Seung Jun Lee

Seung Jun Lee received the B.S., M.S. and Ph.D. degree in mechanical engineering from Sogang University, Seoul, Korea, in 2009, 2011 and 2015, respectively. His Ph.D. dissertation was focused on electro-kinetic flow on micro/nano patterned structures and electro-hydrodynamics of ion flow. From 2015 to 2016, He has joined to the University of Illinois at Urbana-Champaign as a post-doc research fellow, where he conducted research about the fabrications of perovskite solar cells and its characterization on flexible substrates. He is a currently Senior Engineer working at the Next generation Patterning P/J, Process Development Team, Samsung Electronics. His main research interest aims the development of next generation Chemical Mechanical Planarization (CMP) technology includes the predictive deep learning algorithm of CMP to enhance the process characteristics.