Subsessions
9:00 am
Advanced Semiconductor Packaging Technology : Overview
Prof. Hak-Sung Kim
Hanyang University
9:00 am - 10:15 am
ALD Fundamentals and Recent Advances: From Precursors to Equipment
Prof. Won-Jun Lee
Sejong University
9:00 am - 10:15 am
Fundamentals of Plasma Etching
Prof. Geun Young Yeom
Sungkyunkwan University
9:00 am - 10:15 am
9:30 am
Open Remark (GES key takeaway- Call to Action)
Decarbonization as a Shared Strategic Priority for the Semiconductor Supply Chain
Saifi Usmani
SEMI
9:30 am - 9:40 am
9:40 am
9:50 am
9:55 am
SCC Baseline Ambition Roadmap (BAR) WG
Developing science-aligned emissions reduction targets for the semiconductor industry
Prannoy Chowdhury
Carbon Trust
9:55 am - 10:15 am
10:00 am
CMP – The Hidden Architect in the Advanced Packaging Era
Kevin Vandersmissen (invited)
imec
10:00 am - 10:40 am
Development Status and Future Prospects of Lithography Equipment
Hyoung-Kook Kim
ASML
10:00 am - 10:50 am
Emergence and Evolution of Advanced Package Materials
Jihye Shim
Samsung Electronics
10:00 am - 10:30 am
10:05 am
[Keynote] Physical AI for Dark Factories: Sim-to-Real Orchestration of Heterogeneous Robot Fleets Using Digital Twin Intelligence
Prof. Young Jae Jang (invited)
KAIST
10:05 am - 10:40 am
10:15 am
10:20 am
Beyond ZFLOPS: What's Next?
Architecting the Future of AI Systems
Jaihyuk Song
Samsung Electronics
10:20 am - 10:40 am
10:25 am
1000x More Efficient On-Device AI: Powering AR/VR, Humanoid Robotics, and Beyond
Jaejun Lee
AnalogAI
10:25 am - 10:35 am
10:30 am
Advanced Semiconductor Packaging Technology : Recent Trends
JaeDong Kim
JD Technology
10:30 am - 11:45 am
Epitaxy Engineering in Advanced Semiconductor Devices
Prof. Dae-Hong Ko
Yonsei University
10:30 am - 11:45 am
Overview of Emerging Memory Technologies for Next-Generation Computing
Soo Gil Kim
SK hynix
10:30 am - 11:00 am
Various Reliability Issues in DRAM cell transistors
Junsoo Kim
Samsung Electronics
10:30 am - 11:45 am
10:35 am
From Data Gravity to Data-Centric Intelligence: Redefining the Future of AI Infrastructure
Jin Kim
XCENA
10:35 am - 10:45 am
10:40 am
[Keynote] Advancing Autonomous Fabs: PM Automation & Standardization Strategy
Youbean Kim (invited)
Myongji University
10:40 am - 11:15 am
10:45 am
10:50 am
10:55 am
Ease on Three-Dimensional Memory and Logic Integration
Jekyung Kim
FS2
10:55 am - 11:05 am
11:00 am
Big Chips, Tiny Chips, and Scaling 3-D System Architectures: A Hybrid Bonding Perspective
Seung Kang
Adeia
11:00 am - 11:30 am
Building Scalable Infrastructure for the AI Factories of Tomorrow: Cadence’s End-to-end Approach
Boyd Phelps
Cadence Design Systems
11:00 am - 11:20 am
Scope 3 Decarbonization
Collaboration and Partnership across the Value Chain
In San Park
SK Siltron
11:00 am - 11:15 am
11:15 am
Advanced Liquid Cooling Solution for Next Generation AI Semiconductor
Yunhyeok Im
KoolMicro
11:15 am - 11:25 am
Considerations for Realizing Autonomous Manufacturing by AX
KyeungTai Kim
Miracom
11:15 am - 11:40 am
Proactive Yield Maximization in Photolithography via Human-in-the-Loop AI on an On-Premise Big Data Platform
Jeng-Hun Suh
