Grey Roh

Grey Roh is KAT of wafer level packaging (WLP) for the Plating, Packaging, and Cleans (PPC) business unit of Applied Materials. As KAT, he has the responsibility of supporting technical aspects of existing tools and processes, conducting customer technology reviews, and looking forward to solutions for inflection-driven customer issues.

Grey worked in conventional lead frame and BGA packaging at LG Semicon and Signetics Korea for 10 years prior to join Applied Materials. He has led wafer level plating as WLP, damascene, and TSV plating applications since he has joined Applied Materials in 2008.

Grey received his BA in Machine Design and Automation Engineering from SEOULTECH university.