Programs Catalog
Programs Catalog
AI Accelerates Silicon Growth
AI is one of the key factor accompanying the silicon growth with various applications- from daily life gadgets to industrial systems. It will definitely affect for semiconductor industry to expand its market and to develop new market. AI summit will provide the special chance to meet AI industry leaders from worldwide and to find the new opportunities for your future business.
- Date: Jan 23(Wed), 2019
- Time: 14:00-17:00
- Room: #402, Conference Room (South), COEX
- Language: English and Korean (Simultaneous interpretation will NOT be provided)
Registration Fee
| SEMI Member | Non-Member | Student | |
| Early Bird (by Jan 16) | 150,000 won | 180,000 won | 80,000 won |
| Onsite | 180,000 won | 200,000 won | 100,000 won |
Agenda
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14:00-14:10
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Welcome
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14:10-14:40
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AI Driven Changes in the Semiconductor Industry
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14:40-15:10
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Always-on AI Processing at the Edge Device
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15:10-15:40
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Advancement of Semiconductor Technology and Computing
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15:40-16:00
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Break
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16:00-16:30
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Connected, Intelligent Devices: Where Cloud Meets Edge
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16:30-17:00
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Enabling the A.I. Era: From Materials to Systems
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Sundeep Bajikar, Applied Materials
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*The agenda will be subject to change without notice.
- Program: EHS Chapter Formation Group Meeting
- Date: Jan 23(Wed), 2019
- Time: 13:00-15:00
- Room: #305, Conference Room (South), COEX
Contact
- Standards
- Tel: +82-2-531-7808
- Mail: eshim@semi.org
Join more than 400 international participants including leaders and executives from industry, academia, and government in this celebration of our industry and SEMICON Korea. Engage customers, peers, and important decision-makers at this exclusive networking event.
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Date: Jan 23(Wed), 2019
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Time: 17:30-20:00
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Room: Grand Ballroom, 5F, InterContinental Seoul Parnas
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Contact
- Exposition team
- Tel: +82-2-531-7800
- Fax: +82-2-551-3406
- Mail: semiconkorea@semi.org
Eunsoo Shim
Senior Vice President / Head of AI & SW Research Center
Samsung Advanced Institute of Technology, Samsung Electronics
2nd Speaker will be announced soon!
3rd Speaker will be announced soon!
- Date: Jan 23(Wed), 2019
- Time: 10:10-12:00
- Room: #401, Conference Room (South), COEX
- Registration: Free
- Language: Korean and English (Simultaneous interpretation will be provided)
Agenda
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10:10-10:40
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On-Device Artificial Intelligence
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Eunsoo Shim, Senior Vice President SAIT, Samsung Electronics
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10:40-11:20
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TBD
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11:20-12:00
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TBD
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*The agenda will be subject to change without notice.
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Program: Korea FPD Metrology TC Chapter Meeting
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Date: Jan 25(Fri), 2019
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Time: 14:00-16:00
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Room: SEMI Korea Office
Agenda
1.0 Welcome / Call to Order
- 1.1 Introductions
- 1.2 Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)
- 1.3 Agenda Review
2.0 Review and Approval of Previous Meeting Minutes
3.0 Liaison Report
- 3.1 FPD Metrology Japan TC Chapter
- 3.2 FPD Metrology Taiwan TC Chapter
4.0 Staff Report
5.0 Ballot Review
None
6.0 Subcommittee & Task Force Reports
- 5.1 Perceptual Viewing Angle TF
- 5.2 Perceptual Image Quality TF
- 5.3 Transparent Display TF
7.0 Old Business
8.0 New Business
- 7.1 Discussion for roadmap
9.0 Action Item Review
10.0 Next Meeting and Adjournment
- Program: Korea I&C TC Chapter Meeting
- Date: Jan 24(Thu), 2019
- Time: 10:00-12:00
- Room: #305, Conference Room (South), COEX
Agenda
1.0 Welcome / Call to Order
- 1.1 Introductions
- 1.2 Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)
- 1.3 Agenda Review
2.0 Review and Approval of Previous Meeting Minutes
3.0 Liaison Report
- 3.1 I&C Japan TC Chapter
- 3.2 I&C North America TC Chapter
- 3.3 I&C Taiwan TC Chapter
4.0 Staff Report
5.0 Ballot Review
- 5.1 4946D : Line Item Revisions to SEMI E87-1017, Specification for Carrier Management (Cms) and E87.1-1017 Specification for SECS-II Protocol for Carrier Management (CMS); Adding Carrier Ready to Unload Prediction Feature
- 5.2 5832A : New Standard, Specification for Equipment Generic Counter Model, (EGCM)
- 5.3 6301 : Line Item Revision to E142-0211, Specification for Substrate Mapping, Adding packaging raw materials traceability method
6.0 Subcommittee & Task Force Reports
- 6.1 GEM300 TF
- 6.2 DDA TF
- 6.3 ABFI TF
7.0 Old Business
8.0 New Business
9.0 Action Item Review
10.0 Next Meeting and Adjournment
Contact
- Standards
- Tel: +82-2-531-7808
- Mail: eshim@semi.org
New application is rising- AI, Automotive in semiconductor industry and it is time to look it up for understanding its impact in semiconductor market. Also, China market is still interesting theme for our industry due to its potential and investment scale. You can explore these issues as well as semiconductor equipment and materials outlook in one place!
