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S1. Advanced Lithography

Room 307, COEX Wednesday, January 23
1:00pm to 5:00pm

Advanced Lithography session of the STS 2018 will offer the opportunities to review the latest trends in the mainstream lithography technologies under the theme of "EUV High Volume Manufacturing and Beyond".

Recently there are a lot of progresses achieved in EUV and as a result EUV is getting considered as a manufacturing means more seriously than before. For the sake of the solid migration to the manufacturing phase, the readiness of each component of EUV will be reviewed during this meeting including overview, exposure tools, optics, material, mask, and process by the prominent leading figures of the corresponding area. In addition, the next generation EUV technologies like high-NA EUV and EUV double pattering will be discussed to disclose the potential issues and to prepare collaboratively throughout the industry.

 

  • Date: Jan 23(Wed), 2019
  • Time: 13:00-17:00
  • Room: #307, Conference Room (South), COEX
  • Theme
  • Language: English (Simultaneous interpretation will NOT be provided)​​
  • Supported by 

 

Committee

  • Shangwon Kim (DB HiTek)
  • Seong-Sue Kim (Samsung Electronics)
  • Jaehyun Kim (Dongjin Semichem)
  • Hong Seok Kim (Toppan Photomasks Korea)
  • Chang-Nam Ahn (ASML Korea)
  • Hye-Keun Oh (Hanyang University)
  • Changmoon Lim (SK hynix)
  • Jaesung Choi (ASML Korea)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

    Agenda

     13:00-13:40
     
     
     13:40-14:20
     
     
     14:20-14:40
     
     
     14:40-15:00
     
     
     15:00-15:20
    Break
     
     
     15:20-16:00
     
     
     16:00-16:20
     
     
     16:20-16:40
     
     
     16:40-17:00
    Break
     
     
     17:00-17:20
     
     
     17:20-17:40
     
     
     17:40-18:00
     
    *The agenda will be subject to change without notice.
    * Presentation materials agreed by speaker will be distributed via e-mail after the events.
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