S6. Electropackage System and Interconnect Product

Room 317, COEX Thursday, January 24
1:00pm to 5:50pm

Packaging Growth through Technology Diversification
Thanks to the semiconductor’s evolution, electronics markets are significantly expanded from the mainframe computing era to the mobile computing era. Today it is facing the 4th industry generation requires intelligence network in addition to performance excellence. For supporting this, every semiconductors area’s involvement, Design-Chip-Packaging-Test, is needed. Especially packaging technology’s flexibility and confrontation-ability will play a particularly important role with packaging as an Advanced-FOWLP using 3D IC and 2.5D IC, MEMS/Sensor, SIP, vertical integration package, and mature package’s advancing. It is challengeable. But this session will be helpful for understanding the new advanced packaging technologies.​
  • 날짜: 2019년 1월 24일(목)
  • 시간: 13:00-17:50
  • 장소: 코엑스 3층 317호
  • 언어: 영어 (동시통역은 제공되지 않습니다.)



  • Gu Sung Kim (Kangnam University)
  • Young Bae Park (Andong National University)
  • Min Suk Suh (SK hynix)
  • WS Shin (ASE Korea)
  • Seh Kwang Lee (Ehwa Diamond)
  • Hanchoon Lee (DB HiTek)
  • Ji Young Chung (Amkor Technology Korea)
  • Soon Jin Cho (Samsung Electro-Mechanics)
  • Taeje Cho (Samsung Electro-Mechanics)
  • Hwail Jin (Samsung Electronics)
  • HR Han (ASE Korea)



  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원



    The Latest Advanced Packaging Technology Trends
    Evolution of Microstructure Signatures in Thermo-Mechanical Stressed Heterogeneously Integrated Components
      Prof. Tae-Kyu Lee, Portland State University (invited)
    High-Speed Serdes Package Development for Artificial Intelligence (AI) Applications
      Se-Ho You, Samsung Electronics
      Rozalia Beica, DowDuPont
    B-Stage Conductive Adhesive Films for Electronic Packaging Applications
      Prof. Kyung Wook Paik, KAIST (invited)
    Testing & diagnosis of fine-pitch wafers and advanced packages
      Raffaele Vallauri, Technoprobe
    HBM Trends and Market Outlook
      MyeongJae Park, SK hynix
    TBD, ASE
    5G mmWave Packaging Technology or AI Packaging Technology
      SeungWook Yoon, STATS ChipPAC
    Agile Manufacturing of Glass Carriers for Fan-Out Packaging
      Jay Zhang, Corning Incorporated
    Various Bonding Process for FO Technology in WLP and PLP
    Nelson Fan Chun Ho, ASM
    *상기일정은 사전 안내 없이 변경될 수 있습니다. 
    *발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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