Ji-hoon Choi
CEO, AQLASER
25 Years of Micro-Laser Application Expert in Semiconductor, Advanced- Packaging & Display Industry.
Bachelor in ME & Masters in Physics at Chungnam National University of Korea
Display System Engineer at SEMES (A Samsung Affiliate)
Laser Application Engineer at JASTECH, (KOSDAQ)
- Developed World’s 1st Laser Bonding System for Wafer Probe Card
Laser Application Group Leader at SoulBrain System (KOSDAQ)
- Developed Laser Cutting / Patterning / Repair Systems as a team leader
Laser Application Division Leader at DIT (KOSDAQ)
- Developed IGBT Annealing, Glass Cutting & Waterjet System for Samsung
Co-founder of Jeongwon Tech (2009)
- Developed and Launched World’s 1st Laser Bonder for Wafer Probe-card Inspection
- Developed Korea’s 1 st Laser Jetting System for Flip-chip Package Solderball Process
- Developed World’s 1 st TC Bonder for HBM Module (Co-developed with AMKOR)
- Developed World’s 1 st Selective Laser Reflow System for Flip-chip packages (Sold to AMKOR)
Founder of AQLASER (2016)
- Leading Various Micro Laser Application Projects with Global Toptier US / Korea / Taiwan Customers