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Programs Catalog

Programs Catalog

SMART Room 402, COEX Wednesday, January 23
2:00pm to 5:00pm
AI Accelerates Silicon Growth
 

AI is one of the key factor accompanying the silicon growth with various applications- from daily life gadgets to industrial systems. It will definitely affect for semiconductor industry to expand its market and to develop new market. AI summit will provide the special chance to meet AI industry leaders from worldwide and to find the new opportunities for your future business.

 
  • 날짜: 2019년 1월 23일(수)
  • 시간: 14:00-17:00
  • 장소: 코엑스 4층 402호
  • 언어: 영어, 한국어 (동시통역은 제공되지 않습니다.)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 
 
14:00-14:10
Welcome
 
 
14:10-14:40
AI Driven Changes in the Semiconductor Industry
 
 
 
14:40-15:10
Always-on AI Processing at the Edge Device
 
 
 
15:10-15:40
Advancement of Semiconductor Technology and Computing
 
 
 
15:40-16:00
Break
 
 
16:00-16:30
Connected, Intelligent Devices: Where Cloud Meets Edge
 
 
 
16:30-17:00
Enabling the A.I. Era: From Materials to Systems
 
Sundeep Bajikar, Applied Materials
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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Standards Room 305, COEX Wednesday, January 23
1:00pm to 3:00pm

 

  • 행사명: EHS Chapter Formation Group Meeting
  • 날짜: 2019년 1월 23일(수)
  • 시간: 13:00-15:00
  • 장소: 코엑스 3층 305호

 

아젠다 (아젠다는 곧 업데이트 됩니다.)


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Standards SEMI Korea Office Friday, January 25
2:00pm to 4:00pm
 
  • 행사명: Korea FPD Metrology TC Chapter Meeting
  • 날짜: 2019년 1월 25일(금)
  • 시간: 14:00-16:00
  • 장소: SEMI Korea Office

 

아젠다 (아젠다는 곧 업데이트 됩니다.)

 


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Standards Room 305, COEX Thursday, January 24
10:00am to 12:00pm

 

  • 행사명: Korea I&C TC Chapter Meeting
  • 날짜: 2018년 1월 24일 (목)
  • 시간: 10:00-12:00
  • 장소: 코엑스 3층 305호

 

아젠다 (아젠다는 곧 업데이트 됩니다.)

 


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SMART Room 300, COEX Friday, January 25
9:00am to 1:00pm
Opportunities and Challenges for MEMS & Sensor in Korea
 
For enabling IoT and AI, data acquisition from edge is essential and MEMS & Sensor industry is getting bigger and smarter accordingly. The featured speakers from world-leading MEMS & Sensor company will share their vision, technology roadmap and business model at MEMS & Sensor Summit and this will be the great chance to get inspired for Korea MEMS & Sensor community’s future direction.
 
  • 날짜: 2019년 1월 25일(금)
  • 시간: 09:00-13:00
  • 장소: 코엑스 3층 300호
  • 언어: 영어, 한국어 (동시통역은 제공되지 않습니다.)

 

등록비

 
SEMI 회원사
비회원사
학생
사전등록(1/16까지)
150,000 원
180,000 원
80,000 원
현장등록
180,000 원
200,000 원
100,000 원
 

 

아젠다

 
 
09:00-09:05
Welcome
 
 
09:05-09:35
KEYNOTE: Disruptive Engineering
 
Bosch
 
 
09:35-10:00
Maximizing your impact with MEMS and Sensors
 
 
 
10:00-10:25
Market & Technology Trend in MEMS & Sensor
 
Jim Feldhan, Semico Research
 
 
10:25-10:55
Break & Networking
 
 
10:55-11:20
VCSELS for 3D Sensing
 
 
 
11:20-11:45
Let Your Voice be Heard- Devices are Listening
 
James Jeong, Vesper
 
 
11:45-12:10
Smart Sensors & Smart Ear
 
Stanley Park, Infineon
 
 
12:10-12:35
MEMS & Sensor Industry in China
 
Mark Ding, Shanghai Industrial μTechnology Research Institute (SITRI)
   
12:35-13:00
Panel Discussion
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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Technology Room 402, COEX Thursday, January 24
10:00am to 7:00pm
New Waves: Ready to Enjoy?
 
The new waves of industry 4.0 is coming and the role of metrology and inspection is getting more and more important to enable it. To enjoy these waves, we need to prepare the new technologies and sources accordingly in a timely manner. With excellent 10 presentations from technology experts, you can get better understanding on MI challenges and solutions we’re facing now and near future and build the strong network with industry leaders.
 
  • 날짜: 2019년 1월 24일(목)
  • 시간: 10:00-19:00
  • 장소: 코엑스 4층 402호
  • 언어: 영어, 한국어 (동시통역은 지원되지 않습니다.)
 

