Lee Chee Ping is currently the Technical Director for Lam Research. He focuses on advanced packaging segment and now lead the field process teams worldwide on technical engagement and support with leading OSAT customers. In addition, he covers product marketing for the advanced packaging product solution and has been a regular speaker in various conferences.
He has worked at Lam Research since graduation over seventeen (17) years and has held several technical & marketing leadership positions related to front-end fabrications as well as advanced packaging.
Lee Chee Ping received his M.Eng in Technology Management from the University of South Australia, as well as both M.Sc in Financial Engineering and B.Eng in Chemical Engineering from National University of Singapore.