SemiAI
11:15 am - 11:40 am
Surface Preparation Challenges in 3D Integration
Philippe Garnier (invited)
STMicroelectronics
11:15 am - 11:55 am
11:20 am
11:25 am
11:30 am
11:35 am
11:40 am
Renewable Energy Procurement Guideline in the Korea market
Jeongseok Lee
Korea Energy Agency
11:40 am - 1:10 pm
The Inflection Point has arrived: Driving Innovation towards Future of Memory Technology
Sunghoon Lee
SK hynix
11:40 am - 12:00 pm
11:45 am
11:50 am
11:55 am
12:00 pm
12:05 pm
12:15 pm
12:20 pm
Overview of Market Trends in the Semiconductor Materials Industry with Focus on CMP Consumables
Andy Tuan
Linx Consulting Inc. / SEMI
12:20 pm - 12:45 pm
12:25 pm
Autonomous Process Control for Advanced Semiconductor Fabs
Seungchoun Choi
Amously
12:25 pm - 12:35 pm
12:35 pm
12:55 pm
Robust O/L Control Limitations Imposed by the CMP Process
Hyeokjung Lee
SK hynix
12:55 pm - 1:20 pm
1:00 pm
Advanced embedded memory technology for generative AI development at the edge
Gouri Sankar Kar (invited)
imec
1:00 pm - 1:40 pm
Future Advanced Package Solutions for HPC/AI Applications
Hyun Chul Jung
Samsung Electronics
1:00 pm - 1:25 pm
High-NA EUV Lithography at the Turning Point: Preparing for Industry Insertion
Geert Vandenberghe
imec
1:00 pm - 1:40 pm
SiC and GaN Devices in the Mainstream - Achievements, Challenges and Perspectives
Prof. Nando Kaminski (invited)
University of Bremen
1:00 pm - 1:40 pm
[Presentations (Moderator: Prof. Yoon-Jong Lee, KAIST)] The Present and Future of K-AI Semiconductors
Prof. Hoi-Jun Yoo
KAIST
1:00 pm - 1:25 pm
Transformational Plasma Etch Technologies Enabling Ultra Fine Pitch Patterning
Gowri Kamarthy
Lam Research
1:00 pm - 1:25 pm
1:05 pm
Breaking Barriers, Building Careers: A Woman in Semiconductors
Gwen Lee
Lam Research
1:05 pm - 1:20 pm
1:10 pm
Renewable Energy Procurement and Supply Chain Management through Digital Marketplace
Mingi Lim
CnerG
1:10 pm - 1:25 pm
1:20 pm
1:25 pm
Complex Memory Systems for the Agentic AI Era: HBM-HBF-SOCAMM
Prof. Joungho Kim
KAIST
1:25 pm - 1:50 pm
Velocity and Precision Advancing Plasma Etching for AI-Driven Scaling
Sang-Jun Choi
Applied Materials
1:25 pm - 1:50 pm
VFO Packaging for High Performance On-Device AI systems
Ki Jun Sung
SK hynix
1:25 pm - 1:50 pm
1:30 pm
Advanced Packaging as a Platform: Enabling the Future Architecture of Semiconductors
Jan Vardaman
TechSearch International
1:30 pm - 2:00 pm
From Reactive to Predictive: AI-Driven Optimization for Automated Test Equipment (ATE) Performance and Reliability
Wai-Kong Chen
Cohu
1:30 pm - 2:00 pm
Manufacturing AI Solutions for Engineering Automation
Ki Chul Yang
BISTelligence
1:30 pm - 1:55 pm
The Reduction of Surface Defect of SiC Epitaxy by Improved in-situ Etching Process
Han Seok Seo
Research Institute of Industrial Science & Technology
1:30 pm - 2:00 pm
1:35 pm
1:40 pm
Innovative Techniques for High NA EUV: Achieving Robustness in Patterning
Hongik Kim
SK hynix
1:40 pm - 2:05 pm
Next-Generation 3D-NAND Device and Process Technology
Yoohyun Noh
SK hynix
1:40 pm - 2:05 pm
1:50 pm
Enabling 3D-IC and Advanced Packaging through Plasma Dry Etch Technologies
