Hyosang Lee

Dr. Hyosang Lee is a Director CMP Applications at Fujifilm Electronic Materials Inc. and has more than 22 years of experience in the semiconductor industry area. Dr. Hyosang Lee received his Ph.D. in chemical engineering from the University of Arizona in 2008. After graduation, he joined Novellus in 2008 and worked as a process engineer in the CMP and Electrofill business divisions, where he led the development of processes and additive chemistries to enable a bottom-up Cu filling process for TSV applications. In 2012, Dr. Hyosang joined Electronic Materials and has worked as an engineer, manager, and director for 12 years and continue to develop new slurry platforms for BEOL, MOL, FEOL, p-CMP and packaging applications.