[Presentations (Moderator: Prof. Yoon-Jong Lee, KAIST)] Prospect of Memory Devices in AI Generation

1:50 pm - 2:15 pm

Modern computing systems are increasingly bottlenecked by frequent data movement between compute and memory. To address this, AI training is driving wider adoption of High Bandwidth Memory (HBM). Recently, High Bandwidth Flash (HBF) has gained attention by offering HBM-like bandwidth with 8–16× higher capacity, making it a potential complement or partial replacement for HBM in AI inference. This shift could extend HBM process technologies such as TSVs and die stacking to HBF, expanding related process and equipment markets.

In parallel, CNM and CIM approaches that mitigate von Neumann limitations are attracting interest under strong low-power demands, potentially starting from custom HBM and evolving into next-generation AI devices. For inference, Analog CIM (ACIM) is promising for energy-efficient matrix–vector multiplication, but emerging-memory-based ACIM (RRAM/PCM/STT-MRAM/FeRAM) faces weight reliability issues due to nonlinearity and stochasticity. 3D NAND–based ACIM may offer advantages in stability, density, and manufacturing maturity.

Featured Speakers

Sun-Ghil Lee

CTO, Tokyo Electron Korea

Dr. Sun-Ghil Lee earned his Ph.D. in 1998 from KAIST (Department of Physics, Solid-State Theoretical Physics Lab.). From 1998 to 2002, he worked at Hyundai Electronics in the TCAD team, focusing on DRAM development. He then joined Samsung Electronics (2003–2012) in the Process Development team, where he contributed to FEOL process development for DRAM, Flash, and Logic technologies.

From 2012 to 2015, Dr. Lee served as the Samsung team’s on-site manager at imec in Leuven, Belgium. He returned to Samsung Electronics in 2015 and worked in the Logic TD team (2015–2017), supporting 7nm technology development.

Since 2017, he has been with Tokyo Electron (TEL), holding roles across Tokyo Electron Korea, TEL Technology Solutions in Yamanashi, Japan, and TEL Technology Center America in Albany, NY, USA (2017–2024). He is currently (2024–present) the Technology Division Manager at Tokyo Electron Korea.