New Waves: Ready to Enjoy?
The new waves of industry 4.0 is coming and the role of metrology and inspection is getting more and more important to enable it. To enjoy these waves, we need to prepare the new technologies and sources accordingly in a timely manner. With excellent 10 presentations from technology experts, you can get better understanding on MI challenges and solutions we’re facing now and near future and build the strong network with industry leaders.
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Date: Jan 24(Thu), 2019
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Time: 10:00-19:00
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Room: #402, Conference Room (South), COEX
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Language: English, Korea (Simultaneous interpretation will NOT be provided)
Committee
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Chuck Kim (AMETEK Korea)
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Chang Woo Kim (KLA-Tencor Korea)
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TK Kim (Semilab Korea)
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Harris Kim (Rudolph Technologies Korea)
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Munhong Ro (DB HiTek)
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Changman Moon (NOVA Measuring Instruments Korea)
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Byong Chon Park (KRISS)
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Hyungwon Yoo (Hitachi High-Technologies Korea)
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Byoung-Ho Lee (SK hynix)
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Suk Woo Martin Lee (Applied Materials Korea)
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Sung Hun Lee (Thermo Fisher Scientific Electron Microscopy Korea)
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Dongchul Ihm (Samsung Electronics)
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Hyunjin Chang (Auros Technology)
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Jason Jeong (Nextin)
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Jaesung Choi (ASML Korea)
Registration Fee
| SEMI Member | Non-Member | Student | |
| Early Bird (by Jan 16) | 200,000 won | 240,000 won | 120,000 won |
| Onsite | 240,000 won | 280,000 won | 150,000 won |
Agenda
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10:00-10:10
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Welcome
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10:10-10:40
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Keynote
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Metrology and Inspection: Challenges, Opportunities and Requirements for Advanced Logic Technology
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Session 1: Industry 4.0
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10:40-11:10
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TBD
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Intel
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11:10-11:40
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A Systematic Approach to Integrate Metrology and Inspection
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Poh-Boon Yong, KLA-Tencor
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11:40-12:10
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TBD
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TBD
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12:10-13:30
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Lunch
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13:30-14:00
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Tilt, Overlay and Hole Shape using Spectrum Analysis
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Liu Zhuan, Nanometrics
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14:00-14:30
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Challenges in Enabling Multiple Feedback & Feedforward Loops for Advanced Patterning Control
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Ofer Adan, Applied Materials
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Session 2: New Sources
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14:30-15:00
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TBD
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SK hynix
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15:00-15:30
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X-ray Dimensional Metrology for the Semiconductor Industry
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15:30-15:50
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Break
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15:50-16:20
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New OPC Modeling with HMI e-Beam System
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Seung-Hyuk Lee, ASML
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16:20-16:50
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CDSEM Metrology of Line-Edge Roughness (LER) and Wiggling occurring in EUV-Lithography or Mandrel Process
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16:50-17:20
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Enabling EUV Materials Defectivity Qualification with Un-patterned Wafer Inspection
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17:30-19:00
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Networking Reception
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(Forum attendees are invited to networking reception.)
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*The agenda will be subject to change without notice.
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