Seung Chul Han

“SeungChul Han”, has been developing package technology for 9 years at SK Hynix as an R&D engineer in charge of TB/DB and CMP process for 6 years and advanced package TD for 3 years. Prior to joining SK Hynix, he worked at Amkor for five years as an R&D engineer. During his 5 years at Amkor, he spent time developing TSV backside processes like TB/DB, wafer backgrinding and CMP process for 2.5D interposer.

He received a Master’s degree in new material science and engineering from Korea university, Seoul, South Korea, his study theme during Master’s degree was the increase of wear resistance through the formation of Al2O3 coated by PEO(Plasma Enhanced Oxidation). A Bachelor's degree in new material science and engineering from Seoul National University of Science and Technology, Seoul, South Korea.