Committee

  • Chuck Kim (AMETEK Korea)
  • Chang Woo Kim (KLA-Tencor Korea)
  • TK Kim (Semilab Korea)
  • Harris Kim (Rudolph Technologies Korea)
  • Munhong Ro (DB HiTek)
  • Changman Moon (NOVA Measuring Instruments Korea)
  • Byong Chon Park (KRISS)
  • Hyungwon Yoo (Hitachi High-Technologies Korea)
  • Byoung-Ho Lee (SK hynix)
  • Suk Woo Martin Lee (Applied Materials Korea)   
  • Sung Hun Lee (Thermo Fisher Scientific Electron Microscopy Korea)
  • Dongchul Ihm (Samsung Electronics)
  • Hyunjin Chang (Auros Technology)
  • Jason Jeong (Nextin)
  • Jaesung Choi (ASML Korea)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 200,000 원 240,000 원 120,000 원
현장등록 240,000 원 280,000 원 150,000 원

 

아젠다

 
 
10:00-10:10
Welcome
 
 
10:10-10:40
Keynote
 
Metrology and Inspection: Challenges, Opportunities and Requirements for Advanced Logic Technology
 
 
 
 
 
Session 1: Industry 4.0
 
 
10:40-11:10
TBD
 
Intel
 
 
11:10-11:40
A Systematic Approach to Integrate Metrology and Inspection
 
Poh-Boon Yong, KLA-Tencor
 
 
11:40-12:10 TBD
  TBD
   
12:10-13:30
Lunch
 
 
13:30-14:00
Tilt, Overlay and Hole Shape using Spectrum Analysis
 
Liu Zhuan, Nanometrics
 
 
14:00-14:30
Challenges in Enabling Multiple Feedback & Feedforward Loops for Advanced Patterning Control
 
Ofer Adan, Applied Materials
 
 
 
 
Session 2: New Sources
 
 
14:30-15:00
TBD
 
SK hynix
 
 
15:00-15:30
X-ray Dimensional Metrology for the Semiconductor Industry
 
 
 
15:30-15:50 Break
   
15:50-16:20
New OPC Modeling with HMI e-Beam System
 
Seung-Hyuk Lee, ASML
 
 
16:20-16:50
CDSEM Metrology of Line-Edge Roughness (LER) and Wiggling occurring in EUV-Lithography or Mandrel Process
 
 
 
16:50-17:20
Enabling EUV Materials Defectivity Qualification with Un-patterned Wafer Inspection
 
 
 
17:30-19:00
Networking Reception
 
(Forum attendees are invited to networking reception.)
 
 

*The agenda will be subject to change without notice.

 

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Networking Room 402, COEX Thursday, January 24
5:30pm to 7:00pm
MI 리셉션은 MI(Metrology & Inspection)분야에 관련된 국내외 기술 전문가들이 한자리에 모여 최신 기술을 교류할 뿐만 아니라 네트워킹의 기회도 얻을 수 있는 자리입니다.
 
  • 날짜: 2019년 1월 24(목)
  • 시간: 17:30 - 19:00
  • 장소: 코엑스 4층 402호 앞
  • 대상: MI 포럼 참석자 + 사전 초대자

 

 


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STS Room 307, COEX Wednesday, January 23
1:00pm to 4:40pm
Beginning of EUV High Volume Manufacturing
 
Advanced lithography session of the STS 2019 is prepared under the theme of "Beginning of EUV High Volume Manufacturing". This session will provide the opportunities of sharing the information on the latest progresses of EUV lithography as well as other advanced technologies. Recently, there has been a lot of significant progresses made on various fronts of EUV lithography technologies and it is about to enter the high volume manufacturing stage. During the session, you can hear the very up-to-date knowledge and information on various segments, such as exposure tools, optics, materials, mask, and processes including etching aspects, of EUV and also some of optical lithography technology from the prominent figures of the academia and industry. The extendibility issues of EUV such as high NA EUV and industrial challenges where we have to further collaborate will be touched and discussed throughout the session.
 
  • 날짜: 2019년 1월 23일 (수)
  • 시간: 13:00-16:40
  • 장소: 코엑스 3층 307호
  • 언어: 영어 (동시통역은 제공되지 않습니다.)
 

Committee

  • Shangwon Kim (DB HiTek)
  • Seong-Sue Kim (Samsung Electronics)
  • Jaehyun Kim (Dongjin Semichem)
  • Hong Seok Kim (Toppan Photomasks Korea)
  • Chang-Nam Ahn (ASML Korea)
  • Hye-Keun Oh (Hanyang University)
  • Changmoon Lim (SK hynix)
  • Jaesung Choi (ASML Korea)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 
 
 13:00-13:40
EUV Extendibility Research at Berkeley Lab
 
 
 
 13:40-14:00
EUV Materials Solution
 
 
 
 14:00-14:20
EUV Resist Materials Development for Overcoming Stochastic Limitation
 
Sumin Kim, Samsung Electronics
 
 
 14:20-14:40
The Industrialized EUV Scanner for High-Volume Manufacturing
 
 
 
 14:40-15:00
Break
 
 
 15:00-15:20
EUV Materials Challenge for DRAM Application
 
Keundo Ban, SK hynix
 
 
 15:20-16:00
EUV and Evolution in Lithography on the Horizon of Logic Scaling Paradigm Change
 
 
 
 16:00-16:20
Trailing-edge Technology Applications like Broader E95 Approach into the Cutting Edge DUV Light Source for Tool Matching on the ArFi Lithography
 
Tommy Oga, Gigaphoton
 
 
 16:20-16:40
Atomic Layer Etch for Mitigation of EUV Resist Stochastic Defects
 
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.

