Professor, (EPRC) Electronic Packaging Research Center
Kangnam University, Yongin
Gu-Sung Kim, Ph.D., Th.M. is currently a faculty position at Kangnam University and a founder of EPRC and EP. He had 30 years experiments for R&D of Semiconductor Packaging. Prior to joining and establishing lecture/research position, Kim was a 3D IC/TSV/WLP project leader for Samsung Electronics Co., Ltd, IPT team, Memory Division during 17 years. He has more 130 Patents as an inventor in Korea and USA related 3D IC, TSV, and Interposer. He published 2 semiconductor packaging handbooks and taught more 3000 engineers in Korea. He received several awards from Korea MOTIE government, Samsung, Alfred Marquis Lifetime, City May, and SEMI etc.
Kim received a Ph.D. degree in materials science and engineering from Rensselaer Polytechnic Institute, Troy, NY, USA. and a BS degree in ceramic engineering from Yonsei University, Seoul, Korea.
Currently, He has served chair of IEEE EPS Korea Council, SEMI STS ESIP, several National R&D program, vice-chair of KSDT, deputy-chair of EPRC, Kangnam University and Packaging Technology WG at KMEPS. He also has a position of BOD Chair of Electro-Package Mission Society.