Eung Chang Lee

Dr. Eung Chang Lee currently serves as a Principal engineer in the Business Development Team as AVP, Samsung Electronics. His role encompassed thermal management and pathfinding in technology-related advance packages, chiplets, and HBM. Dr. Lee joined Samsung Electronics in 2009 as an R&D engineer, focusing on semiconductor packaging. He earned his Ph.D. degree in the field of thermal management of semiconductor packages from the Korea Advanced Institute of Science and Technology (KAIST), Korea. Dr. Lee has authored 7 journal and conference papers and holds over 20 patents related to semiconductor packages.