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S1. Advanced Lithography

Room 307, COEX Wednesday, January 23
1:00pm to 4:40pm

Beginning of EUV High Volume Manufacturing
 
Advanced lithography session of the STS 2019 is prepared under the theme of "Beginning of EUV High Volume Manufacturing". This session will provide the opportunities of sharing the information on the latest progresses of EUV lithography as well as other advanced technologies. Recently, there has been a lot of significant progresses made on various fronts of EUV lithography technologies and it is about to enter the high volume manufacturing stage. During the session, you can hear the very up-to-date knowledge and information on various segments, such as exposure tools, optics, materials, mask, and processes including etching aspects, of EUV and also some of optical lithography technology from the prominent figures of the academia and industry. The extendibility issues of EUV such as high NA EUV and industrial challenges where we have to further collaborate will be touched and discussed throughout the session.
 
  • 날짜: 2019년 1월 23일 (수)
  • 시간: 13:00-16:40
  • 장소: 코엑스 3층 307호
  • 언어: 영어 (동시통역은 제공되지 않습니다.)
 

Committee

  • Shangwon Kim (DB HiTek)
  • Seong-Sue Kim (Samsung Electronics)
  • Jaehyun Kim (Dongjin Semichem)
  • Hong Seok Kim (Toppan Photomasks Korea)
  • Chang-Nam Ahn (ASML Korea)
  • Hye-Keun Oh (Hanyang University)
  • Changmoon Lim (SK hynix)
  • Jaesung Choi (ASML Korea)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

    아젠다

     
     
     13:00-13:40
    EUV Extendibility Research at Berkeley Lab
     
     
     
     13:40-14:00
    EUV Materials Solution
     
     
     
     14:00-14:20
    EUV Resist Materials Development for Overcoming Stochastic Limitation
     
    Sumin Kim, Samsung Electronics
     
     
     14:20-14:40
    The Industrialized EUV Scanner for High-Volume Manufacturing
     
     
     
     14:40-15:00
    Break
     
     
     15:00-15:20
    EUV Materials Challenge for DRAM Application
     
    Keundo Ban, SK hynix
     
     
     15:20-16:00
    EUV and Evolution in Lithography on the Horizon of Logic Scaling Paradigm Change
     
     
     
     16:00-16:20
    Trailing-edge Technology Applications like Broader E95 Approach into the Cutting Edge DUV Light Source for Tool Matching on the ArFi Lithography
     
    Tommy Oga, Gigaphoton
     
     
     16:20-16:40
    Atomic Layer Etch for Mitigation of EUV Resist Stochastic Defects
     
     
     
    *상기일정은 사전 안내 없이 변경될 수 있습니다. 
    *발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.

     

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