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Date: Jan 23(Wed), 2019
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Time: 13:00-17:10
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Room: #318, Conference Room (South), COEX
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Language: English (Simultaneous interpretation will NOT be provided)
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Who Should Attend
- Senior Professionals in Marketing
- Sales
- Procurement
- Business Development
- Consulting and Product Planning
- Finance
Registration Fee
| SEMI Member | Non-Member | Student | |
| Early Bird (by Jan 16) | 150,000 won | 180,000 won | 80,000 won |
| Onsite | 180,000 won | 200,000 won | 100,000 won |
Agenda
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13:00-13:40
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AI Innovation to Significantly Increase the Value of Semiconductors with 5G |
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Masahiro Wakasugi, Bloomberg Intelligence
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13:40-14:20
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Memory Market
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Nicholas Gaudois, UBS
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14:20-15:00
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Wafer Fab Materials Enabling the Connected World
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Mark Thirsk, Linx Consulting
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15:00-15:20
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Break
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15:20-16:00
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Market Forecast: What Is the Semiconductor Outlook by Product and Markets
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Jim Feldhan, Semico Research
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16:00-16:40
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SEMI Market Outlook- Equipment & Materials for 2019
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Clark Tseng, SEMI
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16:40-17:10
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China Tech Trend |
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Allen Chang, Macquarie
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*The agenda will be subject to change without notice.
Opportunities and Challenges for MEMS & Sensor in Korea
For enabling IoT and AI, data acquisition from edge is essential and MEMS & Sensor industry is getting bigger and smarter accordingly. The featured speakers from world-leading MEMS & Sensor company will share their vision, technology roadmap and business model at MEMS & Sensor Summit and this will be the great chance to get inspired for Korea MEMS & Sensor community’s future direction.
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Date: Jan 25(Fri), 2019
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Time: 09:00-13:00
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Room: #300, Conference Room (South), COEX
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Language: English and Korean (Simultaneous interpretation will NOT be provided)
Registration Fee
| SEMI Member | Non-Member | Student | |
| Early Bird (by Jan 16) | 150,000 won | 180,000 won | 80,000 won |
| Onsite | 180,000 won | 200,000 won | 100,000 won |
Agenda
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09:00-09:05
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Welcome
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09:05-09:35
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KEYNOTE: Disruptive Engineering
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Bosch
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09:35-10:00
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Maximizing your impact with MEMS and Sensors
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10:00-10:25
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Identifying the Markets and Opportunities for MEMs and Sensors
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Jim Feldhan, Semico Research
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10:25-10:55
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Break & Networking
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10:55-11:20
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VCSELS for 3D Sensing
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11:20-11:45
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Let Your Voice be Heard- Devices are Listening
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James Jeong, Vesper
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11:45-12:10
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Smart Sensors & Smart Ear
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Stanley Park, Infineon
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12:10-12:35
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Opportunities and Challenges for MEMS & Sensors in China
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Mark Ding, Shanghai Industrial μTechnology Research Institute (SITRI)
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12:35-13:00
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Panel Discussion |
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*The agenda will be subject to change without notice.
New Waves: Ready to Enjoy?
The new waves of industry 4.0 is coming and the role of metrology and inspection is getting more and more important to enable it. To enjoy these waves, we need to prepare the new technologies and sources accordingly in a timely manner. With excellent 10 presentations from technology experts, you can get better understanding on MI challenges and solutions we’re facing now and near future and build the strong network with industry leaders.
