Taejoo Hwang

“Taejoo Hwang”, Ph.D. has been a principal engineer at Samsung electronics corp. for 18 years with a 3D packaging solution engineer.

”Hwang” received a Ph.D. degree in TSV wafer bonding and MEMS packaging from Rensselaer Polytechnic Institute, Troy, NY, U.S and a master degree in micro-robotics from Korea university, Seoul, South Korea.