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Metrology and Inspection Forum

Thursday, February 6 | 10:00 am - 7:00 pm
#402

As device technology shrinks to sub-10 nm and moves to 3D architecture, we are facing a lot of challenges in process integration and strong concerns on device reliability monitoring. We believe the role of Metrology & Inspection will be more critical than ever.

In MI Forum 2020, 3 main topics, Alternative MI, Novel Method, and Reliability will be discussed with 12 distinguished speakers. We hope you can get better understanding on MI challenges with solutions and build the strong network with industry leaders in this forum.

 

  • Date: Feb 6(Tue), 2020
  • Time: 10:00 am - 7:00 pm
  • Room: #402, 4F, COEX
  • Language: English and Korean (Simultaneous interpretation will NOT be provided)​​

 

Committee

  • MinChul Kang (Onto Innovation)
  • Christopher H. Kang (Thermo Fisher Scientific)
  • Chang Woo Kim (KLA)
  • TK Kim (Semilab)
  • Munhong Ro (DB HiTek)
  • Sang Hyun Han (NOVA)
  • Byong Chon Park (KRISS)
  • Yong Jun Park (Samsung Display)
  • Yudong Soe (Onto Innovation)
  • Youn Tae Ahn (LUKEN Technology)
  • Hyungwon Yoo (Hitachi High-Technologies)
  • DaeHa Lee (AMETEK Korea)
  • Dongchun Lee (NvisANA)
  • Myungjun Lee (Samsung Electronics)
  • Byoung-Ho Lee (SK hynix)
  • Suk Woo Martin Lee (Applied Materials)
  • Kyle Lee (ASML)
  • Dongchul Ihm (Samsung Electronics)
  • Hyunjin Chang (Auros Technology)
  • Jason Jeong (Nextin)

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 29) 200,000 won 240,000 won 120,000 won
Onsite 230,000 won 260,000 won 130,000 won

 

Agenda

Welcome

10:00 am - 10:10 am

[Keynote]Augmenting Design & Metrology Reliability through the Application of Focused Ion Beam (FIB) Circuit Prototyping Prior to a Photomask Modification (invited)

Steve Herschbein

GlobalFoundries
10:10 am - 10:40 am

[Session 1: Alternative MI] Measurement of Fine Patterns by Utilizing Machine Learning in Semiconductor Industry

Yoonshik Kang

SK hynix
10:40 am - 11:10 am

[Session 1: Alternative MI] A Novel Approach to enable Machine Learning and Deep Learning in Production for Inspection and Metrology

Poh-Boon Yong

KLA
11:10 am - 11:40 am

Break

11:40 am - 12:00 pm

[Session 1: Alternative MI] E-Beam Metrology, Inspection and Deep Learning

Yu Cao

HMI, an ASML company
12:00 pm - 12:30 pm

[Session 1: Alternative MI] TBD

Kevin Heidrich

Onto Innovation
12:30 pm - 1:00 pm

Lunch

1:00 pm - 2:30 pm

[Session 2: Novel Method] Metrology Based Inspection(MBI): Merged Metrology and Inspection for Advanced Process Control

Jeong-Ho Yeo

Applied Materials
2:30 pm - 3:00 pm

[Session 2: Novel Method] High Sensitivity Repeater Detection with Broadband Plasma Optical Wafer Inspection for Mask Defect Qualification

Andrew Cross

KLA
3:00 pm - 3:30 pm

[Session 3: Reliability] An Effective Approach to Monitor Potential Reliability Failure in the Advanced Devices

Sang Hyun Han

NOVA

3:30 pm - 4:00 pm

Break

4:00 pm - 4:20 pm

[Session 3: Reliability] Application of Optical Second Harmonic Generation for Process Development in Advanced Memory Device Manufacturing

Ming Lei

FemtoMetrix
4:20 pm - 4:50 pm

[Session 3: Reliability] Quantitative Automated AFM Technologies and Reliability Improvement for Semi Applications

Sang-Joon Cho

Park Systems
4:50 pm - 5:20 pm

[Session 3: Reliability] Providing Contamination Monitoring for Yield Enhancement in Semiconductor Process: From Chemical to Wafer

Jung-Hwan Kim

NvisANA
5:20 pm - 5:50 pm

Networking Reception

5:50 pm - 7:00 pm
(Forum attendees are invited to networking reception.)

* The agenda will be subject to change without notice.

* Presentation files agreed by speakers will be provided to attendees. It will be informed how to download the files after the event.

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