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S2. Advanced Materials & Process Technology

Innovative Materials and Processes for the Semiconductor Technology

In this session, the most up-to-date research and development outputs in the field of Advanced Materials and Process Technology, which are the key enablers of the future semiconductor devices, will be shared. Many prominent authors from the academia and industries will talk various research areas of functional materials and semiconductor devices not only in the view points of the fundamental but also of the mass production. Especially, both revolutionary and evolutionary approach to overcome scaling limit will be discussed in the respect of precursor, equipment, and integration innovation. Excellent 8 presentations including 4 outstanding invited talks will be given to cover the major technical issues and the leading-edge solutions.

 

  • Event Format: On-demand
  • Language: English (Simultaneous interpretation will NOT be provided)
  • Presentation Time: 2~30 minutes for each presentation

 

Committee

  • Si-Bum Kim (KEY FOUNDRY)
  • Hyoung-Yoon Kim (DB HiTek)
  • Jae-Sung Roh (Jusung Engineering)
  • Ki-Seon Park (SK Materials)
  • Nae Hak Park (Applied Materials)
  • Jeonghoon Park (Tokyo Electron)
  • Jin-Seong Park (Hanyang University)
  • Hyun-Chul Sohn (Yonsei University)
  • Dongsun Sheen (SK hynix)
  • Marco Lee (Lam Research)
  • Won-Jun Lee (Sejong University)
  • In-Gon Lim (Digital Imaging Technology)
  • Han-Jin Lim (Samsung Electronics)

 

Agenda

Extending Memory and Logic Roadmaps with New Materials and Processes (invited)

Ivo J. Raaijmakers

ASM International

Advanced Process Technologies to Enable Future Devices and Scaling (invited)

Robert D. Clark

Tokyo Electron

Atomic Layer Deposition of Mo and MoNx Films from Chloride-based Molybdenum Precursors

Se-won Lee

Merck

Challenges of High Aspect Ratio Gap Fill Process in the Front-end-of-line Processing

Hyung Chul Kim

SK hynix

Metallization Challenges in 3D NAND (invited)

Raghuveer Makala

Western Digital

Precursors for the Atomic Layer Deposition of Electropositive Metal Films (invited)

Prof. Charles H. Winter

Wayne State University

Interconnect Scaling – Implications & Solutions for RC Delay

Kevin Moraes

Applied Materials

Enabling Device Scaling through Thin Film Stress Control

Alice Hollister

Lam Research

* The agenda will be subject to change without notice

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