 

Sponsored by Supported By

 

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STS Room 308, COEX Wednesday, January 23
1:00pm to 6:00pm
Advanced Materials & Technologies for Emerging Devices
 
In this session, the most up-to-date research and development outputs in the field of Advanced Materials and Process Technology, which are the key enablers of the future semiconductor devices, will be shared. Many prominent authors from the academia and industries will talk various research areas of functional materials and semiconductor devices not only in the view points of the fundamental but also of the mass production. Especially, topics regarding material innovation for semiconductor fabrication will be highlighted and technical challenges for mass production will be discussed. Excellent 8 presentations including 4 outstanding invited talks will be given to cover the major technical issues and the leading-edge solutions.
 
  • 날짜: 2019년 1월 23일 (수)
  • 시간: 13:00-18:00
  • 장소: 코엑스 3층 308호
  • 언어: 영어 (동시통역은 제공되지 않습니다.)

 

Committee

  • Deok-Sin Kil (SK hynix)
  • Si-Bum Kim (MagnaChip Semiconductor)
  • Hyoung-Yoon Kim (DB HiTek)
  • Jae-Sung Roh (Jusung Engineering)
  • Ki-Seon Park (SK Materials)
  • Jin-Seong Park (Hanyang University)
  • Hyun-Chul Sohn (Yonsei University)
  • Gill Lee (Applied Materials)
  • Marco Lee (Lam Research Korea)
  • Won-Jun Lee (Sejong University)
  • In-Gon Lim (Digital Imaging Technology)
  • Han-Jin Lim (Samsung Electronics)
  • Ji-Hyun Choi (Tokyo Electron Korea)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

   
 13:00-13:40
New Precursors for Vapor Deposition Processes
 
   
 13:40-14:00
CVD Precursors and Associated By-Products – Ensuring Maximum Chamber Productivity
 
   
 14:00-14:30
CVD/ALD Developments for Safety, Performance & Affordability
 
Jean-Marc Girard, Air Liquide Advanced Materials (invited)
 
 
 14:30-14:50
Break
   
 14:50-15:30
Formation of Interface Dipole Layers between Two Dielectrics: Considerations on Physical Origins and Opportunities to Manipulate Its Strength
  Prof. Koji Kita, The University of Tokyo (invited)
 
 
15:30-15:50 Graphene and 2D Layered Materials; Device Application Prospect
 
Hyeon-Jin Shin, SAIT, Samsung Electronics
   
15:50-16:30 Initial Reaction of ALD Process
 
Prof. Jiyoung Kim, UT Dallas (invited)
   
16:30-16:50 Break
   
16:50-17:20 Ferroelectricity in Fluorite Structure Oxides for Future Memory Devices
  Prof. Min Hyuk Park, Pusan National University (invited)
   
17:20-17:40 Materials and Processes for Crosspoint Emerging Memory
  WanGee Kim, Applied Materials
   
17:40-18:00 Study of Interface Dipole in Effective Work Function Modulation
  Hyungchul Kim, SK hynix
   
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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STS Room 317, COEX Wednesday, January 23
1:00pm to 4:50pm
Challenges to Specialty Device Technology
 
Semiconductor scaling is becoming increasingly challenging, requiring more than mere conventional dimension scaling. Two different approaches can be taken at this moment. One approach is to find new specific applications, such as automotive and IoT, based on the current technology. Another approach is to use innovative device structures to overcome the limitations of the current structure. This session will discuss such challenges and the exciting future that lies ahead with distinguished 7 speakers from all of the world.
 
  • 날짜: 2019년 1월 23일 (수)
  • 시간: 13:00-16:50
  • 장소: 코엑스 3층 317호
  • 언어: 영어 (동시통역은 제공되지 않습니다.)

