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STS (SEMI Technology Symposium)

김진국 부사장_STS_2021

Welcome message from the Chairman of the SEMI Technology Symposium

On behalf of the SEMI Technology Symposium (STS) committee, I would like to extend my warm welcome to participants in the semiconductor industry, and to the distinguished speakers, who accepted the invitation to the SEMICON Korea STS 2021.

Due to the COVID-19 pandemic, this year’s STS is held online, bringing speakers from anywhere around the world. This paradigm shift from contact to untact, accelerated by the coronavirus pandemic, I think, became possible thanks largely to the information technology, in which the memory plays a key role. So I feel proud to be a part of the industry and at the same time, I feel the need to act with a sense of responsibility.

The uncertainties in the global semiconductor market are heightened by the pandemic coupled with the geopolitical factors. To overcome the challenges of uncertainty, continuous technological innovation and collaboration among companies home and abroad, among the industry-academia-research institutes is crucial. I hope the symposium can play a key role in facilitating such collaboration. 

In this year’s STS, high quality presentations will be presented in a total of six areas; lithography, interconnection, device, etch, cleaning & CMP and packaging, to provide insight into the various latest technology trends and the future of next generation semiconductor technology. I believe STS 2021 will also offer a useful and valuable information to the participants.

Once again, I would like to thank you all for participating online, and also thank the speakers, program committee members, SEMI staffs, for all their dedication to making this year’s symposium successful. 
Thank you.


Jin-kook Kim
Head of R&D at SK hynix
Chairman of the SEMICON Korea STS 2021 


On-Demand Sessions

S1. Advanced Lithography


S2. Advanced Materials & Process Technology


S3. Device Technology


S4. Plasma Science and Etching Technology


S5. CMP & Cleaning Technology


S6. Electropackage System and Interconnect Product