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S5. CMP & Cleaning Technology

Thursday, February 6 | 1:00 pm - 6:00 pm
#308

CMP & Surface Cleaning for Emerging Technology

As semiconductor devices are reaching their physical limits, there are still many technical challenges to overcome in the future. Logic device should reduce power even further and increase speed more, DRAM memory still needs to shrink to the extreme limits, and 3D NAND needs to be stacked up higher. To achieve these, CMP process needs to reduce variation more than now, defect size and micro scratch caused by CMP should be further reduced to below 20 nm. Also, CMP must overcome extreme step height to achieve planarity while at the same time productivity should be secured.

Cleaning process has already gone beyond the concept of removing normal defects or by products, and it is challenging the limits against the laws of nature in extreme high aspect ratio. In addition, fume control, damaged layer control, drying, bulk material removal with very high selective chemical and environmental factors should be considered.

To overcome these challenges and discuss the present and future of semiconductor CMP and Cleaning process, to reduce the defects caused by CMP to extremely low levels, to implement ultimate drying technology to overcome surface tension, and to provide insights from Revolution to Evolution, in this session, prominent experts in CMP and Cleaning process have been invited and 11 excellent topics presented by experts in each field will be discussed.

 

  • Date: Feb 6(Thu), 2020
  • Time: 1:00 pm - 6:00 pm
  • Room: #308, 3F, COEX
  • Language: English (Simultaneous interpretation will NOT be provided)​​

 

Committee

 

  • Kyunghyun Kim (Samsung Electronics)
  • Taesung Kim (Sungkyunkwan University)
  • Ho Youn Kim (DB HiTek)
  • Jin-Goo Park (Hanyang University)
  • Sangwoo Lim (Yonsei University)
  • Yungseok Chung (Tokyo Electron)
  • Haedo Jeong (Pusan National University)
  • Hong, Chang-Ki (Versum Materials)
  • Kyungho Hwang (SK hynix)

 

 

Registration Fee

  SEMI Member Non-Member Student
Early Bird (by Jan 29) 150,000 won 180,000 won 80,000 won
Onsite 180,000 won 200,000 won 100,000 won

 

Agenda

[Session 1: Cleaning] Past, Present and Future of Semiconductor Cleaning Technology (invited)

Takeshi Hattori

Hattori Consulting International
1:00 pm - 1:40 pm

[Session 1: Cleaning] Challenges for Novel Photoresist Strip

Woogwan Shim

Samsung Electronics
1:40 pm - 2:00 pm

[Session 1: Cleaning] Post CMP Cleans Evolution and Defect Improvement Approaches

Katrina Mikhaylichenko

Applied Materials
2:00 pm - 2:20 pm

Break

2:20 pm - 2:40 pm

[Session 1: Cleaning] Wet Cleaning Challenges in Drying: Present and Future

Harry Yamashita

Tokyo Electron
2:40 pm - 3:00 pm

[Session 1: Cleaning] New Developments in Semiconductor Process Gas Filtration Efficiency: Capturing the 0.0015 µm Particle

Kevin McGuffin

Mott Corporation
3:00 pm - 3:20 pm

[Session 2: CMP] Reactive Liquids, non-Prestonian Rates and post-CMP Cleaning (invited)

Prof. Babu Suryadevara

Clarkson University
3:20 pm - 4:00 pm

Break

4:00 pm - 4:20 pm

[Session 2: CMP] CMP Rev. to Evo. (Revolution to Evolution)

Manabu Tsujimura

Ebara
4:20 pm - 4:40 pm

[Session 2: CMP] Investigation of the Mechanism on Decreased Pad Cut Ratio during Tungsten Chemical Mechanical Polishing

HeeJu Kim

SK hynix
4:40 pm - 5:00 pm

[Session 2: CMP] Effect of Pre-Chemical Treatment on Cu CMP

Sangwon Bahng

SK hynix
5:00 pm - 5:20 pm

[Session 2: CMP] Innovative Material Solution for Advanced CMP Process

Jeong Yun Yu

Versum Materials
5:20 pm - 5:40 pm

[Session 2: CMP] Novel CMP Filter Design that Reduces Fine Particles in Slurry Systems

Benjamin Liao

Entegris
5:40 pm - 6:00 pm

* The agenda will be subject to change without notice.

* Presentation files agreed by speakers will be provided to attendees. It will be informed how to download the files after the event.

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