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Date: Jan 24(Thu), 2019
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Time: 10:00-19:00
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Room: #402, Conference Room (South), COEX
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Language: English, Korea (Simultaneous interpretation will NOT be provided)
Committee
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Chuck Kim (AMETEK Korea)
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Chang Woo Kim (KLA-Tencor Korea)
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TK Kim (Semilab Korea)
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Harris Kim (Rudolph Technologies Korea)
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Munhong Ro (DB HiTek)
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Changman Moon (NOVA Measuring Instruments Korea)
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Byong Chon Park (KRISS)
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Hyungwon Yoo (Hitachi High-Technologies Korea)
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Byoung-Ho Lee (SK hynix)
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Suk Woo Martin Lee (Applied Materials Korea)
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Sung Hun Lee (Thermo Fisher Scientific Electron Microscopy Korea)
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Dongchul Ihm (Samsung Electronics)
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Hyunjin Chang (Auros Technology)
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Jason Jeong (Nextin)
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Jaesung Choi (ASML Korea)
Registration Fee
| SEMI Member | Non-Member | Student | |
| Early Bird (by Jan 16) | 200,000 won | 240,000 won | 120,000 won |
| Onsite | 240,000 won | 280,000 won | 150,000 won |
Agenda
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10:00-10:10
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Welcome
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10:10-10:40
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Keynote
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Metrology and Inspection: Challenges, Opportunities and Requirements for Advanced Logic Technology
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Session 1: Industry 4.0
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10:40-11:10
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A Systematic Approach to Integrate Metrology and Inspection
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Poh-Boon Yong, KLA-Tencor
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11:10-11:40
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TBD
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Chris Hyungho Kang, GLOBALFOUNDRIES
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11:40-12:10
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Tilt, Overlay and Hole Shape using Spectrum Analysis
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Liu Zhuan, Nanometrics
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12:10-13:30
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Lunch
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13:30-14:00
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Challenges in Enabling Multiple Feedback & Feedforward Loops for Advanced Patterning Control
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Ofer Adan, Applied Materials
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14:00-14:30
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Implementation of Machine learning in metrology for advanced semiconductor manufacturing
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Michael Shifrin, NOVA
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14:30-14:50
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Break
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Session 2: New Sources
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14:50-15:20
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TBD
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OhJang Kwon, SK hynix
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15:20-15:50
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X-ray Dimensional Metrology for the Semiconductor Industry
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R. Joseph Kline, NIST
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15:50-16:20
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New OPC Modeling with HMI e-Beam System
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Seung-Hyuk Lee, ASML
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16:20-16:40
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Break
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16:40-17:10
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TBD
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Hyochang Lee, KRISS
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17:10-17:40
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CDSEM Metrology of Line-Edge Roughness (LER) and Wiggling occurring in EUV-Lithography or Mandrel Process
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Hiroki Kawada, Hitachi High-Technologies
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17:40-18:10
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Enabling EUV Materials Defectivity Qualification with Un-patterned Wafer Inspection
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Ming Feng Li, KLA-Tencor
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18:10-19:00
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Networking Reception
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(Forum attendees are invited to networking reception.)
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*The agenda will be subject to change without notice.
| Sponsored by |  |
Supported By |  |
MI Reception is a special event for MI industry to build the global networking through supply chain and to get together for business opportunities. More than 200 people including MI Forum attendees, speakers and MI Committee members are expected to attend.
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Date: Jan 24(Thu), 2019
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Time: 17:30-19:00
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Room: #402 Lobby, COEX
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Contact
- Program Team
- Tel: +82-2-531-7806
- Mail: koreaprograms@semi.org
- Date: Jan 23(Wed), 2019
- Time: 10:00-10:10
- Room: #401, Conference Room (South), COEX
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Beginning of EUV High Volume Manufacturing
Advanced lithography session of the STS 2019 is prepared under the theme of "Beginning of EUV High Volume Manufacturing". This session will provide the opportunities of sharing the information on the latest progresses of EUV lithography as well as other advanced technologies. Recently, there has been a lot of significant progresses made on various fronts of EUV lithography technologies and it is about to enter the high volume manufacturing stage. During the session, you can hear the very up-to-date knowledge and information on various segments, such as exposure tools, optics, materials, mask, and processes including etching aspects, of EUV and also some of optical lithography technology from the prominent figures of the academia and industry. The extendibility issues of EUV such as high NA EUV and industrial challenges where we have to further collaborate will be touched and discussed throughout the session.
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Date: Jan 23(Wed), 2019
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Time: 13:00-16:40
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Room: #307, Conference Room (South), COEX
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Language: English (Simultaneous interpretation will NOT be provided)
Committee
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Shangwon Kim (DB HiTek)
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Seong-Sue Kim (Samsung Electronics)
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Jaehyun Kim (Dongjin Semichem)
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Hong Seok Kim (Toppan Photomasks Korea)
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Chang-Nam Ahn (ASML Korea)
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Hye-Keun Oh (Hanyang University)
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Changmoon Lim (SK hynix)
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Jaesung Choi (ASML Korea)
Registration Fee
| SEMI Member | Non-Member | Student | |
| Early Bird (by Jan 16) | 150,000 won | 180,000 won | 80,000 won |
| Onsite | 180,000 won | 200,000 won | 100,000 won |
Agenda
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13:00-13:40
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EUV Extendibility Research at Berkeley Lab
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13:40-14:00
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EUV Materials Solution
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14:00-14:20
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EUV Resist Materials Development for Overcoming Stochastic Limitation
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Sumin Kim, Samsung Electronics
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14:20-14:40
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The Industrialized EUV Scanner for High-Volume Manufacturing
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Diederik de Bruin, ASML
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14:40-15:00
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Break
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15:00-15:20
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EUV Materials Challenge for DRAM Application
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Keundo Ban, SK hynix
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15:20-16:00
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EUV and Evolution in Lithography on the Horizon of Logic Scaling Paradigm Change
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16:00-16:20
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Lithography Source Requirements in DUV and its EUV Status Updates
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Tommy Oga, Gigaphoton
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16:20-16:40
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Atomic Layer Etch for Mitigation of EUV Resist Stochastic Defects
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*The agenda will be subject to change without notice.
