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Achieve the Balance of Test Cost, Coverage and Complexity of Advanced Packages and HBM

오후 2:00 - 오후 2:30

The recent breakthrough of 2.5D and 3D wafer level packaging technologies has opened up many new possibilities and challenges from test perspectives. A faster test speed with higher signal performance is needed along with an advance probe card technology that can provide the required signal quality and the ability to successfully probe on TSV micro-bump structure in an ultra-low pitch grid array. High-Bandwidth-Memory and heterogeneously integrated packages continues to evolve and demand more stringent testing requirement in terms of test coverage & speed as well as probing accuracy. This drives up the cost of test and a balance between test coverage versus test cost has become a challenge.

Speaker

nhin quay

Quay Nhin

Senior Product Marketing Manager, FormFactor

Quay Nhin, MBA, joined FormFactor in 2007 and is currently serving as the Technical Product Marketing Manager for the memory products with the focus on emerging HBM and high speed wafer-level test requirement. Quay had held various engineering positions in Technical Support and Field Applications. His areas of interest are in high frequency, signal integrity and power delivery in advanced packaging technologies.

Prior to joining FormFactor, Nhin was an Application Test Engineer for Advanced Power Devices (ADP) which later acquired by Diode Inc. During the time at ADP, Nhin was responsible for device yield analysis and designing application test circuits for device characterization and datasheet publication.