Kenneth June Rebibis

Kenneth June Rebibis, has been working in Imec Belgium for the last 10 years and is currently the Program Manager for 3D Bilateral Development Work. Before holding this position, he was the 3D Assembly Integration Team Leader who help developed the different assembly modules such as Thinning (on carrier system), backside/frontside RDL/Bumping/Microbumping, preassembly, Die-to-Die/Die-to-Wafer TCB and hybrid stacking and 3D packaging.

Prior to joining Imec Belgium, Mr. Rebibis was Staff Engineer for Infineon Technologies and Qimonda Memory. During his 5 years at Infineon and Qimonda, he was in-charge if developing flip chip packaging for memory devices. Prior to working in Infineon and Qimonda, he worked as team leader and senior engineer for 10 years in different OSATs, namely Amkor Technologies (Philippines), United Test and Assembly Center (Singapore and Taiwan) and STATSChippac (in Singapore), were his primary task was to develop flip chip and wirebonded packages.

Mr. Rebibis received a Bachelor’s degree in Mechanical Engineering from Mapua Institute of Technology, Manila, Philippines. Mr. Rebibis is also author and co-author of several patents and publications.