS Room 308, COEX Thursday, January 24
1:00pm to 4:40pm
CMP & Cleaning for Emerging Technology
 
As IDMs are developing and manufacturing single digit nm devices with 3 dimentions, they need new technologies to overcome its limits and obstacles. It is a challeng not only for IDM but also for suppliers who have to deliver new materials and equipments. These difficulties occurred in CFM and CMP technologies as well. However, we can find the solution for this through collaborations and discussions actively between IDM, supplier and academia. This session will provide excellent 8 presentations from experts to share the breaktrough technologies for CFM and CMP.
 
  • Date: Jan 24(Thu), 2019
  • Time: 13:00-16:40
  • Room: #308, Conference Room (South), COEX
  • Language: English (Simultaneous interpretation will NOT be provided)​​

 

Committee

  • Kyunghyun Kim (Samsung Electronics)
  • Sang Yong Kim (Korea Polytechnics)
  • Taesung Kim (Sungkyunkwan University)
  • Ho Youn Kim (DB HiTek)
  • Jin-Goo Park (Hanyang University)
  • Sang Woo Lim (Yonsei University)
  • Haedo Jeong (Pusan National University)
  • Hong, Chang-Ki (Versum Materials)
  • Kyungho Hwang (SK hynix)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 
Session 1: CMP Technology
 
 13:00-13:40
Challenges of CMP Technology for Advanced Memory Manufacturing
 
 
 
 13:40-14:00
GOI Evaluation for Surface Defect and Contamination in CMP Process
 
 
 
 14:00-14:20
Cleaner Induced Defect Challenges of BEOL Cu CMP in Advanced Logic Device
 
 
 
 14:20-14:40
3D Thin-film Thickness Profile Measurements of Multilayer Films
 
Young-Sik Ghim, Korea Research Institute of Standards and Science
 
 
 14:40-15:00
Break
 
 
 
Session 2: CFM Technology
 
 
 15:00-15:40
Wet Process Challenges for Advanced Logic Device Fabrication
 
 
 
 15:40-16:00
Influence of Surface Preparation on Gate Oxide Electrical Properties
 
 
 
 16:00-16:20
Improvement of Defect through Fume Control on SOD
 
 
 
 16:20-16:40
Rapid Airborne Molecular Contaminant (AMC) Quantitation and Speciation using SIFT-MS
 
 
 
* The agenda will be subject to change without notice.

 

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STS Room 317, COEX Thursday, January 24
1:00pm to 5:20pm
Packaging Growth through Technology Diversification
 
Thanks to the semiconductor’s evolution, electronics markets are significantly expanded from the mainframe computing era to the mobile computing era. Today it is facing the 4th industry generation requires intelligence network in addition to performance excellence. For supporting this, every semiconductors area’s involvement, Design-Chip-Packaging-Test, is needed. Especially packaging technology’s flexibility and confrontation-ability will play a particularly important role with packaging as an Advanced-FOWLP using 3D IC and 2.5D IC, MEMS/Sensor, SIP, vertical integration package, and mature package’s advancing. It is challengeable. But this session will be helpful for understanding the new advanced packaging technologies.
 
  • Date: Jan 24(Thu),2019
  • Time: 13:00-17:20
  • Room: #317, Conference Room (South), COEX
  • Language: English (Simultaneous interpretation will NOT be provided​​)

 

Committee

  • Gu Sung Kim (Kangnam University)
  • Young Bae Park (Andong National University)
  • Min Suk Suh (SK hynix)
  • WS Shin (ASE Korea)
  • Seh Kwang Lee (Ehwa Diamond)
  • Hanchoon Lee (DB HiTek)
  • Ji Young Chung (Amkor Technology Korea)
  • Soon Jin Cho (Samsung Electro-Mechanics)
  • Taeje Cho (Samsung Electro-Mechanics)
  • Hwail Jin (Samsung Electronics)
  • HR Han (ASE Korea)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 
 
 13:00-13:20
The Latest Advanced Packaging Technology Trends
 
 
 
 13:20-14:00
Evolution of Microstructure Signatures in Thermo-Mechanical Stressed Heterogeneously Integrated Components
 