Jeongsoo Kim (Invited)
imec
1:50 pm - 2:30 pm
From Silicon to Systems: Advanced Packaging enabling AI Performance Scaling
Audrey Charles (invited)
Lam Research
1:50 pm - 2:20 pm
[Presentations (Moderator: Prof. Yoon-Jong Lee, KAIST)] Prospect of Memory Devices in AI Generation
Sun-Ghil Lee
Tokyo Electron Korea
1:50 pm - 2:15 pm
1:55 pm
2:00 pm
8 inch SiC Epitaxial Technology and Industrial Application
Larkin Kong
Hangzhou Haiqian Semiconductor
2:00 pm - 2:30 pm
AI Propels Semiconductor Industry – What Lies Ahead
Gaurav Gupta
Gartner
2:00 pm - 2:30 pm
AI-powered paradigm shift: Unlocking the Next Wave of Innovation in the Semiconductor Industry
Changho Jin
SK Encore
2:00 pm - 2:30 pm
Applications of High Speed IR and Micro-Bump Metrology for Advanced Packaging of Advanced Memory and Logic Devices
Yu Figer
Onto Innovation
2:00 pm - 2:30 pm
CMP Fundamentals for 3D Integration
Prof. Taesung Kim
Sungkyunkwan University
2:00 pm - 3:15 pm
Regulatory Response Strategies from the Viewpoint of Customer Needs
Hyuk Hwa Kwon
SK hynix
2:00 pm - 2:25 pm
[Session 1: Semiconductor Ecosystem in the Netherlands and Korea] Opening & Greeting
2:00 pm - 2:05 pm
2:05 pm
Market Overview and U.S. Investment Climate
Donghwan Lee
Boston Consulting Group
2:05 pm - 2:35 pm
[Keynote] Proactive Security Response: Mitigating Supply Chain Security Risks through Practical Drills
Yongpil Lee
Korea Internet & Security Agency (KISA)
2:05 pm - 2:30 pm
[Session 1: Semiconductor Ecosystem in the Netherlands and Korea] Congratulatory Remark
Aukje de Vries
Minister for Foreign Trade and Development
Jong Myeong Lee
Samsung Electronics
2:05 pm - 2:10 pm
2:10 pm
2:15 pm
2:20 pm
Intelligent ALD—Real-Time Prediction, Anomaly Detection, and Recipe Optimization
Jeff Kim
SurplusGLOBAL
2:20 pm - 2:45 pm
MPDU (Modular Power Delivery Unit) – Intel System Level Test Platform Power Delivery Solution tailored for Manufacturing Test Environment
Syed Hussein SYED ALWI
Intel
2:20 pm - 2:50 pm
[Session 1: Semiconductor Ecosystem in the Netherlands and Korea] Status of Korea Semiconductor Industry
Jaemin Jun
Korea Semiconductor Industry Association
2:20 pm - 2:30 pm
2:25 pm
Accelerating Semiconductor Roadmaps: The Role of AI-Driven
Ron Pearlstein
Merck
2:25 pm - 2:50 pm
Embedded Memory for Future Edge Computing
François Andrieu (invited)
CEA-Leti
2:25 pm - 3:05 pm
[Presentations (Moderator: Prof. Yoon-Jong Lee, KAIST)] From Chip War to AI War
Seung-Woo Lee
Eugene Investment & Securities
2:25 pm - 2:50 pm
The Evolution of EUV Resists and Semiconductor Scaling: A Technical Retrospective and Future Outlook
Ken Maruyama
JSR Corporation
2:25 pm - 2:50 pm
2:30 pm
Current Status of Ga₂O₃ Single Crystal Growth Technology for Next-Generation Power Semiconductor Applications
Jinki Kang
AXEL
2:30 pm - 3:00 pm
Nano Topography Technologies for the Mass Production of Hybrid Bonding Process
Joonho You
Nexensor
2:30 pm - 3:00 pm
[Keynote] Supply Chain Integrity: A Fabless Manufacturing Perspective
Dan O'Loughlin
Qualcomm
2:30 pm - 2:55 pm
2:35 pm
2:40 pm
2:45 pm
2:50 pm
Architecting Epitaxial Precision for Advanced Node Scaling
