Alain Phommahaxay

Alain Phommahaxay, Ph.D. is currently R&D Manager if the Material Transfer and Assembly group in the Unit Process Module organization of imec. He joined imec in 2008 as R&D Engineer dealing with MEMS wafer-level-packaging. In 2010, he transitioned to a process development role and became responsible for the introduction and development of 300mm wafer bonding and debonding technologies. As such he performed R&D activities within the 3D System Integration program in the field of temporary wafer bonding and debonding, thin substrate handling and permanent wafer bonding.

In 2019 he has been appointed team leader of the Bonding, Thinning and Assembly team dealing with process development in the field of Wafer-Level-Packaging, incl. die to wafer hybrid bonding and FOWLP.

He is now R&D manager since 2021 and is overseeing the development processes enabling heterogeneous material-co integration with direct applications in field ranging from system in package integration to next generation CMOS devices.

Alain Phommahaxay received a master degree in electronics from the Université Pierre et Marie Curie in Paris in and another one in electrical engineering from ESIEE Paris in 2004. The same year he began a doctorate thesis dealing with the design, fabrication and testing of high power microwave limiter for radar application. He obtained his PhD in 2007 from the Université de Marne la Vallée. During this period he acted as teaching assistant in Signal Processing, Optical Communication and Semiconductor manufacturing for graduate students.