Metrology and Inspection Forum
As device technology shrinks to sub-10 nm and moves to 3D architecture, we are facing a lot of challenges in process integration and strong concerns on device reliability monitoring. We believe the role of Metrology & Inspection will be more critical than ever.
In MI Forum 2020, 3 main topics, Alternative MI, Novel Method, and Reliability will be discussed with 12 distinguished speakers. We hope you can get better understanding on MI challenges with solutions and build the strong network with industry leaders in this forum.
- Date: Feb 6(Tue), 2020
- Time: 10:00 am - 7:00 pm
- Room: #402, 4F, COEX
- Language: English and Korean (Simultaneous interpretation will NOT be provided)
|Early Bird (by Jan 29)||200,000 won||240,000 won||120,000 won|
|Onsite||230,000 won||260,000 won||130,000 won|
[Keynote]Augmenting Design & Metrology Reliability through the Application of Focused Ion Beam (FIB) Circuit Prototyping Prior to a Photomask Modification (invited)
[Session 1: Alternative MI] Measurement of Fine Patterns by Utilizing Machine Learning in Semiconductor Industry
[Session 1: Alternative MI] A Novel Approach to Enable Machine Learning and Deep Learning in Production for Inspection and Metrology
[Session 1: Alternative MI] E-Beam Metrology, Inspection and Deep Learning
[Session 1: Alternative MI] Dissociating Analysis from Acquisition: An Enterprise/Fab Wide Approach to Information Processing
[Session 2: Novel Method] Metrology Based Inspection(MBI): Merged Metrology and Inspection for Advanced Process Control
[Session 2: Novel Method] High Sensitivity Repeater Detection with Broadband Plasma Optical Wafer Inspection for Mask Defect Qualification
[Session 3: Reliability] An Effective Approach to Monitor Potential Reliability Failure in the Advanced Devices
Sang Hyun Han
[Session 3: Reliability] Application of Optical Second Harmonic Generation for Process Development in Advanced Memory Device Manufacturing
[Session 3: Reliability] Quantitative Automated AFM Technologies and Reliability Improvement for Semi Applications
[Session 3: Reliability] Providing Contamination Monitoring for Yield Enhancement in Semiconductor Process: From Chemical to Wafer
* The agenda will be subject to change without notice.
* Presentation files agreed by speakers will be provided to attendees. It will be informed how to download the files after the event.