Continuous shrinkage of device dimension to nm level requires new materials and novel device structure which demand a new paradigm in contamination control and planarization to improve the production yield and device reliability. CFM technology has become more critical in device manufacturing below 20 nm devices. Film loss-free and damage free cleaning technology face severe challenges for next-generation device fabrication. Also, CMP has grown to be one of the essential technologies for advanced node device fabrications such as FinFET, III/V materials and V-NAND. 7-nm logic technology is already under developing now, and CMP will play the leading role on patterning for sub-7 nm FEOL and MOL process steps. To overcome the new CMP challenges, the consumables should play a more critical role. The purpose of this session is to increase the level of understanding on current and future CFM/CMP technology.
- 행사명: S5. Contamination-free Manufacturing and CMP Technology
- 날짜: 2018년 2월 1일 (목)
- 시간: 13:00-17:00
- 장소: 코엑스 3층 308호
- 주제: CMP & Cleaning for Emerging Technology
- 언어: 영어 (동시통역 제공되지 않음)
- 후원: imec
Committee
- Kyunghyun Kim (Samsung Electronics)
- Sang Yong Kim (Korea Polytechnics)
- Ho Youn Kim (DB HiTek)
- Jin-Goo Park (Hanyang University)
- Haedo Jeong (Pusan National University)
- Hong, Chang-Ki (Versum Materials)
- Kyungho Hwang (SK hynix)
등록비
SEMI 회원사 | 비회원사 | 학생 | |
사전등록(1/24까지) | 150,000 원 | 180,000 원 | 80,000 원 |
현장등록 | 180,000 원 | 200,000 원 | 100,000 원 |
Co-organized by | Korea CMP UGM |
Korea Surface Cleaning UGM (KSCUGM) |
아젠다
Session 1: CFM Technology | |
13:00-13:40 |
Guy Vereecke, imec (invited)
|
13:40-14:00 | |
14:00-14:20 | |
14:20-14:40 | |
14:40-15:00 | Break |
Session 2: CMP Technology | |
15:00-15:40 |
Sunghoon Lee, GLOBAL FOUNDRIES (invited)
|
15:40-16:00 | |
16:00-16:20 | |
16:20-16:40 | |
16:40-17:00 |