 

Committee

  • Oh-Kyong Kwon (Hanyang University)
  • Dong-Won Kim (Samsung Electronics)
  • Tae Kyun Kim (SK hynix)
  • Rock-Hyun Baek (POSTECH)
  • Changhwan Shin (Sungkyunkwan University)
  • Sang Gi Lee (DB HiTek)
  • Hi-Deok Lee (Chungnam National University)
  • Byung Jin Cho (KAIST)
  • Woo Young Choi (Sogang University)
  • Sung Woo Hwang (Samsung Advanced Institute of Technology)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 
 
 13:00-13:40
Material and Device Innovation for IoT and Automotive Applications
 
 
 
 13:40-14:20
SiC Power Device Fabrication: Making the Transition from Si
 
 
 
 14:20-14:40
TBD
 
Samsung Electronics
 
 
 14:40-15:00
Break
 
 
 15:00-15:40
Challenges and Innovations in Interconnect Integration for Continuation of Device Scaling and Enabling Future Devices
 
 
 
 15:40-16:10
ReRAM-based Analog Synapse Devices for Neuromorphic System
 
 
 
 16:10-16:30
Current Status and Trends in MRAM
 
   
16:30-16:50 TBD
  David Haynes, Lam Research
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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STS Room 307, COEX Thursday, January 24
1:00pm to 6:10pm
Plasma Etch Process Technologies for Next Generation Devices
 
The semiconductor business is exploded in this year and the need for semiconductor chips will be more increased in the future by the explosive increase of big data, AI chips and autonomous vehicles. But there exist many limitations at the fabrication of the next generation chips and especially the plasma etching technology will confront the severe limitation. The most critical problems at the plasma etching process have been always related with etch loading, selectivity and variation at the more shrinked patterns and the problem is that there is no plasma etchers to provide the sufficient capability at the next generation. To overcome those limitations we must developed efficient vacuum system, plasma and process simulation S/W as well as high performance plasma etcher including ALE, IBE(Ion beam etch) and ultra low temperature etch. Especially the ALE, IBE and ultra low temperature etch technologies emerged as the very promising ones for replacing the conventional etchers, and those provide unique etch characteristics for the next generation devices fabrication.
We invited the specialists on the above technical areas from worldwide and we will provide the good chances to get the insight on the next generation etch technologies at this symposium. We wish that the coming symposium will contribute to the expansion of the future technologies for overcoming the limitation on the next generation devices fabrication.
 
  • 날짜: 2019년 1월 24일(목)
  • 시간: 13:00-18:10
  • 장소: 코엑스 3층 307호
  • 언어: 영어 (동시통역은 지원되지 않습니다.)
 

Committee

  • Jaesoung Kim (DB HiTek)
  • Gyoungjin Min (Lam Research Korea)
  • Jongchul Park (Samsung Electronics)
  • Jong Won Shon (ASM Genitech)
  • Geun Young Yeom (Sungkyunkwan University)
  • Minsuk Lee (SK hynix)
  • IC Jang (Lam Research Korea)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 
 
 13:00-13:40
Etch Process Technology for Emerging Semiconductor Applications
 
 
 
 13:40-14:00
Finding Correlation between RCP and Profile in HARC Etching through Simulation
 
 
 
 14:00-14:20
Fundamentals and Realization of Etching Selectivity
 
 
 
 14:20-14:40
Enabling 3D and High-Aspect Ratio Etch Technologies Through on-Chamber Process Vacuum
 
 
 
 14:40-15:00
Break
 
 
 15:00-15:30
A Precise Measurement Method of Plasma Density in Plasma Process
 
 
 
 15:30-16:00
Semiconductor Manufacturer's View and Entreaty to Future Dry Etching Technologies
 
 
 
 16:00-16:20
Directional Reactive Ion Etch
 
TBD, Samsung Electronics
 
 
 16:20-16:40
Break
 
 
 16:40-17:20
DRIE: Silicon Ultra Low Temperature Plasma Etching
 
Mohamed Boufnichel, ST Microelectronics (invited)
 
 
 17:20-17:40
Process Variation Studies and the Impact on Electrical Performance
 
 
 
 17:40-18:10
Prospects for Combining ALD and ALE in a Single Chamber
 
Mike Cooke, Oxford Instruments
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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STS Room 308, COEX Thursday, January 24
1:00pm to 4:40pm
CMP & Cleaning for Emerging Technology
 
As IDMs are developing and manufacturing single digit nm devices with 3 dimentions, they need new technologies to overcome its limits and obstacles. It is a challeng not only for IDM but also for suppliers who have to deliver new materials and equipments. These difficulties occurred in CFM and CMP technologies as well. However, we can find the solution for this through collaborations and discussions actively between IDM, supplier and academia. This session will provide excellent 8 presentations from experts to share the breaktrough technologies for CFM and CMP.
 
  • 날짜: 2019년 1월 24일(목)
  • 시간: 13:00-16:40
  • 장소: 코엑스 3층 308호
  • 언어: 영어 (동시통역은 제공되지 않습니다.)