 
 
 14:00-14:20
High-Speed Serdes Package Development for Artificial Intelligence (AI) Applications
 
 
 
 14:20-14:40
Break
 
 
 14:40-15:00
TBD
 
Rozalia Beica, DowDuPont
 
 
 15:00-15:20
Testing & diagnosis of fine-pitch wafers and advanced packages
 
 
 
 15:20-15:40
HBM Trends and Market Outlook
 
MyeongJae Park, SK hynix
 
 
 15:40-16:00
Break
 
 
 16:00-16:20
TBD
 
TBD, ASE
 
 
 16:20-16:40
Challenges and Opportunities in 5G mmWave Packaging
 
SeungWook Yoon, STATS ChipPAC
 
 
 16:40-17:00
Agile Manufacturing of Glass Carriers for Fan-Out Packaging
 
 
 
 17:00-17:20
Various Bonding Process for FO Technology in WLP and PLP
 
Eric NG Hoi Ping, ASM Pacific Technology
 
 
*The agenda will be subject to change without notice.
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SMART Room 300, COEX Thursday, January 24
1:00pm to 5:30pm
New Technologies to Collect, Analyze, Predict and Control
 
The rapidly maturing potential of data analytics and artificial intelligence brings big change, and big opportunities, for the entire semiconductor and electronic systems ecosystem.  But first it brings some challenges in figuring out where the key applications are, managing the complexities of digital simulations, and getting the cyber and the physical worlds to work together. We invite industry leaders to share what’s working and what’s needed next.
 
  • Date: Jan 24(Thu), 2019
  • Time: 13:00-17:30
  • Room: #300, Conference Room (South), COEX
  • Language: English and Korean (Simultaneous interpretation will NOT be provided)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 
 
13:00-13:05
Welcome
 
 
13:05-13:35
Digitalization in Manufacturing Industry
 
Yousoon Choi, Siemens
 
 
13:35-14:05
Digital Twin (tentative)
 
Schneider Electric
 
 
14:05-14:35
Smart Manufacturing and Machine Learning: Process Control in 3D
 
 
 
14:35-14:50
Break
 
 
14:50-15:20
Integration Deep Learning into Factory
 
TBD
 
 
15:20-15:50
Intelligent Digital Threading and Predictive analytics for Smart Manufacturing
 
TIBCO
 
 
15:50-16:20
AI Use Case in Semiconductor Manufacturin
 
Hyun-Jin Kim, BISTel
 
 
16:20-16:50
Creating Value with Industrial IOT
 
 
 
16:50-17:20
A Roadmap for the Future of Smart Manufacturing in Semiconductor point of view
 
Supika Mashiro, Tokyo Electron Limited)
 
 
17:20-17:30
Q&A
 
 

*The agenda will be subject to change without notice

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Technology Room 318, COEX Thursday, January 24
1:00pm to 4:20pm
The 5G and Big Data, key issues in next connected world are increasing demand for putting more pressure on test costs due to higher coverage requirements. Test must become smarter to address the increased quality demands, while at the same time remaining economical. To address these challenges, test industry is struggling with increasing instrumentation integration, smarter strategies, self-test, adaptive test, system-level test, as well as more sophisticated test hardware. In this Test Forum, you can get the clues to overcome these challenges from industry expertise.
 
  • Date: Jan 24(Thu), 2019
  • Time: 13:00-16:20
  • Room: #318, Conference Room (South), COEX
  • Language: English and Korean (Simultaneous interpretation will NOT be provided)​​

 

Committee

  • Young-Kwan Ko (UniTest)
  • James Jin-Soo Ko (Teradyne)
  • Kwonsung Ban (Samsung Electronics)
  • JeongBeom Bae (FormFactor Korea)
  • Sokyoung Song (SK hynix)
  • Kyu-hyuk Yeon (ASE Korea)
  • MinHo Chang (Amkor Technology Korea)
  • YH Jeon (TSE)
  • Jeongho Cho (Advantest Korea)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 
 
13:00-13:30
TBD
 
Gregory Smith, Teradyne
 
 
13:30-14:00
Automotive Semiconductor Testing
 
 
 
14:00-14:30
Testing Challenges and Design for Reliability
 
 
 
14:30-14:50
Break
 
 
14:50-15:20
RF Test Challenges Posed by the 5G Production Rollout
 
Kriss Hublitz, MaxLinear
 
 
15:20-15:50
Challenges of AI Testing
 
 
 
15:50-16:20
A New Singulated HBM Testing Solution - Breakthrough from Traditional ATE Test Method
 
 
 

*The agenda will be subject to change without notice.

