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S6. Electropackage System and Interconnect Product

2020-02-06 | 오후 1:00 - 오후 6:10
#317

Packaging Growth through Technology Diversification

The electronics markets were significantly expanded from the computing era based on PC and Internet to the mobility era based on smartphone and 4G, are moving fast to data era based on IoT, AR/VR, AI, Edge computing and 5G. For supporting this trend, every semiconductors area’s involvement, Design-Chip-Packaging-Test, is needed. Especially packaging technology’s flexibility and confrontation-ability will play a particularly important role with packaging as an Advanced-FOWLP using 3D IC and 2.5D IC, MEMS/Sensor, SIP, vertical integration package, and mature package’s advancing. It is challengeable. But this session will be helpful for understanding the new advanced packaging technologies.

 

  • 날짜: 2020년 2월 6일(목)
  • 시간: 오후 1:00 - 오후 6:10
  • 장소: 코엑스 3층 317호
  • 언어: 영어 (동시통역은 제공되지 않습니다.)​​

 

Committee

  • Gu Sung Kim (Kangnam University)
  • Young Bae Park (Andong National University)
  • Min Suk Suh (SK hynix)
  • Luke Son (Applied Materials)
  • Hwadong Oh (Daeduk Electronics)
  • Chris Lee (Hanmi Semiconductor)
  • Kwangjoo Lee (LG Chem)
  • Seh Kwang Lee (Ehwa Diamond)
  • Hanchoon Lee (DB HiTek)
  • Ju-hyuck Chung (Tokyo Electron)
  • Ji Young Chung (Amkor Technology)
  • Soon Jin Cho (Samsung Electro-Mechanics)
  • Hwail Jin (Samsung Electronics)
  • HR Han (ASE)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록 (1/29까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

Agenda

3D System Integration Technologies: Enabling System Technology Co-Optimization (STCO) (invited)

Kenneth June Rebibis

imec
오후 1:00 - 오후 1:40

The Advanced Packaging Solutions of Samsung

Taejoo Hwang

Samsung Electronics
오후 1:40 - 오후 2:00

New Packaging Solution for 5G System Integration

TaeKyeong Hwang

Amkor Technology
오후 2:00 - 오후 2:30

Break

오후 2:30 - 오후 2:50

Co-Design Challenges for Advanced Packaging and 5G Applications (invited)

Prof. Christopher Bailey

University of Greenwich
오후 2:50 - 오후 3:30

Unit Process Challenges of High Density Fanout

Grey Roh

Applied Materials
오후 3:30 - 오후 3:50

Inspection and Metrology Solutions for Large Packages and Fine Pitch Bumps

Cheolkyu Kim

Onto Innovation
오후 3:50 - 오후 4:10

Break

오후 4:10 - 오후 4:30

Advanced Packaging Technologies for High Performance Computing: Challenges and Opportunities (invited)

Jaesik Lee

NVIDIA
오후 4:30 - 오후 5:10

The Big Data Driven Package Process

Sanghoun Oh

SK hynix
오후 5:10 - 오후 5:30

High Performance Package Technology for 5G and AI

Alex Wang

ASE
오후 5:30 - 오후 5:50

Manufacturing High Quality Diffractive Optical Elements(DOEs) Using Nanoimprint Lithography

Eleonora Storace

SÜSS MicroTec Lithography GmbH
오후 5:50 - 오후 6:10

* 상기 일정은 사전 안내없이 변경될 수 있습니다.

* 본 프로그램은 발표자료를 출력하여 제공하지 않습니다. 프로그램 종료 후, 연사 동의를 얻은 발표자료의 다운로드 방법을 안내해드립니다. 

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