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Metrology and Inspection Forum

2020-02-06 | 오전 10:00 - 오후 7:00
#402

As device technology shrinks to sub-10 nm and moves to 3D architecture, we are facing a lot of challenges in process integration and strong concerns on device reliability monitoring. We believe the role of Metrology & Inspection will be more critical than ever.

In MI Forum 2020, 3 main topics, Alternative MI, Novel Method, and Reliability will be discussed with 12 distinguished speakers. We hope you can get better understanding on MI challenges with solutions and build the strong network with industry leaders in this forum

 

  • 날짜: 2020년 2월 6일(목)
  • 시간: 오전 10:00 - 오후 7:00
  • 장소: 코엑스 4층 402호
  • 언어: 영어와 한국어  (동시통역은 제공되지 않습니다.)​

 

Committee

  • MinChul Kang (Rudolph Technology)
  • Christopher H. Kang (Thermo Fisher Scientific)
  • Chang Woo Kim (KLA)
  • TK Kim (Semilab)
  • Munhong Ro (DB HiTek)
  • Changman Moon (NOVA)
  • Byong Chon Park (KRISS)
  • Yong Jun Park (Samsung Display)
  • Yudong Soe (Nanometrics)
  • Youn Tae Ahn (LUKEN Technology)
  • Hyungwon Yoo (Hitachi High-Technologies)
  • DaeHa Lee (AMETEK Korea)
  • Dongchun Lee (NvisANA)
  • Myungjun Lee (Samsung Electronics)
  • Byoung-Ho Lee (SK hynix)
  • Suk Woo Martin Lee (Applied Materials)
  • Kyle Lee (ASML)
  • Dongchul Ihm (Samsung Electronics)
  • Hyunjin Chang (Auros Technology)
  • Jason Jeong (Nextin)

 

 

등록비

  SEMI 회원사 비회원사 학생
사전등록 (1/29까지) 200,000 원 240,000 원 120,000 원
현장등록 240,000 원 280,000 원 150,000 원

Agenda

Welcome

오전 10:00 - 오전 10:10

Keynote: Machine Learning MI Technology

오전 10:10 - 오전 10:40

[Session 1: Alternative MI] Measurement of Fine Patterns by Utilizing Machine Learning in Semiconductor Industry

Yoonshik Kang

SK hynix
오전 10:40 - 오전 11:10

[Session 1: Alternative MI] A Novel Approach to enable Machine Learning and Deep Learning in Production for Inspection and Metrology

Poh-Boon Yong

KLA
오전 11:10 - 오전 11:40

[Session 1: Alternative MI] TBD

Yu Cao

ASML
오전 11:40 - 오후 12:10

[Session 1: Alternative MI] TBD

오후 12:10 - 오후 12:40

Lunch

오후 12:40 - 오후 2:00

[Session 2: Novel Method] Metrology Based Inspection(MBI): Merged Metrology and Inspection for Advanced Process Control

Jeong-Ho Yeo

Applied Materials
오후 2:00 - 오후 2:30

[Session 2: Novel Method] Broadband Plasma Optical Wafer Inspection Solutions for Monitoring EUV Reticle Defectivity

Andrew Cross

KLA
오후 2:30 - 오후 3:00

Break

오후 3:00 - 오후 3:20

[Session 3: Reliability] An Effective Approach to Monitor Potential Reliability Failure in the Advanced Devices

Sang Hyun Han

NOVA

오후 3:20 - 오후 3:50

[Session 3: Reliability] Application of Optical Second Harmonic Generation for Process Development in Advanced Memory Device Manufacturing

Ming Lei

FemtoMetrix

오후 3:50 - 오후 4:20

[Session 3: Reliability] Quantitative Automated AFM Technologies and Reliability Improvement for Semi Applications

Sang-Joon Cho

Park Systems
오후 4:20 - 오후 4:50

Break

오후 4:50 - 오후 5:10

[Session 3: Reliability] Providing Contamination Monitoring for Yield Enhancement in Semiconductor Process: From Chemical to Wafer

Jung-Hwan Kim

NvisANA

오후 5:10 - 오후 5:40

TBD

오후 5:40 - 오후 6:10

[Session 3: Reliability] Networking Reception

오후 6:10 - 오후 7:00
(Forum attendees are invited to networking reception.)

*상기일정은 사전 안내 없이 변경될 수 있습니다. 

*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.

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