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S4. Plasma Science and Etching Technology

Thursday, February 6 | 1:00 pm - 5:30 pm
#307

Ultra-fine Patterning Technology for EUV Era

  • Date: Feb 6(Thu), 2020
  • Time: 1:00 pm - 5:30 pm
  • Room: #307, Conference Room (South), COEX
  • Language: English (Simultaneous interpretation will NOT be provided)​​

 

Committee

  • Jaesoung Kim (DB HiTek)
  • Gyoungjin Min (Lam Research Korea)
  • Jongchul Park (Samsung Electronics)
  • Jong Won Shon (ASMK)
  • Geun Young Yeom (Sungkyunkwan University)
  • Minsuk Lee (SK hynix)
  • Seongsoo Lee (Applied Materials Korea)
  • IC Jang (Lam Research Korea)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 29) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

Agenda

Prediction of Etch Rates for New Materials by Machine Learning - Case Study for Physical Sputtering

Prof. S. Hamaguchi

Osaka University
1:00 pm - 1:40 pm

Next Genertation Etch Technologies for EUV Patterning Era

SangDeok Park

Samsung Electronics
1:40 pm - 2:00 pm

TBD

Thorsten Lill

Lam Research
2:00 pm - 2:20 pm

Break

2:20 pm - 2:40 pm

Spectroscopic diagnostics for plasma processing

Prof. SY Moon

Chonbuk National University
2:40 pm - 3:10 pm

Ultra-fine Patterning Technology for EUV Era

3:10 pm - 3:50 pm

Plasma Etching Technology Challenges for Next Generation Devices

Huichan Seo

SK hynix
3:50 pm - 4:10 pm

Break

4:10 pm - 4:30 pm

TBD

Joydeep Guha

Applied Materials
4:30 pm - 4:50 pm

Understanding the Cooling and Particulate Challenges for Next Generation Atomic Layer Etch Technologies

Raj Melkote

Edwards Vacuum
4:50 pm - 5:10 pm

SAQP Pitch Walking Improvement Path Finding by Simulation

Timothy Yang

Lam Research
5:10 pm - 5:30 pm

*The agenda will be subject to change without notice.

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