MI (Metrology & Inspection) Forum

2026-02-12 | 오전 10:00 - 오후 5:20
#402

 

  • Date: Feb 12(Thu), 2026
  • Time: 10:00-17:20
  • Room: 402, Conference Room (South), 4F, COEX
  • Language: English and Korean (Simultaneous interpretation will NOT be provided.)
  • Registration Fee (KRW)
    • Early Bird: SEMI Members 242,000 / Non-members 308,000 / Student 165,000
    • Onsite: 363,000

 

Committee

  • Christopher H. Kang (Thermo Fisher Scientific)
  • MinKeun Kwak (Auros Technology)
  • Sungsu Kim (KLA)
  • TK Kim (HICS Company)
  • Yong Jun Park (Samsung Display)
  • Minsuk Seo (Camtek)
  • Yudong Soe (Onto Innovation)
  • Chaeho Shin (KRISS)
  • Kyu-Chan Shim (SK hynix)
  • Youn Tae Ahn (LUKEN Technologies)
  • Jeongho Ahn (Samsung Electronics)
  • Kyung-Bae Hwang (ASML)
  • Hyungwon Yoo (Hitachi High-Technologies)
  • DaeHa Lee (AMETEK Korea)
  • Dongchun Lee (Park Systems)
  • Myungjun Lee (Samsung Electronics)
  • Byoung-Ho Lee (Hitachi High-Technologies)
  • Yong-Woon Lim (Nextin)
  • Mansoo Jang (Applied Materials)
  • Sanghyun Han (NOVA) 

Agenda

Emergence and Evolution of Advanced Package Materials

Jihye Shim

Samsung Electronics
오전 10:00 - 오전 10:30
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Overview of Emerging Memory Technologies for Next-Generation Computing

Soo Gil Kim

SK hynix
오전 10:30 - 오전 11:00
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Big Chips, Tiny Chips, and Scaling 3-D System Architectures: A Hybrid Bonding Perspective

Seung Kang

Adeia
오전 11:00 - 오전 11:30
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Process Control in Advanced Packaging

Yoonjoo Kim

KLA
오전 11:30 - 오후 12:00
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Poster Session & MI Forum Reception

오후 12:00 - 오후 2:00
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Applications of High Speed IR and Micro-Bump Metrology for Advanced Packaging of Advanced Memory and Logic Devices

Yu Figer

Onto Innovation
오후 2:00 - 오후 2:30
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Nano Topography Technologies for the Mass Production of Hybrid Bonding Process

Joonho You

Nexensor
오후 2:30 - 오후 3:00
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From Dimensions to Properties: Novel Approaching of E-Beam Technology

Keiichiro Hitomi

Hitachi High-Tech
오후 3:00 - 오후 3:30
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Break

오후 3:30 - 오후 3:50
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Advanced Optical Metrology Solutions for AI Packaging Processes

Fabian Schneider

Nova
오후 3:50 - 오후 4:20
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In-Line 3D SEM Metrology Data for 3D Technology Inflections in Memory, Adv. Packaging and Logic Fabs

Nimrod Shuall

Thermo Fisher Scientific
오후 4:20 - 오후 4:50
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Leveraging Hardware Enabled AI Image Analysis for Rapid 3D X-ray Inspection

Joscha Malin

Comet AG
오후 4:50 - 오후 5:20
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*The agenda is subject to change. 

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