Calvin Lee

Calvin Lee is currently the Director of Corporate R&D in ASE, leading the team for research and development of 3DIC technology. He has around 20 years of experience in the Labs of Package Characterization, focuses on 2.5D/3D IC Packaging and the development of Advanced Packaging.

Mr. Lee holds 70 patents and published more than 20 technical publications on electronic packaging during his career at ASE. He received his B.S. degree and M.S. degree in mechanical engineering from Taiwan Cheng Kung University and Sun Yat-sen University.