Sanghyuk Lim

“SAGNHYUK LIM”, Ph.D. has been package engineer position at SK Hynix for 10 years with responsibility for development of molded underfill as well as capillary underfill for wafer level as mold process and material engineer, development of hybrid bonding process for chip to wafer bonding, and development of HBM product for HBM3E 8Hi, 12Hi and 16Hi.  

LIM received a Ph.D. degree in fluid mechanics, especially rheology from Seoul National University, South Korea. His research theme was about migration behavior and microstructure formation for particulate system during drying process.