 
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Networking Room 403, COEX Wednesday, January 23
12:30pm to 1:30pm
 
  • Date: Jan 23(Wed), 2019
  • Time: 12:30-13:30
  • Room: #403, Conference Room (South), COEX

 

 


Contact

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Workforce Development Room 308, COEX Thursday, January 24
9:00am to 12:00pm
This tutorial aims to provide a basic course for new engineers who is working at cleaning & CMP technology related area. With this practical lecture from device makers, material suppliers and academia, we expect you will learn the challenges and fundamental technologies in cleaning & CMP process.
 
  • Date: Jan 24 (Thu), 2019
  • Time: 09:00-12:00
  • Room: #308, Conference Room (South), COEX
  • Language: Korean (Simultaneous interpretation will NOT be provided)

 

Registration Fee

 
 
SEMI Member
Non-Member
Student
Early Bird (by Jan 16)
100,000 won
120,000 won
50,000 won
Onsite
120,000 won
150,000 won
80,000 won

 

Agenda

   
09:00-09:45
Role and Responsibility of CMP Process in Recent IC Technology
 
 
 
09:45-10:00
Q&A / Break
 
 
Q&A / Break
Contamination Control
 
SK Chae, Sungkyunkwan University
 
 
10:45-11:00
Q&A / Break
 
 
11:00-11:45
Electroplating Trend in Semiconductor
 
 
 
11:45-12:00
Q&A
 
 

*The agenda will be subject to change without notice.

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Workforce Development Room 308, COEX Wednesday, January 23
9:00am to 12:00pm
​In this tutorial, ferroelectric which is emerging technology will be covered. The tutorial will focus on the most up-to-date researches on ferroelectric devices and its materials.
 
  • Date: Jan 23 (Wed), 2019
  • Time: 09:00-12:00
  • Room: #308, Conference Room (South), COEX
  • Language: Korean (Simultaneous interpretation will NOT be provided​​)

 

Registration Fee

 
SEMI Member
Non-Member
Student
Early Bird (by Jan 16)
100,000 won
120,000 won
50,000 won
Onsite
120,000 won
150,000 won
80,000 won
 

 

Agenda 

 
 
09:00-10:15
Ferroelectric Materials
 
 
 
10:15-10:30
Q&A / Break
 
 
10:30-11:45
Hafnia Ferroelectric Devices
 
 
 
11:45-12:00
Q&A
 
 

*The agenda will be subject to change without notice.
 

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Workforce Development Room 403, COEX Friday, January 25
10:00am to 1:00pm
High Tech U(HTU) is career exploration program for middle school student who want to know more about careers in high tech industry.
HTU alumni will be gathered again at SEMICON Korea to see and experience semiconductor industry.
 
  • Date: Jan 25(Fri), 2019
  • Time: 10:00-13:00
  • Room: #403, Conference Room (South), COEX
  • Language: Korean (Simultaneous interpretation will NOT be provided)

 

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Workforce Development Room 307, COEX Wednesday, January 23
9:00am to 12:00pm
This tutorial is intended for who interested in lithography technologies and related area. In this tutorial, trends and issues as well as fundamentals of Lithography technologies will be provided from industry experts and academia.
 