Yi-Chiau Huang
Applied Materials
2:50 pm - 3:15 pm
Design-Aware Post-Si Data Analysis Methodology: Links with DFT Design, ATE Test and FA works
Jeongsu Park
Synopsys
2:50 pm - 3:20 pm
Domain Knowledge-Driven Fusion Machine Learning for Overlay Prediction Enhancement
Taekwon Jee
SemiAI
2:50 pm - 3:15 pm
[Presentations (Moderator: Prof. Yoon-Jong Lee, KAIST)] Memory Reimagined: From High-Bandwidth to In-Memory Processing
Kyomin Sohn
Samsung Electronics
2:50 pm - 3:15 pm
Next-Generation Etch Chemistry for the AI Era: Performance & Sustainability Enabled by Merck’s End-to-End Innovation
Sung-Ho Kim
Merck
2:50 pm - 3:15 pm
The AI Data Center Boom: Facts, Fundamentals, and Implications for the Semiconductor Industry
Donghwan Lee
Boston Consulting Group
2:50 pm - 3:20 pm
2:55 pm
Ohio's Burgeoning Semiconductor & Microelectronics Ecosystem
Justin Kocher
JobsOhio
2:55 pm - 3:05 pm
Semiconductor Manufacturing Cybersecurity Consortium (SMCC) Overview
Kimberly Daich
PDF Solutions
2:55 pm - 3:20 pm
[Session 2: EUV Technologies and Metrology] Developing EUV Mask Metrology for High-Volume Manufacturing
Byung Gook Kim
ESOL
2:55 pm - 3:05 pm
3:00 pm
3:05 pm
3D NAND Flash Evolution: Challenges and Opportunities for the Future
Sangyong Park
Samsung Electronics
3:05 pm - 3:35 pm
AI-Empowered Digital Twin for Multi-FAB Simulation
Prof. Sang Chul Park (invited)
Ajou University
3:05 pm - 3:30 pm
New Jersey at the Forefront of Innovation
Bill Noonan (video recording)
Choose New Jersey
3:05 pm - 3:15 pm
[Session 2: EUV Technologies and Metrology] Semiconductor / EUV Lithography and Related MI technology, Synchrotron Science
Sangsul Lee
Postech/Xavis Optics
3:05 pm - 3:15 pm
3:10 pm
Advanced Packaging Market & Technology Trends - Focus on Glass
Bilal Hachemi (video recording)
Yole Group
3:10 pm - 3:35 pm
High Power Semiconductor Markets and Evaluation Method
Hyemin Kang
Korea Institute of Energy Technology(KENTECH)
3:10 pm - 3:40 pm
3:15 pm
Applications of Ion Implantation Technology for Scaling Down Advanced Devices
KyungWon Lee
Axcelis Technologies
3:15 pm - 3:40 pm
Environmentally Sustainable Plasma Etching of SiO2 using Fluorinated Ethers with Low Global Warming Potentials
Prof. Chang-Koo Kim (invited)
Ajou University
3:15 pm - 3:45 pm
High Throughput Digital Lithography Development Enables AI and HPC Device Integration
Ksenija Varga
EV Group
3:15 pm - 3:40 pm
Tennessee’s Semiconductor Supply Chain Advantage
Hee-jung Shin
State of Tennessee Korea Office
3:15 pm - 3:25 pm
[Presentations (Moderator: Prof. Yoon-Jong Lee, KAIST)] The Role of Semiconductor Packaging in the AI Era: Innovations in Advanced Packaging Technologies Accelerating the AI Era
Kangwook Lee
SK hynix
3:15 pm - 3:40 pm
3:20 pm
SEMI Market Outlook - Semiconductor Equipment Forecasts, Fab Investment and Material Market Outlook
Clark Tseng
SEMI
3:20 pm - 3:50 pm
SMCC WG9: Expanding Cybersecurity Collaboration in South Korea & Standardized Semiconductor Cyber Assessment (SSCA): A Unified Approach to Supply Chain Security
Suk Won Kang
Applied Materials
3:20 pm - 3:45 pm
3:25 pm
3:30 pm
