Skip to main content

Metrology and Inspection Forum

Thursday, February 6 | 10:00 am - 7:00 pm
#402

As device technology shrinks to sub-10 nm and moves to 3D architecture, we are facing a lot of challenges in process integration and strong concerns on device reliability monitoring. We believe the role of Metrology & Inspection will be more critical than ever.

In MI Forum 2020, 3 main topics, Alternative MI, Novel Method, and Reliability will be discussed with 12 distinguished speakers. We hope you can get better understanding on MI challenges with solutions and build the strong network with industry leaders in this forum

 

  • Date: Feb 6(Wed), 2020
  • Time: 10:00 am -  7:00 pm
  • Room: #402, Conference Room (South), COEX
  • Language: English and Korean (Simultaneous interpretation will NOT be provided)​​

 

Committee

  • MinChul Kang (Rudolph Technology)
  • Christopher H. Kang (Thermo Fisher Scientific)
  • Chang Woo Kim (KLA)
  • TK Kim (Semilab)
  • Munhong Ro (DB HiTek)
  • Changman Moon (NOVA)
  • Byong Chon Park (KRISS)
  • Yong Jun Park (Samsung Display)
  • Yudong Soe (Nanometrics)
  • Youn Tae Ahn (LUKEN Technology)
  • Hyungwon Yoo (Hitachi High-Technologies)
  • DaeHa Lee (AMETEK Korea)
  • Dongchun Lee (NvisANA)
  • Myungjun Lee (Samsung Electronics)
  • Byoung-Ho Lee (SK hynix)
  • Suk Woo Martin Lee (Applied Materials)
  • Kyle Lee (ASML)
  • Dongchul Ihm (Samsung Electronics)
  • Hyunjin Chang (Auros Technology)
  • Jason Jeong (Nextin)

 

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 29) 200,000 won 240,000 won 120,000 won
Onsite 240,000 won 280,000 won 150,000 won

 

Agenda

Welcome

10:00 am - 10:10 am

Keynote: Machine Learning MI Technology

10:10 am - 10:40 am

[Session 1: Alternative MI] Measurement of Fine Patterns by Utilizing Machine Learning in Semiconductor Industry

Yoonshik Kang

SK hynix
10:40 am - 11:10 am

[Session 1: Alternative MI] A Novel Approach to enable Machine Learning and Deep Learning in Production for Inspection and Metrology

Poh-Boon Yong

KLA
11:10 am - 11:40 am

[Session 1: Alternative MI] TBD

Yu Cao

ASML
11:40 am - 12:10 pm

[Session 1: Alternative MI] TBD

12:10 pm - 12:40 pm

Lunch

12:40 pm - 2:00 pm

[Session 2: Novel Method] Metrology Based Inspection(MBI): Merged Metrology and Inspection for Advanced Process Control

Jeong-Ho Yeo

Applied Materials
2:00 pm - 2:30 pm

[Session 2: Novel Method] Broadband Plasma Optical Wafer Inspection Solutions for Monitoring EUV Reticle Defectivity

Andrew Cross

KLA
2:30 pm - 3:00 pm

Break

3:00 pm - 3:20 pm

[Session 3: Reliability] An Effective Approach to Monitor Potential Reliability Failure in the Advanced Devices

Sang Hyun Han

NOVA

3:20 pm - 3:50 pm

[Session 3: Reliability] Application of Optical Second Harmonic Generation for Process Development in Advanced Memory Device Manufacturing

Ming Lei

FemtoMetrix

3:50 pm - 4:20 pm

[Session 3: Reliability] Quantitative Automated AFM Technologies and Reliability Improvement for Semi Applications

Sang-Joon Cho

Park Systems
4:20 pm - 4:50 pm

Break

4:50 pm - 5:10 pm

[Session 3: Reliability] Providing Contamination Monitoring for Yield Enhancement in Semiconductor Process: From Chemical to Wafer

Jung-Hwan Kim

NvisANA

5:10 pm - 5:40 pm

TBD

5:40 pm - 6:10 pm

[Session 3: Reliability] Networking Reception

6:10 pm - 7:00 pm
(Forum attendees are invited to networking reception.)

*The agenda will be subject to change without notice.

Sponsors