Jinho An

Jinho An has been serving as an Account Technologist Director in the Advanced Packaging Business Unit of Applied Materials Inc. since 2021.  Before Applied, he worked for over 10 years as a process development engineer at Samsung’s Semiconductor R&D Center and Package Development Team working on advanced packaging technology including TSV and RDL process and product development. During this time, he led the wafer level process development including  CVD, PVD, wet clean, Dry Etch, Cu ECP, CMP, and photolithography. Jinho An has a B.S. in Inorganic Materials Engineering from Hanyang University and a Ph.D. in Materials Science and Engineering from the University of Texas at Austin.