Run-to-Run Control Automation in CMP Enabled by a Production-Oriented Digital Twin
Seungchoun Choi
Amously
3:30 pm - 3:55 pm
Understanding of Particle Removal and Surface Preparation for 3D Integration Era
Prof. Tae-Gon Kim
Hanyang University
3:30 pm - 4:45 pm
[Session 3: Material & Equipment Development] Opportunities for Cooperation in the SoBuJang Field of Semiconductors
Hakkyung Sung
SoBuJang Technology Collaboration Forum
3:30 pm - 3:40 pm
3:35 pm
Atomic Layer Deposition Processes for Future Extremely Scaled Semiconductor Devices
Chang-Yong Nam (invited)
Brookhaven National Laboratory
3:35 pm - 4:15 pm
Challenges of Energy Policy in Korea from the Perspective of Industrial Competitiveness
Prof. Sangjun Lee
Seoul National University of Science and Technology
3:35 pm - 4:00 pm
3:40 pm
Accurate Transient Current Measurement for AI Processor Power Characterization
Justin(Jeong-Tae) Kim
Keysight Technologies
3:40 pm - 4:10 am
[Session 3: Material & Equipment Development] Introduction of LGE PRI (Semiconductor Equipment)
Joo Won Lee
LG Electronics PRI
3:40 pm - 3:50 pm
3:45 pm
3:50 pm
Advanced Optical Metrology Solutions for AI Packaging Processes
Fabian Schneider
Nova
3:50 pm - 4:20 pm
[Panel Discussion] Current Status and Outlook of AI and AI Semiconductor Technologies
Moderator: Prof. Wooyeong Cho | KAIST
Prof. Hoi-Jun Yoo
KAIST
Prof. Joungho Kim
KAIST
Sun-Ghil Lee
Tokyo Electron Korea
Seung-Woo Lee
Eugene Investment & Securities
Kyomin Sohn
Samsung Electronics
Kangwook Lee
SK hynix
3:50 pm - 5:00 pm
[Session 3: Material & Equipment Development] Success factors for Contract Engineering; a Dutch perspective
Sven Pekelder
Settels Savenije
3:50 pm - 4:00 pm
3:55 pm
4:00 pm
Advanced Logic Patterning Process for High-NA Lithography
Heeyoung Koh
Samsung Electronics
4:00 pm - 4:25 pm
Challenges and Innovations in Advanced Interconnect Metallization
Juhyun Kim
Samsung Electronics
4:00 pm - 4:25 pm
[Session 3: Material & Equipment Development] Horizontal Integration Partner for Semiconductor Equipment Development
Dongha Kim
Prodrive Technologies
4:00 pm - 4:10 pm
4:05 pm
4:10 pm
Addressing Semiconductor Cybersecurity Challenges through Robust Industry Standards and Globally Secure Frameworks
Alan Weber
PDF Solutions
4:10 pm - 4:35 pm
Evolving Test Distribution in the Age of AI
Fabio Pizza
Advantest Europe
4:10 pm - 4:40 pm
[Session 3: Material & Equipment Development] Predicting Device-Relevant Properties in ALD and ALE via Multiscale Surface-to-Device Simulation
Fedor Goumans
Software for Chemistry & Materials
4:10 pm - 4:20 pm
4:15 pm
4:20 pm
4:25 pm
Engineering Capacitance Reduction in Advanced Logic and Memory Technology
Erik A Edelberg
Lam Research
4:25 pm - 4:50 pm
[Session 4: New Device] Status for DBH SiC/GaN Technology development
Sang Gi Lee
DB Hitek
4:25 pm - 4:35 pm
4:30 pm
VNAND HARC Etching’s Yesterday, Today, and Tomorrow
Hoki Lee
Samsung Electronics
4:30 pm - 4:55 pm
4:35 pm
Advanced Interconnects Enabling 2.5D and 3D Packaging
Ravi Pokhrel
Qnity Electronics
4:35 pm - 5:00 pm
Next Generation DRAM with Oxide Semiconductor (IGZO) and Cell Structure
Min Hee Cho