 

Committee

  • Kyunghyun Kim (Samsung Electronics)
  • Sang Yong Kim (Korea Polytechnics)
  • Taesung Kim (Sungkyunkwan University)
  • Ho Youn Kim (DB HiTek)
  • Jin-Goo Park (Hanyang University)
  • Sang Woo Lim (Yonsei University)
  • Haedo Jeong (Pusan National University)
  • Hong, Chang-Ki (Versum Materials)
  • Kyungho Hwang (SK hynix)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원
 

아젠다

 
Session 1: CMP Technology
 
 13:00-13:40
Challenges of CMP Technology for Advanced Memory Manufacturing
 
 
 
 13:40-14:00
GOI Evaluation for Surface Defect and Contamination in CMP Process
 
 
 
 14:00-14:20
Cleaner Induced Defect Challenges of BEOL Cu CMP in Advanced Logic Device
 
 
 
 14:20-14:40
3D Thin-film Thickness Profile Measurements of Multilayer Films
 
Young-Sik Ghim, Korea Research Institute of Standards and Science
 
 
 14:40-15:00
Break
 
 
 
Session 2: CFM Technology
 
 
 15:00-15:40
Wet Process Challenges for Advanced Logic Device Fabrication
 
 
 
 15:40-16:00
Influence of Surface Preparation on Gate Oxide Electrical Properties
 
 
 
 16:00-16:20
Improvement of Defect through Fume Control on SOD
 
 
 
 16:20-16:40
Rapid Airborne Molecular Contaminant (AMC) Quantitation and Speciation using SIFT-MS
 
David Hera, Syft Technologies
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.

 

Sponsored by
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STS Room 317, COEX Thursday, January 24
1:00pm to 5:50pm
Packaging Growth through Technology Diversification
 
Thanks to the semiconductor’s evolution, electronics markets are significantly expanded from the mainframe computing era to the mobile computing era. Today it is facing the 4th industry generation requires intelligence network in addition to performance excellence. For supporting this, every semiconductors area’s involvement, Design-Chip-Packaging-Test, is needed. Especially packaging technology’s flexibility and confrontation-ability will play a particularly important role with packaging as an Advanced-FOWLP using 3D IC and 2.5D IC, MEMS/Sensor, SIP, vertical integration package, and mature package’s advancing. It is challengeable. But this session will be helpful for understanding the new advanced packaging technologies.​
 
  • 날짜: 2019년 1월 24일(목)
  • 시간: 13:00-17:50
  • 장소: 코엑스 3층 317호
  • 언어: 영어 (동시통역은 제공되지 않습니다.)

 

Committee

  • Gu Sung Kim (Kangnam University)
  • Young Bae Park (Andong National University)
  • Min Suk Suh (SK hynix)
  • WS Shin (ASE Korea)
  • Seh Kwang Lee (Ehwa Diamond)
  • Hanchoon Lee (DB HiTek)
  • Ji Young Chung (Amkor Technology Korea)
  • Soon Jin Cho (Samsung Electro-Mechanics)
  • Taeje Cho (Samsung Electro-Mechanics)
  • Hwail Jin (Samsung Electronics)
  • HR Han (ASE Korea)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

   
 13:00-13:20
The Latest Advanced Packaging Technology Trends
 
   
 13:20-14:00
Evolution of Microstructure Signatures in Thermo-Mechanical Stressed Heterogeneously Integrated Components
  Prof. Tae-Kyu Lee, Portland State University (invited)
 
 
 14:00-14:20
High-Speed Serdes Package Development for Artificial Intelligence (AI) Applications
  Se-Ho You, Samsung Electronics
 
 
 14:20-14:40
TBD
  Rozalia Beica, DowDuPont
 
 
 14:40-15:00
Break
 
 
 15:00-15:30
B-Stage Conductive Adhesive Films for Electronic Packaging Applications
  Prof. Kyung Wook Paik, KAIST (invited)
 
 
 15:30-15:50
Testing & diagnosis of fine-pitch wafers and advanced packages
  Raffaele Vallauri, Technoprobe
 
 
 15:50-16:10
HBM Trends and Market Outlook
  MyeongJae Park, SK hynix
 
 
 16:10-16:30
Break
 
 
 16:30-16:50
TBD
 
TBD, ASE
   
 16:50-17:10
5G mmWave Packaging Technology or AI Packaging Technology
  SeungWook Yoon, STATS ChipPAC
 
 
 17:10-17:30
Agile Manufacturing of Glass Carriers for Fan-Out Packaging
  Jay Zhang, Corning Incorporated
   
 17:30-17:50
Various Bonding Process for FO Technology in WLP and PLP
 
Nelson Fan Chun Ho, ASM
   
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
View Full Agenda
SMART Room 300, COEX Thursday, January 24
1:00pm to 5:30pm
The rapidly maturing potential of data analytics and artificial intelligence brings big change, and big opportunities, for the entire semiconductor and electronic systems ecosystem.  But first it brings some challenges in figuring out where the key applications are, managing the complexities of digital simulations, and getting the cyber and the physical worlds to work together. We invite industry leaders to share what’s working and what’s needed next.
 
