JiHun Lee

JiHun Lee joined Amkor in 2007 and is currently director of R&D leading the development of new platform technology at Amkor. He previously served as package development project manager for high density fan-out products until assuming his current role in 2018. JiHun has more than 14 years’ experience in semiconductor package development and design including wafer level, flip chip and 2.5D/3D packaging. He holds a MS degree in inorganic industrial chemistry from Konkuk University in Seoul, Korea.