  • Date: Jan 23 (Wed), 2019
  • Time: 09:00-12:00
  • Room: #307, Conference Room (South), COEX
  • Language: Korean (Simultaneous interpretation will NOT be provided​​)

 

Registration Fee

 
SEMI Member
Non-Member
Student
Early Bird (by Jan 16)
100,000 won
120,000 won
50,000 won
Onsite
120,000 won
150,000 won
80,000 won

 

Agenda

 
 
09:00-09:45
Patterning Technologies of Lithography
 
 
 
09:45-10:00
Q&A / Break
 
 
10:00-10:45
Lithography Technology Trends from Equipment Industry’s point of view
 
 
 
10:45-11:00
Q&A / Break
 
 
11:00-11:45
An Overview of Lithography
 
Prof. Hye-Keun Oh, Hanyang University
 
 
11:45-12:00
Q&A
 
 

*The agenda will be subject to change without notice.
 

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Workforce Development Room 402, COEX Friday, January 25
1:00pm to 5:00pm
Career opportunities in semiconductor manufacturing are vast due to the depth and breadth of the industry. Therefore, in SEMICON Korea 2019, Meet the Experts! - the Mentoring Seminar is prepared only for university students. You can meet the engineers from diverse backgrounds and hear what you really want to know by participating the seminar and 1-on-1 mentoring
 
  • Date: Jan 25(Fri), 2019
  • Time: 13:00-17:00
  • Room: #402, Conference Room (South), COEX
  • Language: Korean (Simultaneous interpretation will NOT be provided)
  • Registration Fee: Free
      
 
 

Agenda

13:00-13:10
Welcome
 
 
13:10-13:50
Keynote: Where Does the Computer Come From and Heading To?
 
 
 
13:50-14:20
Mentoring 1: Design
 
 
 
14:20-14:50
Mentoring 2: Field Service
 
 
 
14:50-15:00
Break
 
 
15:00-15:30
Mentoring 3: Software
 
 
 
15:30-16:00
Mentoring 4: Process Development
 
 
 
16:00-16:30
Mentoring 5: Material Development
 
Dongjin Semichem 이창수 상무보
 
 
16:30-17:00
Mentoring 6: Field Service
 
 
 
*The agenda will be subject to change without notice.
 
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Workforce Development Room 317 Thursday, January 24
9:00am to 12:00pm
This tutorial is designed as basic course for new engineers who is working at packaging technology related area. With the practical lecture from OSAT company and academia, we expect you will learn the challenges in packaging process and fundamental technologies as well.
 
  • Date: Jan 24 (Thu), 2019
  • Time: 09:00-12:00
  • Room: #317, Conference Room (South), COEX
  • Language: Korean (Simultaneous interpretation will NOT be provided)

 

Registration Fee

 
SEMI Member
Non-Member
Student
Early Bird (by Jan 16)
100,000 won
120,000 won
50,000 won
Onsite
120,000 won
150,000 won
80,000 won

 

Agenda

   
09:00-10:15
PKG Overview
 
JiYoung Chung, Amkor Technology
 
 
10:15-10:30
Q&A / Break
 
 
10:30-11:45
Materials & Equipment
 
Gu Sung Kim, Kangnam University
 
 
11:45-12:00
Q&A
 
 
*The agenda will be subject to change without notice.
 
View Full Agenda
Workforce Development Room 307, COEX Thursday, January 24
9:00am to 12:00pm
This tutorial is designed as basic course for new engineers who is working at etching technology related area. With the practical lecture from device makers, equipment suppliers and academia, you will learn the hottest issues and challenges in plasma & etching process and fundamental technologies as well.
 
  • Date: Jan 24 (Thu), 2019
  • Time: 09:00-12:00
  • Room: #307, Conference Room (South), COEX
  • Language: Korean (Simultaneous interpretation will NOT be provided)

 

Registration Fee

 
SEMI Member
Non-Member
Student
Early Bird (by Jan 16)
100,000 won
120,000 won
50,000 won
Onsite
120,000 won
150,000 won
80,000 won

 

Agenda

 
 
09:00-09:45
Plasma Etching Fundamentals for Memory Devices
 
 
 
09:45-10:00
Q&A / Break
 
 
10:00-10:45
Characteristics of ICP Source
 
 
 
10:45-11:00
Q&A / Break
 
 
11:00-11:45
Effect of Pulsed RF Plasma for Etch Application
 
 
 
11:45-12:00
Q&A
 
 

*The agenda will be subject to change without notice.
 

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