  • 날짜: 2019년 1월 24일(목)
  • 시간: 13:00-17:30
  • 장소: 코엑스 3층 300호
  • 언어: 영어, 한국어 (동시통역은 제공되지 않습니다.)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 
 
13:00-13:05
Welcome
 
 
13:05-13:35
Smart Manufacturing Trend in Semiconductor (tentative)
 
Yousoon Choi, Siemens
 
 
13:35-14:05
Digital Twin (tentative)
 
Schneider Electric
 
 
14:05-14:35
Smart Manufacturing and Machine Learning: Process Control in 3D
 
 
 
14:35-14:50
Break
 
 
14:50-15:20
Integration Deep Learning into Factory
 
TBD
 
 
15:20-15:50
Intelligent Digital Threading and Predictive analytics for Smart Manufacturing
 
TIBCO
 
 
15:50-16:20
AI use case in Semiconductor Industry (tentative)
 
BISTel
 
 
16:20-16:50
Creating Value with Industrial IOT
 
 
 
16:50-17:20
A Roadmap for the Future of Smart Manufacturing
 
TBD
 
 
17:20-17:30
Q&A
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
View Full Agenda
Networking Room 403, COEX Wednesday, January 23
12:30pm to 1:30pm
사전에 초청된 분들만 입장이 가능합니다. 
 
  • 행사명: VIP 런천
  • 날짜: 2018년 1월 23일(수)
  • 시간: 12:30-13:30
  • 장소: 코엑스 4층 403호 
  • 문의: semiconkorea@semi.org

 

 

View Full Agenda
Workforce Development Room 308, COEX Thursday, January 24
9:00am to 12:00pm
This tutorial aims to provide a basic course for new engineers who is working at cleaning & CMP technology related area. With this practical lecture from device makers, material suppliers and academia, we expect you will learn the challenges and fundamental technologies in cleaning & CMP process.
 
  • 날짜: 2019년 1월 24일(목)
  • 시간: 09:00-12:00
  • 장소: 코엑스 3층 308호
  • 언어: 한국어 (동시통역은 제공되지 않습니다.)

 

등록비

 
SEMI 회원사
비회원사
학생
사전등록(1/16까지)
100,000 원
120,000 원
50,000 원
현장등록
120,000 원
150,000 원
80,000 원

 

아젠다

   
09:00-09:45
Role and Responsibility of CMP Process in Recent IC Technology
 
 
 
09:45-10:00
Q&A / Break
 
 
10:00-10:45
Contamination Control
 
SK Chae, Sungkyunkwan University
 
 
10:45-11:00
Q&A / Break
 
 
11:00-11:45
Electroplating Trend in Semiconductor
 
 
 
11:45-12:00
Q&A
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
View Full Agenda
Workforce Development Room 308, COEX Wednesday, January 23
9:00am to 12:00pm
In this tutorial, ferroelectric which is emerging technology will be covered. The tutorial will focus on the most up-to-date researches on ferroelectric devices and its materials. 
 
  • 날짜: 2019년 1월 23일(수)
  • 시간: 09:00-12:00
  • 장소: 코엑스 3층 308호
  • 언어: 한국어 (동시통역은 제공되지 않습니다.)

 

등록비

 
SEMI 회원사
비회원사
학생
사전등록(1/16까지)
100,000 원
120,000 원
50,000 원
현장등록
120,000 원
150,000 원
80,000 원
 
 

아젠다

 
 
09:00-10:15
Ferroelectric Materials
 
 
 
10:15-10:30
Q&A / Break
 
 
10:30-11:45
Hafnia Ferroelectric Devices
 
 
 
11:45-12:00
Q&A
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
View Full Agenda
Workforce Development Room 403, COEX Friday, January 25
10:00am to 1:00pm
High Tech U(HTU)는 이공계 진학을 꿈꾸고 있는 중학생을 대상으로 하는 첨단 반도체 산업 현장 체험 및 진로 탐색 프로그램으로 전세계 9개국에서 동일한 커리큘럼으로 진행되고 있습니다. HTU Reunion은  HTU에 참여했던 학생들이 세미콘 코리아에서 다시 만나 반도체 산업 현장을 견학할 수 있도록 마련된 자리입니다.
 
  • 날짜: 2019년 1월 25일(금)
  • 시간: 10:00-13:00
  • 장소: 코엑스 4층 403호

 

후원사

                 
PLATINUM                
       
                 
                 
                 
GOLD                
             
                 
                 
                 
SILVER                
       
                 
               
                 
                 

 

 

View Full Agenda
Workforce Development Room 307, COEX Wednesday, January 23
9:00am to 12:00pm
This tutorial is intended for who interested in lithography technologies and related area. In this tutorial, trends and issues as well as fundamentals of Lithography technologies will be provided from industry experts and academia.
 
  • 날짜: 2019년 1월 23일 (수)
  • 시간: 09:00-12:00
  • 장소: 코엑스 3층 307호
  • 언어: 한국어 (동시통역은 제공되지 않습니다.)
 
