Hyunseop Lee

"Hyunseop Lee" is currently an associate professor of Department of mechanical engineering at Dong-A University. His research fields are CMP, grinding, and polishing of semiconductor materials, and 75 papers related to CMP have been published. “Lee” is also attempting various approaches to improving the sustainability of CMP.

"Lee" is currently vice president of the Precision Processing Committee at the Korean Society for Precision Engineering (KSPE) and member of Korea CMPUGM. He also serves as editor-in-chief of Tribology and Lubricants, associate editor of JMST, and editorial board member of IJPEM and IJPEM-Green Technology.

“Lee” received his bachelor's, master's and Ph. D degrees from Pusan National University, Busan, Korea.

Prior to joining Dong-A University, “Lee” served at Tongmyoung University in Busan, Korea for seven years. He also worked for SK Hynix from 2006 to 2007, and as a postdoctoral researcher at UC Berkeley in 2011.

“Lee” received the Baek-Am Award from KSME, the Busan Future Scientist Award from the Federation of Busan Science and Technology(FOBST), the academic award from the Korea Tribology Society(KTS), and the Science and Technology Award from the Science and Technology Society (KOFST).