| Sponsored By |  |
Supported By |
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Advanced Materials & Technologies for Emerging Devices
In this session, the most up-to-date research and development outputs in the field of Advanced Materials and Process Technology, which are the key enablers of the future semiconductor devices, will be shared. Many prominent authors from the academia and industries will talk various research areas of functional materials and semiconductor devices not only in the view points of the fundamental but also of the mass production. Especially, topics regarding material innovation for semiconductor fabrication will be highlighted and technical challenges for mass production will be discussed. Excellent 8 presentations including 4 outstanding invited talks will be given to cover the major technical issues and the leading-edge solutions.
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Date: Jan 23(Wed), 2019
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Time: 13:00-18:00
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Room: #308, Conference Room (South), COEX
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Language: English (Simultaneous interpretation will NOT be provided)
Committee
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Deok-Sin Kil (SK hynix)
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Si-Bum Kim (MagnaChip Semiconductor)
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Hyoung-Yoon Kim (DB HiTek)
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Jae-Sung Roh (Jusung Engineering)
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Ki-Seon Park (SK Materials)
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Jin-Seong Park (Hanyang University)
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Hyun-Chul Sohn (Yonsei University)
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Gill Lee (Applied Materials)
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Marco Lee (Lam Research Korea)
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Won-Jun Lee (Sejong University)
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In-Gon Lim (Digital Imaging Technology)
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Han-Jin Lim (Samsung Electronics)
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Ji-Hyun Choi (Tokyo Electron Korea)
Registration Fee
| SEMI Member | Non-Member | Student | |
| Early Bird (by Jan 16) | 150,000 won | 180,000 won | 80,000 won |
| Onsite | 180,000 won | 200,000 won | 100,000 won |
Agenda
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13:00-13:40
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New Precursors for Vapor Deposition Processes
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13:40-14:00
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CVD Precursors and Associated By-Products – Ensuring Maximum Chamber Productivity
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14:00-14:30
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CVD/ALD Developments for Safety, Performance & Affordability |
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Jean-Marc Girard, Air Liquide Advanced Materials (invited) |
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| 14:30-14:50 | Break |
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| 14:50-15:30 | Formation of Interface Dipole Layers between Two Dielectrics: Considerations on Physical Origins and Opportunities to Manipulate Its Strength |
| Prof. Koji Kita, The University of Tokyo (invited) | |
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| 15:30-15:50 | Graphene and 2D Layered Materials; Device Application Prospect |
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Hyeon-Jin Shin, SAIT, Samsung Electronics |
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| 15:50-16:30 | Initial Characteristics of ALD Process |
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Prof. Jiyoung Kim, University of Texas at Dallas (invited) |
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| 16:30-16:50 | Break |
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| 16:50-17:20 | Ferroelectricity in Fluorite Structure Oxides for Future Memory Devices |
| Prof. Min Hyuk Park, Pusan National University (invited) | |
| 17:20-17:40 | Materials and Processes for Crosspoint Emerging Memory |
| WanGee Kim, Applied Materials | |
| 17:40-18:00 | Study of Interface Dipole in Effective Work Function Modulation |
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Hyungchul Kim, SK hynix |
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* The agenda will be subject to change without notice.
Challenges to Specialty Device Technology
Semiconductor scaling is becoming increasingly challenging, requiring more than mere conventional dimension scaling. Two different approaches can be taken at this moment. One approach is to find new specific applications, such as automotive and IoT, based on the current technology. Another approach is to use innovative device structures to overcome the limitations of the current structure. This session will discuss such challenges and the exciting future that lies ahead with distinguished 7 speakers from all of the world.
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Date: Jan 23(Wed), 2019
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Time: 13:00-16:50
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Room: #317, Conference Room (South), COEX
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Language: English (Simultaneous interpretation will NOT be provided)
Committee
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Oh-Kyong Kwon (Hanyang University)
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Dong-Won Kim (Samsung Electronics)
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Tae Kyun Kim (SK hynix)
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Rock-Hyun Baek (POSTECH)
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Changhwan Shin (Sungkyunkwan University)
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Sang Gi Lee (DB HiTek)
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Hi-Deok Lee (Chungnam National University)
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Byung Jin Cho (KAIST)
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Woo Young Choi (Sogang University)
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Sung Woo Hwang (Samsung Advanced Institute of Technology)
Registration Fee
| SEMI Member | Non-Member | Student | |
| Early Bird (by Jan 16) | 150,000 won | 180,000 won | 80,000 won |
| Onsite | 180,000 won | 200,000 won | 100,000 won |
Agenda
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13:00-13:40
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Material and Device Innovation for IoT and Automotive Applications
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13:40-14:20
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SiC Power Device Fabrication: Making the Transition from Si
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14:20-14:40
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TBD
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Samsung Electronics
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14:40-15:00
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Break
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15:00-15:40
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Challenges and Innovations in Interconnect Integration for Continuation of Device Scaling and Enabling Future Devices
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15:40-16:10
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ReRAM-based Analog Synapse Devices for Neuromorphic System
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16:10-16:30
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Current Status and Trends in MRAM
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| 16:30-16:50 | TBD |
| David Haynes, Lam Research | |
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*The agenda will be subject to change without notice.