 

등록비

 
SEMI 회원사
비회원사
학생
사전등록(1/16까지)
100,000 원
120,000 원
50,000 원
현장등록
120,000 원
150,000 원
80,000 원
 
 

아젠다

   
09:00-09:45
Patterning Technologies of Lithography
 
 
 
09:45-10:00
Q&A / Break
 
 
10:00-10:45
Lithography Technology Trends from Equipment Industry’s point of view
 
 
 
10:45-11:00
Q&A / Break
 
 
11:00-11:45
An Overview of Lithography
 
Prof. Hye-Keun Oh, Hanyang University
 
 
11:45-12:00
Q&A
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
View Full Agenda
Workforce Development Room 402, COEX Friday, January 25
1:00pm to 5:00pm
대학생만을 위한 반도체 산업 멘토링 세미나가 처음으로 개최됩니다.
반도체업계의 전문가들로부터 듣는 직군별 발표와 1:1 멘토링을 통해 유용한 정보를 얻어가시길 바랍니다.
* 본 프로그램은 대학생을 위해 마련되었으며, 사전등록을 완료한 참가자에 한해 참석 가능합니다.
 
  • 날짜: 2019년 1월 25일(금)
  • 시간: 13:00 - 17:00
  • 장소: 코엑스 4층 402호
  • 언어: 한국어 (동시통역은 제공되지 않습니다.)
  • 대상: 대학생
  • 등록비: 없음
     

 

아젠다

 13:00-13:10
Welcome
 
 
 13:10-13:50
Keynote: Where Does the Computer Come From and Heading To?
  서울대학교 황철성 교수
 
 
 13:50-14:20
Mentoring 1: Design 설계
  EO Technics 김종화 팀장
 
 
 14:20-14:50
Mentoring 2: Field Service 필드서비스
  ASML 이진우 차장
 
 
 14:50-15:00
Break
 
 
 15:00-15:30
Mentoring 3: Software 소프트웨어
  Wonik IPC 정봉명 과장
 
 
 15:30-16:00
Mentoring 4: Process Development 공정개발
 
   
 16:00-16:30
Mentoring 5: Material Development 소재개발
  Dongjin Semichem 이창수 상무보
 
 
 16:30-17:00
Mentoring 6: Field Service 필드서비스
  Applied Materials 권효선 과장
 
 

*상기일정은 사전 안내 없이 변경될 수 있습니다.

View Full Agenda
Workforce Development Room 317, COEX Thursday, January 24
9:00am to 12:00pm
This tutorial is designed as basic course for new engineers who is working at packaging technology related area. With the practical lecture from OSAT company and academia, we expect you will learn the challenges in packaging process and fundamental technologies as well.
 
  • 날짜: 2019년 1월 24일(목)
  • 시간: 09:00-12:00
  • 장소: 코엑스 3층 317호
  • 언어: 한국어 (동시통역은 지원되지 않습니다.)
 

등록비

 
SEMI 회원사
비회원사
학생
사전등록(1/16까지)
100,000 원
120,000 원
50,000 원
현장등록
120,000 원
150,000 원
80,000 원
 
 

아젠다

   
09:00-10:15
PKG Overview
 
JiYoung Chung, Amkor Technology
 
 
10:15-10:30
Q&A / Break
 
 
10:30-11:45
Materials & Equipment
 
Gu Sung Kim, Kangnam University
 
 
11:45-12:00
Q&A
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
View Full Agenda
Workforce Development Room 307, COEX Thursday, January 24
9:00am to 12:00pm
This tutorial is designed as basic course for new engineers who is working at etching technology related area. With the practical lecture from device makers, equipment suppliers and academia, you will learn the hottest issues and challenges in plasma & etching process and fundamental technologies as well.
 
  • 날짜: 2019년 1월 24일(목)
  • 시간: 09:00-12:00
  • 장소: 코엑스 3층 307호
  • 언어: 한국어 (동시통역은 제공되지 않습니다.)

 

등록비

 
SEMI 회원사
비회원사
학생
사전등록(1/16까지)
100,000 원
120,000 원
50,000 원
현장등록
120,000 원
150,000 원
80,000 원

 

아젠다

 
 
09:00-09:45
Plasma Etching Fundamentals for Memory Devices
 
 
 
09:45-10:00
Q&A / Break
 
 
10:00-10:45
Characteristics of ICP Source
 
 
 
10:45-11:00
Q&A / Break
 
 
11:00-11:45
Effect of Pulsed RF Plasma for Etch Application
 
 
 
11:45-12:00
Q&A
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
View Full Agenda
Opening Ceremony Room 401, COEX Wednesday, January 23
10:00am to 10:10am
 
