Buvna Ayyagari-Sangamalli

Buvna Ayyagari-Sangamalli heads Design Technology at Applied Materials. With a career spanning Design Engineering, developing Low-Power Design Methodologies, designing EDA Design Flows, and leading Interface IP Engineering & IP Subsystems Development, she is intimately familiar with today’s chip design challenges. At Synopsys, she played a pivotal role in growing the company’s IP business, along with managing global, multi-site, multi-function IP Customer Applications & Subsystems Engineering teams for AI, Automotive, IoT and other segments. Previously, she played a critical role in defining low-power EDA and design methodologies. At Intel, she worked on various mobile and desktop processor chips. Currently, she heads Design Technology at Applied, where her charter is to enable rapid design prototyping of material and process innovations for AI applications. Her well-rounded 20 years in the semiconductor industry straddles Architecture, Design, EDA and IP -- and is currently being deployed at Applied Materials, connecting the industry from materials to systems.