Plasma Etch Process Technologies for Next Generation Devices
The semiconductor business is exploded in this year and the need for semiconductor chips will be more increased in the future by the explosive increase of big data, AI chips and autonomous vehicles. But there exist many limitations at the fabrication of the next generation chips and especially the plasma etching technology will confront the severe limitation. The most critical problems at the plasma etching process have been always related with etch loading, selectivity and variation at the more shrinked patterns and the problem is that there is no plasma etchers to provide the sufficient capability at the next generation. To overcome those limitations we must developed efficient vacuum system, plasma and process simulation S/W as well as high performance plasma etcher including ALE, IBE(Ion beam etch) and ultra low temperature etch. Especially the ALE, IBE and ultra low temperature etch technologies emerged as the very promising ones for replacing the conventional etchers, and those provide unique etch characteristics for the next generation devices fabrication.
We invited the specialists on the above technical areas from worldwide and we will provide the good chances to get the insight on the next generation etch technologies at this symposium. We wish that the coming symposium will contribute to the expansion of the future technologies for overcoming the limitation on the next generation devices fabrication.
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Date: Jan 24(Thu), 2019
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Time: 13:00-18:10
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Room: #307, Conference Room (South), COEX
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Language: English (Simultaneous interpretation will NOT be provided.)
Committee
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Jaesoung Kim (DB HiTek)
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Gyoungjin Min (Lam Research Korea)
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Jongchul Park (Samsung Electronics)
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Jong Won Shon (ASM Genitech)
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Geun Young Yeom (Sungkyunkwan University)
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Minsuk Lee (SK hynix)
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IC Jang (Lam Research Korea)
Registration Fee
| SEMI Member | Non-Member | Student | |
| Early Bird (by Jan 16) | 150,000 won | 180,000 won | 80,000 won |
| Onsite | 180,000 won | 200,000 won | 100,000 won |
Agenda
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13:00-13:40
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Etch Process Technology for Emerging Semiconductor Applications
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13:40-14:00
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Finding Correlation between RCP and Profile in HARC Etching through Simulation
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14:00-14:20
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Emerging memories: Etching Challenges and Solutions
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14:20-14:40
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Enabling 3D and High-Aspect Ratio Etch Technologies Through on-Chamber Process Vacuum
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14:40-15:00
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Break
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15:00-15:30
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A Precise Measurement Method of Plasma Density in Plasma Process
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15:30-16:00
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Semiconductor Manufacturer's View and Entreaty to Future Dry Etching Technologies
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16:00-16:20
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Process Variation Studies and the Impact on Electrical Performance
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16:20-16:40
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Break
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16:40-17:20
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DRIE / Silicon Ultra Low Temperature Plasma Etching: …Its Applications, Limitations & Evolution
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Mohamed Boufnichel, ST Microelectronics (invited)
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17:20-17:40
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Ion Beam Etching in Semiconductor Process
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Keun Hee Bai, Samsung Electronics
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17:40-18:10
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Optimizing Tools for ALD and ALE
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Mike Cooke, Oxford Instruments Plasma Technology
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*The agenda will be subject to change without notice.
CMP & Cleaning for Emerging Technology
As IDMs are developing and manufacturing single digit nm devices with 3 dimentions, they need new technologies to overcome its limits and obstacles. It is a challeng not only for IDM but also for suppliers who have to deliver new materials and equipments. These difficulties occurred in CFM and CMP technologies as well. However, we can find the solution for this through collaborations and discussions actively between IDM, supplier and academia. This session will provide excellent 8 presentations from experts to share the breaktrough technologies for CFM and CMP.
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Date: Jan 24(Thu), 2019
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Time: 13:00-16:40
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Room: #308, Conference Room (South), COEX
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Language: English (Simultaneous interpretation will NOT be provided)
Committee
-
Kyunghyun Kim (Samsung Electronics)
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Sang Yong Kim (Korea Polytechnics)
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Taesung Kim (Sungkyunkwan University)
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Ho Youn Kim (DB HiTek)
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Jin-Goo Park (Hanyang University)
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Sang Woo Lim (Yonsei University)
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Haedo Jeong (Pusan National University)
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Hong, Chang-Ki (Versum Materials)
-
Kyungho Hwang (SK hynix)
Registration Fee
| SEMI Member | Non-Member | Student | |
| Early Bird (by Jan 16) | 150,000 won | 180,000 won | 80,000 won |
| Onsite | 180,000 won | 200,000 won | 100,000 won |
Agenda
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Session 1: CMP Technology
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13:00-13:40
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Challenges of CMP Technology for Advanced Memory Manufacturing
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13:40-14:00
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GOI Evaluation for Surface Defect and Contamination in CMP Process
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14:00-14:20
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Cleaner Induced Defect Challenges of BEOL Cu CMP in Advanced Logic Device
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14:20-14:40
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3D Thin-film Thickness Profile Measurements of Multilayer Films
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Young-Sik Ghim, Korea Research Institute of Standards and Science
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14:40-15:00
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Break
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Session 2: CFM Technology
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15:00-15:40
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Wet Process Challenges for Advanced Logic Device Fabrication
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15:40-16:00
|
Influence of Surface Preparation on Gate Oxide Electrical Properties
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16:00-16:20
|
Improvement of Defect through Fume Control on SOD
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16:20-16:40
|
Rapid Airborne Molecular Contaminant (AMC) Quantitation and Speciation using SIFT-MS
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* The agenda will be subject to change without notice.
