02-531-7800

Korean


MI 포럼

Room 402, COEX Thursday, February 01
10:00am to 6:00pm

As device technology shrinks to sub-10 nm, we expect a lot of challenges in process integration. Thus, many chip makers are considering EUV lithography to mitigate process risk and to reduce process integration time. However, EUV lithography also has many technical challenges. On the other hand, 3D memory process also brings another technical issue in many aspects. Therefore, we believe the role of Metrology & Inspection is getting more and more important to enable sub-10nm and 3D device.

This year, celebrating its 10th anniversary, MI Forum will cover the theme as “MI: An Enabler of Future Devices” with technical experts from worldwide. We hope you can get better understanding on MI challenges and solutions for upcoming process technologies in the forum and build the network with industry leaders in MI Networking reception, which will be held after the forum as well.

 

  • 행사명: MI 포럼
  • 날짜: 2018년 2월 1일 (목)
  • 시간: 10:00-18:30
  • 장소: 코엑스 4층 402호
  • 주제: MI: An Enabler for Future Devices
  • 언어: 영어, 한국어 (동시통역 제공되지 않음)

 

Committee

  • Chuck Kim (AMETEK Korea)
  • Chang Woo Kim (KLA-Tencor Korea)
  • TK Kim (Semilab Korea)
  • Harris Kim (Rudolph Technologies Korea)
  • Munhong Ro (Dongbu HiTek)
  • Changman Moon (NOVA Measuring Instruments Korea)
  • Byong Chon Park (KRISS)
  • Dong Chun Lee (Nanometrics Korea)
  • Byoung-Ho Lee (SK hynix)
  • Suk Woo Martin Lee (Applied Materials Korea)  
  • Sung Hun Lee (Thermo-Fisher MSD Korea)
  • Junwoo Lee (Auros Technology)
  • Jason Jeong (Nextin)
  • Jaesung Choi (ASML Korea)

 

등록하기

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/24까지) 200,000 원 240,000 원 120,000 원
현장등록 240,000 원 280,000 원 150,000 원

 

아젠다

 10:00-10:10
Welcome
   
 10:10-10:50
Keynote
 
   
 Session 1: EUV
 10:50-11:20
   
 11:20-11:50 Holistic Patterning Solutions in Leading Edge Semiconductor Device Manufacturing
   
 11:50-12:20 EUV Reticle Management: From Mask Shop to Fab
Moshe Preil, KLA-Tencor
   
 12:20-12:50
TBD
Philippe Leray, Imec (invited)
   
 12:50-14:30
Lunch
(Lunchbox will be provided to attendees.)
   
 Session 2: 3D
 14:30-15:00
 
In-Line 3D CD Uniformity Control for Next Generation 3D Memory Devices
Kevin Heidrich, Nanometrics
   
 15:00-15:30
   
 15:30-15:50
Break
   
 15:50-16:20
   
 16:20-16:50
   
 Session 3: Collaboration
 16:50-17:20 MI Challenges for Future Devices
Seong-Min Ma, SK hynix (invited)
   
 17:20-18:00 Panel Discussion
   
 18:00-19:00
(Forum attendees are invited to networking reception.)
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
Sponsored by: 
Share page with AddThis