S5. Contamination-free Manufacturing and CMP Technology

Continuous shrinkage of device dimension to nm level requires new materials and novel device structure which demand a new paradigm in contamination control and planarization to improve the production yield and device reliability. CFM technology has become more critical in device manufacturing below 20 nm devices. Film loss-free and damage free cleaning technology face severe challenges for next-generation device fabrication. Also, CMP has grown to be one of the essential technologies for advanced node device fabrications such as FinFET, III/V materials and V-NAND. 7-nm logic technology is already under developing now, and CMP will play the leading role on patterning for sub-7 nm FEOL and MOL process steps. To overcome the new CMP challenges, the consumables should play a more critical role. The purpose of this session is to increase the level of understanding on current and future CFM/CMP technology. 

• 행사명: S5. Contamination-free Manufacturing and CMP Technology
• 날짜: 2018년 2월 1일 (목)
• 시간: 13:00-17:00
• 장소: 코엑스 3층 308호
• 주제:  CMP & Cleaning for Emerging Technology
• 언어: 영어 (동시통역 제공되지 않음)
• 후원: imec

Committee

• Kyunghyun Kim (Samsung Electronics)
• Sang Yong Kim (Korea Polytechnics)
• Ho Youn Kim (DB HiTek)
• Jin-Goo Park (Hanyang University)
• Haedo Jeong (Pusan National University)
• Hong, Chang-Ki (Versum Materials)
• Kyungho Hwang (SK hynix)

등록비

아젠다