|
Sponsored By
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Supported By
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Packaging Growth through Technology Diversification
Thanks to the semiconductor’s evolution, electronics markets are significantly expanded from the mainframe computing era to the mobile computing era. Today it is facing the 4th industry generation requires intelligence network in addition to performance excellence. For supporting this, every semiconductors area’s involvement, Design-Chip-Packaging-Test, is needed. Especially packaging technology’s flexibility and confrontation-ability will play a particularly important role with packaging as an Advanced-FOWLP using 3D IC and 2.5D IC, MEMS/Sensor, SIP, vertical integration package, and mature package’s advancing. It is challengeable. But this session will be helpful for understanding the new advanced packaging technologies.
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Date: Jan 24(Thu),2019
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Time: 13:00-17:20
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Room: #317, Conference Room (South), COEX
-
Language: English (Simultaneous interpretation will NOT be provided)
Committee
-
Gu Sung Kim (Kangnam University)
-
Young Bae Park (Andong National University)
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Min Suk Suh (SK hynix)
-
WS Shin (ASE Korea)
-
Seh Kwang Lee (Ehwa Diamond)
-
Hanchoon Lee (DB HiTek)
-
Ji Young Chung (Amkor Technology Korea)
-
Soon Jin Cho (Samsung Electro-Mechanics)
-
Taeje Cho (Samsung Electro-Mechanics)
-
Hwail Jin (Samsung Electronics)
-
HR Han (ASE Korea)
Registration Fee
| SEMI Member | Non-Member | Student | |
| Early Bird (by Jan 16) | 150,000 won | 180,000 won | 80,000 won |
| Onsite | 180,000 won | 200,000 won | 100,000 won |
Agenda
|
|
|
|
13:00-13:20
|
The Latest Advanced Packaging Technology Trends
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13:20-14:00
|
Evolution of Microstructure Signatures in Thermo-Mechanical Stressed Heterogeneously Integrated Components
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14:00-14:20
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High-Speed Serdes Package Development for Artificial Intelligence (AI) Applications
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14:20-14:40
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Break
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14:40-15:00
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TBD
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Rozalia Beica, DowDuPont
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15:00-15:20
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Testing & diagnosis of fine-pitch wafers and advanced packages
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15:20-15:40
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HBM Trends and Market Outlook
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MyeongJae Park, SK hynix
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15:40-16:00
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Break
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16:00-16:20
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TBD
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TBD, ASE
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16:20-16:40
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Challenges and Opportunities in 5G mmWave Packaging
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SeungWook Yoon, STATS ChipPAC
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16:40-17:00
|
Agile Manufacturing of Glass Carriers for Fan-Out Packaging
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17:00-17:20
|
Various Bonding Process for FO Technology in WLP and PLP
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Eric NG Hoi Ping, ASM Pacific Technology
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|
*The agenda will be subject to change without notice.
New Technologies to Collect, Analyze, Predict and Control
The rapidly maturing potential of data analytics and artificial intelligence brings big change, and big opportunities, for the entire semiconductor and electronic systems ecosystem. But first it brings some challenges in figuring out where the key applications are, managing the complexities of digital simulations, and getting the cyber and the physical worlds to work together. We invite industry leaders to share what’s working and what’s needed next.
