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Metrology and Inspection Forum

Room 402, COEX Thursday, January 24
10:00am to 7:00pm

New Waves: Ready to Enjoy?
 
The new waves of industry 4.0 is coming and the role of metrology and inspection is getting more and more important to enable it. To enjoy these waves, we need to prepare the new technologies and sources accordingly in a timely manner. With excellent 10 presentations from technology experts, you can get better understanding on MI challenges and solutions we’re facing now and near future and build the strong network with industry leaders.
 
  • Date: Jan 24(Thu), 2019
  • Time: 10:00-19:00
  • Room: #402, Conference Room (South), COEX
  • Language: English, Korea (Simultaneous interpretation will NOT be provided)

 

Committee

  • Chuck Kim (AMETEK Korea)
  • Chang Woo Kim (KLA-Tencor Korea)
  • TK Kim (Semilab Korea)
  • Harris Kim (Rudolph Technologies Korea)
  • Munhong Ro (DB HiTek)
  • Changman Moon (NOVA Measuring Instruments Korea)
  • Byong Chon Park (KRISS)
  • Hyungwon Yoo (Hitachi High-Technologies Korea)
  • Byoung-Ho Lee (SK hynix)
  • Suk Woo Martin Lee (Applied Materials Korea)   
  • Sung Hun Lee (Thermo Fisher Scientific Electron Microscopy Korea)
  • Dongchul Ihm (Samsung Electronics)
  • Hyunjin Chang (Auros Technology)
  • Jason Jeong (Nextin)
  • Jaesung Choi (ASML Korea)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 200,000 won 240,000 won 120,000 won
Onsite 240,000 won 280,000 won 150,000 won

 

Agenda

 
 
10:00-10:10
Welcome
 
 
10:10-10:40
Keynote
 
Metrology and Inspection: Challenges, Opportunities and Requirements for Advanced Logic Technology
 
 
 
 
 
Session 1: Industry 4.0
 
 
10:40-11:10
TBD
 
Intel
 
 
11:10-11:40
A Systematic Approach to Integrate Metrology and Inspection
 
Poh-Boon Yong, KLA-Tencor
 
 
11:40-12:10
TBD
 
TBD
 
 
12:10-13:30
Lunch
 
 
13:30-14:00
Tilt, Overlay and Hole Shape using Spectrum Analysis
 
Liu Zhuan, Nanometrics
 
 
14:00-14:30
Challenges in Enabling Multiple Feedback & Feedforward Loops for Advanced Patterning Control
 
Ofer Adan, Applied Materials
 
 
 
 
Session 2: New Sources
 
 
14:30-15:00
TBD
 
SK hynix
 
 
15:00-15:30
X-ray Dimensional Metrology for the Semiconductor Industry
 
 
 
15:30-15:50
Break
 
 
15:50-16:20
New OPC Modeling with HMI e-Beam System
 
Seung-Hyuk Lee, ASML
 
 
16:20-16:50
CDSEM Metrology of Line-Edge Roughness (LER) and Wiggling occurring in EUV-Lithography or Mandrel Process
 
 
 
16:50-17:20
Enabling EUV Materials Defectivity Qualification with Un-patterned Wafer Inspection
 
 
 
17:30-19:00
Networking Reception
 
(Forum attendees are invited to networking reception.)
 
 
*The agenda will be subject to change without notice.
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