Dong Seup Lee

Dong Seup Lee is a semiconductor technologist and currently works in Texas Instruments (TI) as device and process integration engineer for GaN power device technology as well as high voltage BiCMOS technology. He joined TI in 2014 and has made major contributions on 600V-class Depletion-mode/Enhancement-mode GaN technology development, reliability improvement, and successful qualification & production. 

He received M.S. degree in Electrical Engineering from Seoul National University, Korea in 2009 and Ph.D. degree in Electrical Engineering and Computer Science from MIT in 2014. He has researched various semiconductor devices including advanced CMOS, tunneling FETs, single electron transistors, GaN-based RF amplifiers and high voltage power devices. He has authored or coauthored more than 30 papers in technical journals and international conferences as well as numerous patents. Also, he has been a reviewer for various major journals such as EDL, TED and JAP. He was a technical committee member on power devices and compound semiconductor high speed devices in IEDM conference in 2018 and 2019.