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Date: Jan 24(Thu), 2019
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Time: 13:00-17:30
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Room: #300, Conference Room (South), COEX
-
Language: English and Korean (Simultaneous interpretation will NOT be provided)
Registration Fee
| SEMI Member | Non-Member | Student | |
| Early Bird (by Jan 16) | 150,000 won | 180,000 won | 80,000 won |
| Onsite | 180,000 won | 200,000 won | 100,000 won |
Agenda
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|
13:00-13:05
|
Welcome
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13:05-13:35
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Digitalization in Manufacturing Industry
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Yousoon Choi, Siemens
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13:35-14:05
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Digital Twin (tentative)
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Schneider Electric
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14:05-14:35
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Smart Manufacturing and Machine Learning: Process Control in 3D
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14:35-14:50
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Break
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14:50-15:20
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Integration Deep Learning into Factory
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TBD
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15:20-15:50
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Intelligent Digital Threading and Predictive analytics for Smart Manufacturing
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TIBCO
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15:50-16:20
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AI Use Case in Semiconductor Manufacturin
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Hyun-Jin Kim, BISTel
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16:20-16:50
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Creating Value with Industrial IOT
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16:50-17:20
|
A Roadmap for the Future of Smart Manufacturing in Semiconductor point of view
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|
Supika Mashiro, Tokyo Electron Limited)
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17:20-17:30
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Q&A
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|
*The agenda will be subject to change without notice
The 5G and Big Data, key issues in next connected world are increasing demand for putting more pressure on test costs due to higher coverage requirements. Test must become smarter to address the increased quality demands, while at the same time remaining economical. To address these challenges, test industry is struggling with increasing instrumentation integration, smarter strategies, self-test, adaptive test, system-level test, as well as more sophisticated test hardware. In this Test Forum, you can get the clues to overcome these challenges from industry expertise.
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Date: Jan 24(Thu), 2019
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Time: 13:00-16:20
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Room: #318, Conference Room (South), COEX
-
Language: English and Korean (Simultaneous interpretation will NOT be provided)
Committee
-
Young-Kwan Ko (UniTest)
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James Jin-Soo Ko (Teradyne)
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Kwonsung Ban (Samsung Electronics)
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JeongBeom Bae (FormFactor Korea)
-
Sokyoung Song (SK hynix)
-
Kyu-hyuk Yeon (ASE Korea)
-
MinHo Chang (Amkor Technology Korea)
-
YH Jeon (TSE)
-
Jeongho Cho (Advantest Korea)
Registration Fee
| SEMI Member | Non-Member | Student | |
| Early Bird (by Jan 16) | 150,000 won | 180,000 won | 80,000 won |
| Onsite | 180,000 won | 200,000 won | 100,000 won |
Agenda
|
|
|
|
13:00-13:30
|
TBD
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|
|
Gregory Smith, Teradyne
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13:30-14:00
|
Automotive Semiconductor Testing
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14:00-14:30
|
Testing Challenges and Design for Reliability
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14:30-14:50
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Break
|
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14:50-15:20
|
RF Test Challenges Posed by the 5G Production Rollout
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|
Kriss Hublitz, MaxLinear
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15:20-15:50
|
Challenges of AI Testing
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15:50-16:20
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A New Singulated HBM Testing Solution - Breakthrough from Traditional ATE Test Method
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*The agenda will be subject to change without notice.
-
Date: Jan 23(Wed), 2019
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Time: 12:30-13:30
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Room: #403, Conference Room (South), COEX
 |
 |
Contact
- Exposition team
- Tel: +82-2-531-7800
- Fax: +82-2-551-3406
- Mail: semiconkorea@semi.org
This tutorial aims to provide a basic course for new engineers who is working at cleaning & CMP technology related area. With this practical lecture from device makers, material suppliers and academia, we expect you will learn the challenges and fundamental technologies in cleaning & CMP process.
-
Date: Jan 24 (Thu), 2019
-
Time: 09:00-12:00
-
Room: #308, Conference Room (South), COEX
-
Language: Korean (Simultaneous interpretation will NOT be provided)
Registration Fee
|
|
SEMI Member
|
Non-Member
|
Student
|
|
Early Bird (by Jan 16)
|
100,000 won
|
120,000 won
|
50,000 won
|
|
Onsite
|
120,000 won
|
150,000 won
|
80,000 won
|
Agenda
|
09:00-09:45
|
Role and Responsibility of CMP Process in Recent IC Technology
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09:45-10:00
|
Q&A / Break
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|
Q&A / Break
|
Contamination Control
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|
SK Chae, Sungkyunkwan University
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10:45-11:00
|
Q&A / Break
|
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|
11:00-11:45
|
Electroplating Trend in Semiconductor
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11:45-12:00
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Q&A
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|
*The agenda will be subject to change without notice.
In this tutorial, ferroelectric which is emerging technology will be covered. The tutorial will focus on the most up-to-date researches on ferroelectric devices and its materials.
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Date: Jan 23 (Wed), 2019
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Time: 09:00-12:00
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Room: #308, Conference Room (South), COEX
-
Language: Korean (Simultaneous interpretation will NOT be provided)
Registration Fee
|
|
SEMI Member
|
Non-Member
|
Student
|
|
Early Bird (by Jan 16)
|
100,000 won
|
120,000 won
|
50,000 won
|
|
Onsite
|
120,000 won
|
150,000 won
|
80,000 won
|
Agenda
|
|
|
|
09:00-10:15
|
Ferroelectric Materials
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10:15-10:30
|
Q&A / Break
|
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|
10:30-11:45
|
Hafnia Ferroelectric Devices
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|
11:45-12:00
|
Q&A
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|
*The agenda will be subject to change without notice.
High Tech U(HTU) is career exploration program for middle school student who want to know more about careers in high tech industry.
