S5. Contamination-free Manufacturing and CMP Technology

Room 308, COEX Thursday, January 24
1:00pm to 5:00pm

Continuous shrinkage of device dimension to nm level requires new materials and novel device structure which demand a new paradigm in contamination control and planarization to improve the production yield and device reliability. CFM technology has become more critical in device manufacturing below 20 nm devices. Film loss-free and damage free cleaning technology face severe challenges for next-generation device fabrication. Also, CMP has grown to be one of the essential technologies for advanced node device fabrications such as FinFET, III/V materials and V-NAND. 7-nm logic technology is already under developing now, and CMP will play the leading role on patterning for sub-7 nm FEOL and MOL process steps. To overcome the new CMP challenges, the consumables should play a more critical role. The purpose of this session is to increase the level of understanding on current and future CFM/CMP technology. 


  • Date: Jan 24(Thu), 2019
  • Time: 13:00-17:00
  • Room: #308, Conference Room (South), COEX
  • Theme
  • Language
  • Supported by 



  • Kyunghyun Kim (Samsung Electronics)
  • Sang Yong Kim (Korea Polytechnics)
  • Ho Youn Kim (DB HiTek)
  • Jin-Goo Park (Hanyang University)
  • Haedo Jeong (Pusan National University)
  • Hong, Chang-Ki (Versum Materials)
  • Kyungho Hwang (SK hynix)


Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 24) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won
Co-organized by   Korea CMP UGM
  Korea Surface Cleaning UGM (KSCUGM)



     Session 1: CFM Technology
     14:40-15:00 Break
     Session 2: CMP Technology
    *The agenda will be subject to change without notice.
    * Presentation materials agreed by speaker will be distributed via e-mail after the events.
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