Samsung Electronics
4:35 pm - 5:00 pm
Three Foundational Security Strategies for a Sustainable Semiconductor Industry: Training, Encryption, and Backup
Bongho Kang
Fasoo
4:35 pm - 5:00 pm
[Session 4: New Device] Photonics Integrated Circuit
Dongjae Shin
imec Netherlands
4:35 pm - 4:45 pm
4:40 pm
4:50 pm
Advanced Logic Technology as a Backbone of the New Era of Computing
Kisik Choi (Invited)
IBM
4:50 pm - 5:30 pm
Leveraging Hardware Enabled AI Image Analysis for Rapid 3D X-ray Inspection
Joscha Malin
Comet AG
4:50 pm - 5:20 pm
Navigating Overlay Metrology Challenges: High-NA Lithography, Backside Bonding, Advanced Packaging, and the Road to Massive Sampling
Nadav Gutman
KLA Corporate
4:50 pm - 5:15 pm
4:55 pm
Non-Sinusoidal-Waveform for High Aspect Ratio Etching
Dong-Hun Kim
SEMES
4:55 pm - 5:20 pm
5:00 pm
Advancing Materials and Integration Technologies for Next-Generation Ferroelectric Devices
Ganesh Panaman
Intermolecular
5:00 pm - 5:25 pm
Plasma-free Hydrophilic Bonding for Wafer to Wafer and Die to Wafer 3D and Photonic Applications
Frank Fournel
CEA LETI
5:00 pm - 5:25 pm
Proven Best Path to Secure Resilient Semiconductor Manufacturing in the Era of AI
Toru Takahashi
TXOne Networks
5:00 pm - 5:25 pm
5:05 pm
Industrial Autonomy in the Era of Physical AI: Building the Autonomous Fab Stack
Jonghwan Lee (invited)
NVIDIA
5:05 pm - 5:30 pm
5:20 pm
3D Nanopatterning Using Ion Beam Etching
Denis Joschko
scia Systems GmbH
5:20 pm - 5:45 pm
Wednesday, February 11, 2026
9:00 am
10:20 am
Keynote Speech #1
Wednesday, February 11 | 10:20 am - 10:40 am
Auditorium, 3F, COEX
10:40 am
Keynote Speech #2
Wednesday, February 11 | 10:40 am - 11:00 am
Auditorium, 3F, COEX
11:00 am
Keynote Speech #3
Wednesday, February 11 | 11:00 am - 11:20 am
Auditorium, 3F, COEX
11:20 am
Keynote Speech #4
Wednesday, February 11 | 11:20 am - 11:40 am
Auditorium, 3F, COEX
11:40 am
Keynote Speech #5
Wednesday, February 11 | 11:40 am - 12:00 pm
Auditorium, 3F, COEX
12:00 pm
Keynote Speech #6
Wednesday, February 11 | 12:00 pm - 12:20 pm
Auditorium, 3F, COEX
1:00 pm
Compound Power Semiconductor Summit
Wednesday, February 11 | 1:00 pm - 4:40 pm
#403
S1. Advanced Lithography
Wednesday, February 11 | 1:00 pm - 5:15 pm
#307
S2. Advanced Materials & Process Technology
Wednesday, February 11 | 1:00 pm - 5:30 pm
#308
S3. Device Technology
Wednesday, February 11 | 1:00 pm - 5:25 pm
#317
2:00 pm
Thursday, February 12, 2026
9:00 am
T4. Plasma & Etching Tutorial
Thursday, February 12 | 9:00 am - 12:00 pm
#307
10:00 am
MI (Metrology & Inspection) Forum
Thursday, February 12 | 10:00 am - 5:20 pm
#402
S5. CMP & Cleaning Technology
Thursday, February 12 | 10:00 am - 1:45 pm
#308
1:00 pm
Netherlands-Korea Semiconductor Tech Seminar
Thursday, February 12 | 1:00 pm - 5:00 pm
#318
S4. Plasma Science & Etching Technology
Thursday, February 12 | 1:00 pm - 5:45 pm
#307
S6. Advanced Packaging
Thursday, February 12 | 1:00 pm - 5:50 pm
#317
2:00 pm
Global Semiconductor Regulatory Outlook Forum
Thursday, February 12 | 2:00 pm - 4:00 pm
#328
T5. CMP & Cleaning Tutorial
Thursday, February 12 | 2:00 pm - 5:00 pm
#308