Skip to main content

S5. CMP & Cleaning Technology

Thursday, February 6 | 1:00 pm - 6:00 pm
#308

CMP & Surface Cleaning for Emerging Technology

 

  • Date: Feb 6(Thu), 2020
  • Time: 1:00 pm - 6:00 pm
  • Room: #308, Conference Room (South), COEX
  • Language: English (Simultaneous interpretation will NOT be provided)​​

 

Committee

  • Kyunghyun Kim (Samsung Electronics)
  • Taesung Kim (Sungkyunkwan University)
  • Ho Youn Kim (DB HiTek)
  • Jin-Goo Park (Hanyang University)
  • Sangwoo Lim (Yonsei University)
  • Haedo Jeong (Pusan National University)
  • Hong, Chang-Ki (Versum Materials)
  • Kyungho Hwang (SK hynix)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 29) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

[Session 1: Cleaning] Past, Present and Future of Semiconductor Cleaning Technology

Takeshi Hattori

Hattori Consulting International
1:00 pm - 1:40 pm

[Session 1: Cleaning] TBD

1:40 pm - 2:00 pm

[Session 1: Cleaning] Post CMP Cleans Evolution and Defect Improvement Approaches

Katrina Mikhaylichenko

Applied Materials
2:00 pm - 2:20 pm

Break

2:20 pm - 2:40 pm

[Session 1: Cleaning] Wet Cleaning Challenges in Drying: Present and Future

Harry Yamashita

Tokyo Electron
2:40 pm - 3:00 pm

[Session 1: Cleaning] New Developments in Semiconductor Process Gas Filtration Efficiency: Capturing the 0.0015 µm Particle

Kevin McGuffin

Mott Corporation
3:00 pm - 3:20 pm

[Session 2: CMP] Reactive Liquids, non-Prestonian Rates and post-CMP Cleaning

Suryadevara Babu

Clarkson University
3:20 pm - 4:00 pm

Break

4:00 pm - 4:20 pm

[Session 2: CMP] TCMP (mini) Legend = Revolution to Evolution =

Manabu Tsujimura

Ebara Corporation
4:20 pm - 4:40 pm

[Session 2: CMP] Investigation of the mechanism on decreased pad cut ratio during Tungsten Chemical Mechanical Polishing

HeeJu Kim

SK hynix
4:40 pm - 5:00 pm

[Session 2: CMP] Effect of Pre-Chemical Treatment on Cu CMP

Sangwon Bahng

SK hynix
5:00 pm - 5:20 pm

[Session 2: CMP] Innovative Material Solution for Advanced CMP Process

Jeong Yun Yu

Versum Materials
5:20 pm - 5:40 pm

[Session 2: CMP] Novel CMP filter design that reduces fine particles in slurry systems

Benjamin Liao

Entegris
5:40 pm - 6:00 pm

*The agenda will be subject to change without notice.

Sponsors