HTU alumni will be gathered again at SEMICON Korea to see and experience semiconductor industry.
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Date: Jan 25(Fri), 2019
-
Time: 10:00-13:00
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Room: #403, Conference Room (South), COEX
-
Language: Korean (Simultaneous interpretation will NOT be provided)
SPONSOR
| PLATINUM | ||||
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| GOLD | ||||
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| SILVER | ||||
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This tutorial is intended for who interested in lithography technologies and related area. In this tutorial, trends and issues as well as fundamentals of Lithography technologies will be provided from industry experts and academia.
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Date: Jan 23 (Wed), 2019
-
Time: 09:00-12:00
-
Room: #307, Conference Room (South), COEX
-
Language: Korean (Simultaneous interpretation will NOT be provided)
Registration Fee
|
|
SEMI Member
|
Non-Member
|
Student
|
|
Early Bird (by Jan 16)
|
100,000 won
|
120,000 won
|
50,000 won
|
|
Onsite
|
120,000 won
|
150,000 won
|
80,000 won
|
Agenda
|
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|
09:00-09:45
|
Patterning Technologies of Lithography
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09:45-10:00
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Q&A / Break
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10:00-10:45
|
Lithography Technology Trends from Equipment Industry’s point of view |
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10:45-11:00
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Q&A / Break
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|
11:00-11:45
|
An Overview of Lithography
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|
|
Prof. Hye-Keun Oh, Hanyang University
|
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11:45-12:00
|
Q&A
|
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*The agenda will be subject to change without notice.
Career opportunities in semiconductor manufacturing are vast due to the depth and breadth of the industry. Therefore, in SEMICON Korea 2019, Meet the Experts! - the Mentoring Seminar is prepared only for university students. You can meet the engineers from diverse backgrounds and hear what you really want to know by participating the seminar and 1-on-1 mentoring
-
Date: Jan 25(Fri), 2019
-
Time: 13:00-17:00
-
Room: #402, Conference Room (South), COEX
-
Language: Korean (Simultaneous interpretation will NOT be provided)
-
Registration Fee: Free
Agenda
|
13:00-13:10
|
Welcome
|
|
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|
13:10-13:50
|
Keynote: Where Does the Computer Come From and Heading To?
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13:50-14:20
|
Mentoring 1: Design
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14:20-14:50
|
Mentoring 2: Field Service
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14:50-15:00
|
Break
|
|
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|
15:00-15:30
|
Mentoring 3: Software
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15:30-16:00
|
Mentoring 4: Process Development
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16:00-16:30
|
Mentoring 5: Material Development
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|
Dongjin Semichem 이창수 상무보
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|
|
16:30-17:00
|
Mentoring 6: Field Service
|
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|
*The agenda will be subject to change without notice.
This tutorial is designed as basic course for new engineers who is working at packaging technology related area. With the practical lecture from OSAT company and academia, we expect you will learn the challenges in packaging process and fundamental technologies as well.
-
Date: Jan 24 (Thu), 2019
-
Time: 09:00-12:00
-
Room: #317, Conference Room (South), COEX
-
Language: Korean (Simultaneous interpretation will NOT be provided)
Registration Fee
|
|
SEMI Member
|
Non-Member
|
Student
|
|
Early Bird (by Jan 16)
|
100,000 won
|
120,000 won
|
50,000 won
|
|
Onsite
|
120,000 won
|
150,000 won
|
80,000 won
|
Agenda
|
09:00-10:15
|
PKG Overview
|
|
|
JiYoung Chung, Amkor Technology
|
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|
10:15-10:30
|
Q&A / Break
|
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|
10:30-11:45
|
Materials & Equipment
|
|
|
Gu Sung Kim, Kangnam University
|
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11:45-12:00
|
Q&A
|
|
|
*The agenda will be subject to change without notice.
This tutorial is designed as basic course for new engineers who is working at etching technology related area. With the practical lecture from device makers, equipment suppliers and academia, you will learn the hottest issues and challenges in plasma & etching process and fundamental technologies as well.
-
Date: Jan 24 (Thu), 2019
-
Time: 09:00-12:00
-
Room: #307, Conference Room (South), COEX
-
Language: Korean (Simultaneous interpretation will NOT be provided)
Registration Fee
|
|
SEMI Member
|
Non-Member
|
Student
|
|
Early Bird (by Jan 16)
|
100,000 won
|
120,000 won
|
50,000 won
|
|
Onsite
|
120,000 won
|
150,000 won
|
80,000 won
|
Agenda
|
|
|
|
09:00-09:45
|
Plasma Etching Fundamentals for Memory Devices
|
|
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09:45-10:00
|
Q&A / Break
|
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|
10:00-10:45
|
Characteristics of ICP Source
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10:45-11:00
|
Q&A / Break
|
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|
11:00-11:45
|
Effect of Pulsed RF Plasma for Etch Application
|
|
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11:45-12:00
|
Q&A
|
|
|
*The agenda will be subject to change without notice.
