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S6. Electropackage System and Interconnect Product

Thursday, February 6 | 1:00 pm - 6:10 pm
#317

Packaging Growth through Technology Diversification 

 

  • Date: Feb 6 (Thu), 2020
  • Time: 1:00 pm -  6:10 pm
  • Room: #317, Conference Room (South), COEX
  • Language: English (Simultaneous interpretation will NOT be provided)​

 

Committee

  • Gu Sung Kim (Kangnam University)
  • Young Bae Park (Andong National University)
  • Min Suk Suh (SK hynix)
  • WS Shin (ASE Korea)
  • Seh Kwang Lee (Ehwa Diamond)
  • Hanchoon Lee (DB HiTek)
  • Ji Young Chung (Amkor Technology Korea)
  • Soon Jin Cho (Samsung Electro-Mechanics)
  • Taeje Cho (Samsung Electro-Mechanics)
  • Hwail Jin (Samsung Electronics)
  • HR Han (ASE Korea)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 29) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

Agenda

TBD

1:00 pm - 1:40 pm

TBD

1:40 pm - 2:00 pm

New Packaging Solution for 5G System Intergration

JinYoung Khim

Amkor Technology Korea
2:00 pm - 2:30 pm

Break

2:30 pm - 2:50 pm

TBD

Christopher Bailey

University of Greenwich
2:50 pm - 3:30 pm

Unit Process Challenges of High Density Fanout

Marvin Bernt

Applied Materials
3:30 pm - 3:50 pm

Inspection and Metrology Solutions for Large Packages and Fine Pitch Bumps

Cheolkyu Kim

Rudolph Technology
3:50 pm - 4:10 pm

Break

4:10 pm - 4:30 pm

Advanced Packaging Technologies for High Performance Computing: Challenges and Opportunities

Jaesik Lee

NVIDIA
4:30 pm - 5:10 pm

The Big Data Driven Package Process

Sanghoun Oh

SK hynix

5:10 pm - 5:30 pm

TBD

5:30 pm - 5:50 pm

Manufacturing High Quality Diffractive Optical Elements(DOEs) Using Nanoimprint Lithography

Eleonora Storace

SUSS MicroTec Lithography GmbH
5:50 pm - 6:10 pm

*The agenda will be subject to change without notice.

 

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