02-531-7800

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S5. Contamination-free Manufacturing and CMP Technology

Room 308, COEX Thursday, January 24
1:00pm to 4:40pm

CMP & Cleaning for Emerging Technology
 
As IDMs are developing and manufacturing single digit nm devices with 3 dimentions, they need new technologies to overcome its limits and obstacles. It is a challeng not only for IDM but also for suppliers who have to deliver new materials and equipments. These difficulties occurred in CFM and CMP technologies as well. However, we can find the solution for this through collaborations and discussions actively between IDM, supplier and academia. This session will provide excellent 8 presentations from experts to share the breaktrough technologies for CFM and CMP.
 
  • Date: Jan 24(Thu), 2019
  • Time: 13:00-16:40
  • Room: #308, Conference Room (South), COEX
  • Language: English (Simultaneous interpretation will NOT be provided)​​

 

Committee

  • Kyunghyun Kim (Samsung Electronics)
  • Sang Yong Kim (Korea Polytechnics)
  • Taesung Kim (Sungkyunkwan University)
  • Ho Youn Kim (DB HiTek)
  • Jin-Goo Park (Hanyang University)
  • Sang Woo Lim (Yonsei University)
  • Haedo Jeong (Pusan National University)
  • Hong, Chang-Ki (Versum Materials)
  • Kyungho Hwang (SK hynix)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 16) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

 
Session 1: CMP Technology
 
 13:00-13:40
 
 
 
 13:40-14:00
 
 
 
 14:00-14:20
Cleaner Induced Defect Challenges of BEOL Cu CMP in Advanced Logic Device
 
 
 
 14:20-14:40
 
 
 
 14:40-15:00
Break
 
 
 
Session 2: CFM Technology
 
 
 15:00-15:40
 
 
 
 15:40-16:00
Influence of Surface Preparation on Gate Oxide Electrical Properties
 
 
 
 16:00-16:20
 
 
 
 16:20-16:40
 
 
 
* The agenda will be subject to change without notice.

 

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