Ilseok Son

Ilseok Son (Sunny) is currently the 3D Interconnect and Heterogenous Integration Manager and member of technical staff at TEL technology Center America (TTCA) one of the largest R&D centers for TEL outside of Japan. One of his key focus is on scaling copper hybrid bonding technologies.

Sunny received Ph.D. in electrical engineering at UW- Madison working on MEMS and started his career at Intel, covering Lithography process & equipment, Mask Inspection Wafer Bonding (temporary & permanent) process & equipment development, Layer transfer integration at Intel Component Research. During his Intel career Sunny was recognized by receiving the Intel Achievement Award for a novel interconnect architecture and technology for advanced nodes. Later, he moved to South Korea to join at SK hynix as R&D center metrology manager to provide metrology solutions for memory development.  He later built a new team for wafer bonding and worked as a manager and a tech leader to apply hybrid bonding in memory architectures until he joined TTCA.

Sunny’s work on hybrid bonding has been presented at several conferences including ECTC, IMAPS, SEMI 3DI, IITC and IEDM.