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S5. CMP & Cleaning Technology

2020-02-06 | 오후 1:00 - 오후 6:00
#308

CMP & Surface Cleaning for Emerging Technology

As semiconductor devices are reaching their physical limits, there are still many technical challenges to overcome in the future. Logic device should reduce power even further and increase speed more, DRAM memory still needs to shrink to the extreme limits, and 3D NAND needs to be stacked up higher. To achieve these, CMP process needs to reduce variation more than now, defect size and micro scratch caused by CMP should be further reduced to below 20 nm. Also, CMP must overcome extreme step height to achieve planarity while at the same time productivity should be secured.

Cleaning process has already gone beyond the concept of removing normal defects or by products, and it is challenging the limits against the laws of nature in extreme high aspect ratio. In addition, fume control, damaged layer control, drying, bulk material removal with very high selective chemical and environmental factors should be considered.

To overcome these challenges and discuss the present and future of semiconductor CMP and Cleaning process, to reduce the defects caused by CMP to extremely low levels, to implement ultimate drying technology to overcome surface tension, and to provide insights from Revolution to Evolution, in this session, prominent experts in CMP and Cleaning process have been invited and 11 excellent topics presented by experts in each field will be discussed.

 

  • 날짜: 2020년 2월 6일(목)
  • 시간: 오후 1:00 - 오후 6:00
  • 장소: 코엑스 3층 308호
  • 언어: 영어 (동시통역은 제공되지 않습니다.)​​

 

Committee

  • Kyunghyun Kim (Samsung Electronics)
  • Taesung Kim (Sungkyunkwan University)
  • Ho Youn Kim (DB HiTek)
  • Jin-Goo Park (Hanyang University)
  • Sangwoo Lim (Yonsei University)
  • Yungseok Chung (Tokyo Electron)
  • Haedo Jeong (Pusan National University)
  • Hong, Chang-Ki (Versum Materials)
  • Kyungho Hwang (SK hynix)

 

 

등록비

  SEMI 회원사 비회원사 학생
사전등록 (1/29까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

Agenda

[Session 1: Cleaning] Past, Present and Future of Semiconductor Cleaning Technology (invited)

Takeshi Hattori

Hattori Consulting International
오후 1:00 - 오후 1:40

[Session 1: Cleaning] Challenges for Novel Photoresist Strip

Woogwan Shim

Samsung Electronics
오후 1:40 - 오후 2:00

[Session 1: Cleaning] Post CMP Cleans Evolution and Defect Improvement Approaches

Katrina Mikhaylichenko

Applied Materials
오후 2:00 - 오후 2:20

Break

오후 2:20 - 오후 2:40

[Session 1: Cleaning] Wet Cleaning Challenges in Drying: Present and Future

Harry Yamashita

Tokyo Electron
오후 2:40 - 오후 3:00

[Session 1: Cleaning] New Developments in Semiconductor Process Gas Filtration Efficiency: Capturing the 0.0015 µm Particle

Kevin McGuffin

Mott Corporation
오후 3:00 - 오후 3:20

[Session 2: CMP] Reactive Liquids, non-Prestonian Rates and post-CMP Cleaning (invited)

Prof. Babu Suryadevara

Clarkson University
오후 3:20 - 오후 4:00

Break

오후 4:00 - 오후 4:20

[Session 2: CMP] CMP Rev. to Evo. (Revolution to Evolution)

Manabu Tsujimura

Ebara
오후 4:20 - 오후 4:40

[Session 2: CMP] Investigation of the Mechanism on Decreased Pad Cut Ratio during Tungsten Chemical Mechanical Polishing

HeeJu Kim

SK hynix
오후 4:40 - 오후 5:00

[Session 2: CMP] Effect of Pre-Chemical Treatment on Cu CMP

Sangwon Bahng

SK hynix
오후 5:00 - 오후 5:20

[Session 2: CMP] Innovative Material Solution for Advanced CMP Process

Jeong Yun Yu

Versum Materials
오후 5:20 - 오후 5:40

[Session 2: CMP] Novel CMP Filter Design that Reduces Fine Particles in Slurry Systems

Benjamin Liao

Entegris
오후 5:40 - 오후 6:00

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