  • 날짜: 2019년 1월 23일 (수)
  • 시간: 10:00-10:10
  • 장소: 코엑스 4층 401호
 
View Full Agenda
심은수
센터장 / Head of AI & SW Research Center
삼성전자 삼성종합기술원
다음 연사는 곧 공개됩니다!
다음 연사는 곧 공개됩니다!
Keynotes Room 401, COEX Wednesday, January 23
10:10am to 12:00pm

 

  • 행사명: 기조연설
  • 날짜: 2019년 1월 23일 (수)
  • 시간: 10:10-12:00
  • 장소: 코엑스 4층 401호
  • 등록비: 무료
  • 언어: 영어, 한국어 (동시통역 제공)

 

아젠다

10:10-10:40
On-Device Artificial Intelligence
 
Eunsoo Shim, Senior Vice President SAIT, Samsung Electronics
 
 
10:40-11:20
TBD
 
 
 
 
11:20-12:00
TBD
 
 

*상기일정은 사전 안내 없이 변경될 수 있습니다. 

View Full Agenda
Market Room 318, COEX Wednesday, January 23
1:00pm to 5:10pm
New application is rising- AI, Automotive in semiconductor industry and it is time to look it up for understanding its impact in semiconductor market. Also, China market is still interesting theme for our industry due to its potential and investment scale. You can explore these issues as well as semiconductor equipment and materials outlook in one place!
 
  • 날짜: 2019년 1월 23일 (수)
  • 시간: 13:00-17:10
  • 장소: 코엑스 3층 318호
  • 언어: 영어 (동시통역은 제공되지 않습니다.)
  • 대상
- Senior Professionals in Marketing
- Sales
- Procurement
- Business Development
- Consulting and Product Planning
- Finance

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 
 
 13:00-13:40
AI Innovation to Significantly Increase the Value of Semiconductors with 5G
 
 
 
 13:40-14:20
Memory Market
 
Nicholas Gaudois, UBS
 
 
 14:20-15:00
Wafer Fab Materials Enabling the Connected World
 
 
 
 15:00-15:20
Break
 
 
 15:20-16:00
Automotive
 
Jim Feldhan, Semico Research
 
 
 16:00-16:40
SEMI Market Outlook- Equipment & Materials for 2019
 
Clark Tseng, SEMI
 
 
16:40-17:10
China Tech Trend
 
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
View Full Agenda
Networking Grand Ballroom, 5F, Grand InterContinental Seoul Parnas Wednesday, January 23
5:30pm to 8:00pm
400여 명의 전세계 반도체 리더 및 임원들이 한자리에 모이는 "인더스트리 리더십 디너"에서 네트워킹 기회를 누리시기 바랍니다. 행사의 원활한 운영을 위해 좌석이 지정되어 있으니, 초대된 분들께선 추후 안내드리는 사이트에서 사전에 RSVP를 해주시기 바랍니다.   
 
  • 날짜: 2019년 1월 23일(수)
  • 시간: 17:30-20:00
  • 장소: 그랜드 인터컨티넨탈 서울 파르나스, 5층 그랜드 볼룸
  • 문의: semiconkorea@semi.org 

 

 

View Full Agenda
Technology Room 318, COEX Thursday, January 24
1:00pm to 4:20pm
The 5G and Big Data, key issues in next connected world are increasing demand for putting more pressure on test costs due to higher coverage requirements. Test must become smarter to address the increased quality demands, while at the same time remaining economical. To address these challenges, test industry is struggling with increasing instrumentation integration, smarter strategies, self-test, adaptive test, system-level test, as well as more sophisticated test hardware. In this Test Forum, you can get the clues to overcome these challenges from industry expertise.
 
  • 날짜: 2019년 1월 24일(목)
  • 시간: 13:00-16:20
  • 장소: 코엑스 3층 318호
  • 언어: 영어/한국어 (동시통역은 제공되지 않습니다.)

 

Committee

  • Young-Kwan Ko (UniTest)
  • James Jin-Soo Ko (Teradyne Korea)
  • Hyuk Kwon (Advantest Korea)
  • Kwonsung Ban (Samsung Electronics)
  • JeongBeom Bae (FormFactor Korea)
  • Sokyoung Song (SK hynix)
  • Kyu-hyuk Yeon (ASE Korea)
  • MinHo Chang (Amkor Technology Korea)
  • YH Jeon (TSE)
  • SungSoo Chung (QRT)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 
 
13:00-13:30
TBD
 
Gregory Smith, Teradyne
 
 
13:30-14:00
Automotive Semiconductor Testing
 
 
 
14:00-14:30
Testing Challenges and Design for Reliability
 
 
 
14:30-14:50
Break
 
 
14:50-15:20
RF Test Challenges Posed by the 5G Production Rollout
 
Kriss Hublitz, MaxLinear
 
 
15:20-15:50
Challenges of AI Testing
 
 
 
15:50-16:20
A New Singulated HBM Testing Solution - Breakthrough from Traditional ATE Test Method
 
 
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
View Full Agenda
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