Prof. Gu-Sung Kim

Gu-Sung Kim, Ph.D., Th.M. is currently a faculty position at Kangnam University and a founder of EPRC (Electronics Packaging Research Center).  He had 34 years experiments for R&D of Semiconductor Packaging. Prior to joining and establishing lecture/research position, Kim was a 3D IC/TSV/WLP project leader for Samsung Electronics Co., Ltd, IPT team, Memory Division during 17 years. He has more 130 Patents as an inventor in Korea and USA related 3D IC, TSV, and Interposer. He published 2 semiconductor packaging handbooks and presented more 100 as a speaker and talk. He received several awards from Korea government, Society, Samsung, KSIA, SEMI, and Alfred Marquis Lifetime etc.

Kim received a Ph.D. degree in materials engineering from Rensselaer Polytechnic Institute, Troy, NY, USA., a BS degree in ceramic engineering from Yonsei University, Seoul, Korea., a Th.M. degree in practical theology from Kangnam University, Yongin, Korea. 

Currently, He serve a member of Board-of-Governors (BoG) of IEEE EPS (eps.ieee.org), chair of IEEE EPS Korea Council (EP21, www.ieee-epskorea.org). vice-chair of KSDT (Korea Semiconductor Display Technology Society), deputy-chair of EPRC, and Technical Director at KMEPS (Korea Microelectronics and Packaging Society). He also has a position of chair of board at Electro-Package Mission Society (www.epcross.org), technical committee of Korea industrial technology security agency, SEMI STS, and Semiconductor Korea Symposium.