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Haran

Bala Haran

Corporate Vice President, Integrated Materials Solutions, Applied Materials

Bala Haran leads a team of device integrators and process engineers focused on identifying and enabling new inflections in logic and memory technology. His current focus is on integrating Applied Materials' processes and tools to deliver leading-edge performance for nanosheet-based CMOS logic, and next-generation DRAM and 3D NAND devices.

Before joining Applied Materials, Bala worked at IBM for 18 years, where he led multi-company process and device integration teams focused on CMOS technology development and transfer. He holds a Ph.D. in chemical engineering from the University of South Carolina, has authored more than 50 peer-reviewed publications, and holds 100 patents.