Seungwoo Choi

Dr. SeungWoo Choi has been fellow in Tokyo Electron Korea since 2023 with responsibility of 3D integration. Prior to joining Tokyo Electron Korea, he has worked for Process Development team at Samsung Electronics and EVG for 10 and 6 years respectively. His major field is to develop wafer bonding technologies for 3D integration to apply to not only in fab devices but also advanced package. 

He received his B.S., M.S. and Ph.D. degrees in the Department of Materials Science and Engineering at Korea University in 1997, 1999 and 2003 respectively.