S5. CMP & Cleaning Technology
CMP & Surface Cleaning for Emerging Technology
As semiconductor devices are reaching their physical limits, there are still many technical challenges to overcome in the future. Logic device should reduce power even further and increase speed more, DRAM memory still needs to shrink to the extreme limits, and 3D NAND needs to be stacked up higher. To achieve these, CMP process needs to reduce variation more than now, defect size and micro scratch caused by CMP should be further reduced to below 20 nm. Also, CMP must overcome extreme step height to achieve planarity while at the same time productivity should be secured.
Cleaning process has already gone beyond the concept of removing normal defects or by products, and it is challenging the limits against the laws of nature in extreme high aspect ratio. In addition, fume control, damaged layer control, drying, bulk material removal with very high selective chemical and environmental factors should be considered.
To overcome these challenges and discuss the present and future of semiconductor CMP and Cleaning process, to reduce the defects caused by CMP to extremely low levels, to implement ultimate drying technology to overcome surface tension, and to provide insights from Revolution to Evolution, in this session, prominent experts in CMP and Cleaning process have been invited and 11 excellent topics presented by experts in each field will be discussed.
- Date: Feb 6(Thu), 2020
- Time: 1:00 pm - 6:00 pm
- Room: #308, 3F, COEX
- Language: English (Simultaneous interpretation will NOT be provided)
- Kyunghyun Kim (Samsung Electronics)
- Taesung Kim (Sungkyunkwan University)
- Ho Youn Kim (DB HiTek)
- Jin-Goo Park (Hanyang University)
- Sangwoo Lim (Yonsei University)
- Yungseok Chung (Tokyo Electron)
- Haedo Jeong (Pusan National University)
- Hong, Chang-Ki (Versum Materials)
- Kyungho Hwang (SK hynix)
|Early Bird (by Jan 29)||150,000 won||180,000 won||80,000 won|
|Onsite||180,000 won||200,000 won||100,000 won|
[Session 1: Cleaning] Past, Present and Future of Semiconductor Cleaning Technology (invited)
[Session 1: Cleaning] Challenges for Novel Organic Strip Process
[Session 1: Cleaning] Post CMP Cleans Evolution and Defect Improvement Approaches
[Session 1: Cleaning] Wet Cleaning Challenges in Drying: Present and Future
[Session 1: Cleaning] New Developments in Semiconductor Process Gas Filtration Efficiency: Capturing the 0.0015 µm Particle
[Session 2: CMP] Reactive Liquids, non-Prestonian Rates and post-CMP Cleaning (invited)
Prof. Babu Suryadevara
[Session 2: CMP] CMP Rev. to Evo. (Revolution to Evolution)
[Session 2: CMP] Investigation of the Mechanism on Decreased Pad Cut Ratio during Tungsten Chemical Mechanical Polishing
[Session 2: CMP] Effect of Pre-Chemical Treatment on Cu CMP
[Session 2: CMP] Innovative Material Solution for Advanced CMP Process
Jeong Yun Yu
[Session 2: CMP] Novel CMP Filter Design that Reduces Fine Particles in Slurry Systems
* The agenda will be subject to change without notice.
* Presentation files agreed by speakers will be provided to attendees. It will be informed how to download the files after the event.